scholarly journals Chemical composition analysis of precipitates and dispersoids by analytical electron microscopy.

1992 ◽  
Vol 42 (8) ◽  
pp. 471-480 ◽  
Author(s):  
Tatsuo SATO
Keyword(s):  
Electron Microscopy ◽  
Chemical Composition ◽  
Analytical Electron Microscopy ◽  
Composition Analysis ◽  
Analytical Electron ◽  
Chemical Composition Analysis

A potassium-rich beidellite from a laterite pallid zone in Western Australia

Clay Minerals ◽  
1991 ◽  
Vol 26 (2) ◽  
pp. 233-244 ◽  
Author(s):  
Balwant Singh ◽  
R. J. Gilkes
Keyword(s):  
Electron Microscopy ◽  
Chemical Composition ◽  
Western Australia ◽  
Analytical Electron Microscopy ◽  
Layer Charge ◽  
Swelling Properties ◽  
Exchangeable K ◽  
Analytical Electron ◽  
Tetrahedral Substitution

AbstractA smectite formed by weathering of mica in a laterite pallid zone at Boddington, Western Australia has been investigated by analytical electron microscopy. The evidence suggests that this mineral has the chemical composition and swelling properties of ideal beidellite but is anomalous in containing abundant non-exchangeable K. This K balances half of the layer charge that arises mostly from tetrahedral substitution of Al3+ for Si4+, with the K+ occupying one sixth of the sites occupied by K in mica.

Structure and Composition Analysis of High-TcSuperconducting Bi-Ca-Sr-Cu-O Oxide by High-Resolution Analytical Electron Microscopy

1988 ◽  
Vol 27 (Part 2, No. 3) ◽  
pp. L358-L360 ◽  
Author(s):  
Yoshio Bando ◽  
Tsuyoshi Kijima ◽  
Yoshizo Kitami ◽  
Junzo Tanaka ◽  
Fujio Izumi ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
High Resolution ◽  
Analytical Electron Microscopy ◽  
Composition Analysis ◽  
Analytical Electron

scholarly journals Chemical composition of smectites formed in clastic sediments. Implications for the smectite-illite transformation

Clay Minerals ◽  
2000 ◽  
Vol 35 (4) ◽  
pp. 665-678 ◽  
Author(s):  
A. Drief ◽  
F. Nieto
Keyword(s):  
Electron Microscopy ◽  
Chemical Composition ◽  
Analytical Electron Microscopy ◽  
Fluvial Sediments ◽  
Interlayer Cation ◽  
Clastic Sediments ◽  
Soils And Sediments ◽  
Analytical Electron ◽  
Important Trend ◽  
Pelitic Rocks

AbstractAnalytical electron microscopy of representative smectites from soils and sediments revealed that K was present in significant proportions. It was the major interlayer cation in soils from pelitic rocks, continental and marine sediments, independent of their diagenetic grade. Sodium was predominant only in soils from basic rock. Fluvial sediments contained smectites with both kinds of interlayer compositions. The octahedral composition of each sample ranged widely, covering various fields of dioctahedral smectites. The most important trend was the substitution of Al by Fe and Mg; the chemistry of each smectite particle was determined by the parent mineral from which it formed. The real interlayer composition has important implications for the diagenetic smectite–illite transformation. When considering a typical K content, the smectite–illite reaction, with chlorite and quartz as subproducts, needs only 0.21 K atoms. For more K-rich compositions, a reaction is possible without an external supply of K.

Electron Beam Damage of Biomolecules Assessed by Energy Loss Spectroscopy

1978 ◽  
Vol 36 (3) ◽  
pp. 61-69
Author(s):  
M. Isaacson ◽  
M.L. Collins ◽  
M. Listvan
Keyword(s):  
Electron Microscopy ◽  
Radiation Damage ◽  
Structural Integrity ◽  
Analytical Electron Microscopy ◽  
High Dose ◽  
Dose Rates ◽  
Special Cases ◽  
Analytical Electron ◽  
Atom Migration ◽  
Beam Damage

Over the past five years it has become evident that radiation damage provides the fundamental limit to the study of blomolecular structure by electron microscopy. In some special cases structural determinations at very low doses can be achieved through superposition techniques to study periodic (Unwin & Henderson, 1975) and nonperiodic (Saxton & Frank, 1977) specimens. In addition, protection methods such as glucose embedding (Unwin & Henderson, 1975) and maintenance of specimen hydration at low temperatures (Taylor & Glaeser, 1976) have also shown promise. Despite these successes, the basic nature of radiation damage in the electron microscope is far from clear. In general we cannot predict exactly how different structures will behave during electron Irradiation at high dose rates. Moreover, with the rapid rise of analytical electron microscopy over the last few years, nvicroscopists are becoming concerned with questions of compositional as well as structural integrity. It is important to measure changes in elemental composition arising from atom migration in or loss from the specimen as a result of electron bombardment.

Analytical Electron Microscopy (AEM) of Meningeal Cells Exposed to Particulate Cobalt During Studies of Experimental Epilepsy

1982 ◽  
Vol 40 ◽  
pp. 186-187
Author(s):  
R.G. Frederickson ◽  
R.G. Ulrich ◽  
J.L. Culberson
Keyword(s):  
Electron Microscopy ◽  
Analytical Electron Microscopy ◽  
Experimental Epilepsy ◽  
Metallic Cobalt ◽  
Experimental Animals ◽  
X Ray ◽  
Brain Surface ◽  
Meningeal Cells ◽  
Analytical Electron ◽  
The Brain

Metallic cobalt acts as an epileptogenic agent when placed on the brain surface of some experimental animals. The mechanism by which this substance produces abnormal neuronal discharge is unknown. One potentially useful approach to this problem is to study the cellular and extracellular distribution of elemental cobalt in the meninges and adjacent cerebral cortex. Since it is possible to demonstrate the morphological localization and distribution of heavy metals, such as cobalt, by correlative x-ray analysis and electron microscopy (i.e., by AEM), we are using AEM to locate and identify elemental cobalt in phagocytic meningeal cells of young 80-day postnatal opossums following a subdural injection of cobalt particles.

Analytical Electron Microscopy Characterization of Electric Arc Furnace Dust

1981 ◽  
Vol 39 ◽  
pp. 134-135
Author(s):  
J. R. Porter ◽  
J. I. Goldstein ◽  
D. B. Williams
Keyword(s):  
Electron Microscopy ◽  
Analytical Electron Microscopy ◽  
Electric Arc Furnace ◽  
Electric Arc ◽  
Dust Particles ◽  
Particle Analysis ◽  
Arc Furnace ◽  
Analytical Electron ◽  
Residual Elements ◽  
Industry Practice

Alloy scrap metal is increasingly being used in electric arc furnace (EAF) steelmaking and the alloying elements are also found in the resulting dust. A comprehensive characterization program of EAF dust has been undertaken in collaboration with the steel industry and AISI. Samples have been collected from the furnaces of 28 steel companies representing the broad spectrum of industry practice. The program aims to develop an understanding of the mechanisms of formation so that procedures to recover residual elements or recycle the dust can be established. The multi-phase, multi-component dust particles are amenable to individual particle analysis using modern analytical electron microscopy (AEM) methods.Particles are ultrasonically dispersed and subsequently supported on carbon coated formvar films on berylium grids for microscopy. The specimens require careful treatment to prevent agglomeration during preparation which occurs as a result of the combined effects of the fine particle size and particle magnetism. A number of approaches to inhibit agglomeration are currently being evaluated including dispersal in easily sublimable organic solids and size fractioning by centrifugation.

Application of analytical electron microscopy to the study of partitioning of silicon in a 2 wt% Si eutectoid steel

1978 ◽  
Vol 36 (1) ◽  
pp. 616-617
Author(s):  
N. Ridley ◽  
S.A. Al-Salman ◽  
G.W. Lorimer
Keyword(s):  
Electron Microscopy ◽  
Electron Microscope ◽  
Analytical Electron Microscopy ◽  
Eutectoid Steel ◽  
Minimum Diameter ◽  
Thin Foils ◽  
Analytical Electron ◽  
Analytical Electron Microscope ◽  
Transformation Front

The application of the technique of analytical electron microscopy to the study of partitioning of Mn (1) and Cr (2) during the austenite-pearlite transformation in eutectoid steels has been described in previous papers. In both of these investigations, ‘in-situ’ analyses of individual cementite and ferrite plates in thin foils showed that the alloying elements partitioned preferentially to cementite at the transformation front at higher reaction temperatures. At lower temperatures partitioning did not occur and it was possible to identify a ‘no-partition’ temperature for each of the steels examined.In the present work partitioning during the pearlite transformation has been studied in a eutectoid steel containing 1.95 wt% Si. Measurements of pearlite interlamellar spacings showed, however, that except at the highest reaction temperatures the spacing would be too small to make the in-situ analysis of individual cementite plates possible, without interference from adjacent ferrite lamellae. The minimum diameter of the analysis probe on the instrument used, an EMMA-4 analytical electron microscope, was approximately 100 nm.

Analytical electron microscopy of grain boundaries in Al-Cu metallizations

1992 ◽  
Vol 50 (2) ◽  
pp. 1684-1685
Author(s):  
J. R. Michael ◽  
A. D. Romig ◽  
D. R. Frear
Keyword(s):  
Electron Microscopy ◽  
Integrated Circuits ◽  
Failure Mode ◽  
Current Density ◽  
Thermal History ◽  
Analytical Electron Microscopy ◽  
Cu Metallization ◽  
Analytical Electron ◽  
Interconnect Lines

Al with additions of Cu is commonly used as the conductor metallizations for integrated circuits, the Cu being added since it improves resistance to electromigration failure. As linewidths decrease to submicrometer dimensions, the current density carried by the interconnect increases dramatically and the probability of electromigration failure increases. To increase the robustness of the interconnect lines to this failure mode, an understanding of the mechanism by which Cu improves resistance to electromigration is needed. A number of theories have been proposed to account for role of Cu on electromigration behavior and many of the theories are dependent of the elemental Cu distribution in the interconnect line. However, there is an incomplete understanding of the distribution of Cu within the Al interconnect as a function of thermal history. In order to understand the role of Cu in reducing electromigration failures better, it is important to characterize the Cu distribution within the microstructure of the Al-Cu metallization.

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