scholarly journals Influence of printed circuit board thickness in wave soldering

2017 ◽  
Vol 0 (0) ◽  
pp. 0-0
Author(s):  
M.S. Abdul Aziz ◽  
M.Z. Abdullah ◽  
C.Y. Khor ◽  
I.A. Azid ◽  
A. Jalar ◽  
...  
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Wave Soldering ◽  
Board Thickness

Modeling of Errors Counting System for PCB Soldered in the Wave Soldering Technology

2014 ◽  
Vol 874 ◽  
pp. 139-143 ◽  
Author(s):  
Jacek Pietraszek ◽  
Aneta Gądek-Moszczak ◽  
Tomasz Toruński
Keyword(s):  
Quality Assurance ◽  
Experimental Design ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Counting System ◽  
Printed Circuit ◽  
Pcb Assembly ◽  
Wave Soldering ◽  
Soldering Technology ◽  
Through Hole

PartnerTech provides printed circuit board (PCB) assembly on request. Wired elements are assembled in through-hole technology and soldered on the wave soldering machine. The PCB with inserted elements is passed across the pumped wave of melted solder. Typically this process is accompanied by some class of defects like cracks, cavities, wrong solder thickness and poor conductor. In PartnerTech Ltd. another type of defects was observed: dispersion of small droplets of solder around holes. Quality assurance department plans to optimize the process in order to reduce the number of defects. In the first stage, it was necessary to develop a methodology for counting defects. This paper presents experimental design and analysis related to this project.

The Design Principle and Application of Power Resistor with over Temperature and over Current Protection Function

2012 ◽  
Vol 562-564 ◽  
pp. 1501-1504 ◽  
Author(s):  
Sa Zhang ◽  
Zhong Hou Xu ◽  
Shi Chen ◽  
You Sheng Xu ◽  
Gen Hua Wu
Keyword(s):  
Design Principle ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Compact Structure ◽  
Printed Circuit ◽  
Size And Shape ◽  
Wave Soldering ◽  
Technological Improvement

A power resistor with over temperature and over current protection function was designed in this paper, we developed a compact structure innovatively which integrated thermal cutoff and wire wound resistor in a tubular case. It has the same size and shape as a resistor without Printed Circuit Board redesign, offer higher security and wave-soldering. It is really a very important technological improvement and breakthrough in over-heat protective field of wire wound resistor .

PB-Free Wave Soldering of Thick Printed Circuit Boards Using No-Clean VOC Free Flux

2007 ◽  
Author(s):  
Shantanu Mukherjee ◽  
Manuel Castro ◽  
Pei-Fang Jennifer Tsai ◽  
Krishnaswami Srihari ◽  
Van D. Nguyen
Keyword(s):  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Hole Filling ◽  
Process Step ◽  
Free Wave ◽  
Surface Mount ◽  
Printed Circuit ◽  
Wave Soldering ◽  
Hole Fill

There has been an increasing focus on surface mount technology, and the miniaturization of electronic assemblies. However, wave soldering still remains an integral part of the Printed Circuit Board (PCB) assembly process. Hole fill is an important aspect in wave soldering. It is caused by the capillary action of molten alloys, as the PCB traverses across the molten wave. The advent of Pb-free materials has tightened the process windows for wave soldering. This is primarily because Pb-free alloys have higher melting points. One way to enhance hole filling action is to increase the operating temperatures of the molten wave. This step, however, could result in the disintegration of surface mount or through hole devices, board discoloration and warpage. Flux selection is an important process step for Pb-free wave soldering as it enhances hole-fill and cleans the soldering surface of the oxides prior to the PCB hitting the wave. It is critical to use the ‘optimal’ flux in Pb-free wave soldering processes. The objective of this study is to determine the ‘best’ flux for the Pb-free wave soldering of 2.16mm (0.085″) thick PCBs with Ni/Au surface finish. The Pb-free solder in this application is SAC387 (95.5%Sn, 3.8%Ag, and 0.7% Cu) with VOC-free no clean water based flux. Under different conveyor speeds, the experimentation evaluates the ‘best’ flux among three candidates. Complete (100%) inspection using X-ray laminography equipment detects the percentage of hole fill and other defects such as bridging, flux residue, and solder balling. The ‘best’ flux should have the least number of defects.

Contamination profile on typical printed circuit board assemblies vs soldering process

2014 ◽  
Vol 26 (4) ◽  
pp. 194-202 ◽  
Author(s):  
Helene Conseil ◽  
Morten Stendahl Jellesen ◽  
Rajan Ambat
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Content Type ◽  
Contamination Control ◽  
Conformal Coating ◽  
Printed Circuit ◽  
Soldering Process ◽  
Wave Soldering ◽  
Solder Flux ◽  
Set Up

Purpose – The purpose of this paper was to analyse typical printed circuit board assemblies (PCBAs) processed by reflow, wave or selective wave soldering for typical levels of process-related residues, resulting from a specific or combination of soldering processes. Typical solder flux residue distribution pattern, composition and concentration are profiled and reported. The effect of such contaminants on conformal coating was tested. Design/methodology/approach – Presence of localized flux residues was visualized using a commercial residue reliability assessment testing gel test and chemical structure was identified by Fourier transform infrared spectroscopy, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined by measuring the leak current using a twin platinum electrode set-up. Localized extraction of residue was carried out using a commercial critical contamination control extraction system. Findings – Results clearly show that the amount and distribution of flux residues are a function of the soldering process, and the level can be reduced by an appropriate cleaning. Selective soldering process generates significantly higher levels of residues compared to the wave and reflow process. For conformal coated PCBAs, the contamination levels generated from the tested wave and selective soldering process are found to be enough to generate blisters under exposure to high humidity levels. Originality/value – Although it is generally known that different soldering processes can introduce contamination on the PCBA surface, compromising its cleanliness, no systematic work is reported investigating the relative levels of residue introduced by various soldering processes and its effect on corrosion reliability.

Prediction of Solder Geometry for an Axisymmetric Through-Hole Joint

1997 ◽  
Vol 119 (4) ◽  
pp. 268-274 ◽  
Author(s):  
A. F. Elkouh ◽  
N. Ramasubramanian ◽  
T. F. Hsu ◽  
N. J. Nigro ◽  
S. M. Heinrich ◽  
...  
Keyword(s):  
Differential Equation ◽  
Printed Circuit Board ◽  
Solder Joints ◽  
Bond Number ◽  
Circuit Board ◽  
Dimensionless Parameters ◽  
Printed Circuit ◽  
Board Thickness ◽  
Solder Volume ◽  
Through Hole

Solutions for axisymmetric profiles of solder joints formed between a cylindrical pin and a printed circuit board (PCB) are presented. The dimensionless differential equation governing the formation of the solder joints is developed and then solved numerically for the cases of single upright joints, single inverted joints, and through-hole joints. Results are presented in terms of the following dimensionless parameters: bond number, solder volume, board thickness, and tinning radius. The dimensionless approach makes the results from this study suitable for use in a broader range of applications.

Characteristics of Radiated Emission from a Printed Circuit Board with a Slit

2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Radiated Emission
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