Printed Coplanar Batteries: Materials, Processing and Parametrisation

2021 ◽  
Author(s):  
◽  
Patrick L. Rassek
Keyword(s):  
Carbon Black ◽  
Interfacial Area ◽  
Electrical Performance ◽  
Electrode Spacing ◽  
Side Reactions ◽  
Current Collectors ◽  
Wide Range ◽  
Passivation Layers ◽  
Gap Width ◽  
Screen Printed

Fully screen-printed zinc-manganese dioxide (Zn|MnO2) batteries can power printed electronics devices. However, large-scale market implementation of such batteries has been impeded due to complexity in manufacturing and insufficient long-term stability. This work looks at key production parameters of current collector passivation, calendering of electrodes, electrode spacing and interfacial area and evaluates their effect on battery performance. Many commercially available conductive inks used to screen-print current collectors were developed for other applications and suffer power consuming parasitic side reactions inside electrochemical cells. A practical strategy to avoid corrosion of metallic current collectors adversely affecting battery performance is to print carbon black passivation layers, which is employed in this work. The stability of printed current collectors and passivation layers in common electrolyte solutions has been addressed using cyclic voltammetry (CV) experiments to identify pinhole-related anodic peak currents. Current integration over time enabled quantification and comparison of the passivation capability of individually fabricated protective carbon black layers. Printed layer thicknesses of at least 7 µm were required for the avoidance of pinholes in the protective passivation layers. The protective functionality was further enhanced by printing of passivation layer thicknesses of up to 25 µm and modification of the printing process to double prints wet-on-dry. Coplanar Zn|MnO2 batteries have a lower manufacturing complexity than stack-type batteries but lower interest in coplanar batteries can be attributed to reduced electrical and electrochemical performance due to layout-specific issues. Batteries comprising series connections or smaller gap widths between electrodes are typically printed to overcome these limitations. The focus of this study is the optimisation of battery performance characteristics by process and layout modification while enhancing processability on a wide range of screen printing machines. Thus, coplanar batteries prepared were calendered as part of the systematic electrode post-treatment. Battery layouts were modified by incremental gap width enlargement and a gap length extension. Individual effects of the electrical performance were monitored by electrochemical impedance spectroscopy (EIS) measurements and discharge experiments. Calendering of zinc anodes reduced charge transfer resistances of the batteries. Gap width extensions in a range between 1 mm and 5 mm showed only marginal impact on discharge performance metrics. Increase of the electrode interfacial area resulted in an improved current capability, raised short circuit currents by 45 %, and enhanced the durability against mechanical stress and thermal intake during battery activation and encapsulation. This work contributes to the optimisation of fully screen-printed coplanar Zn|MnO2 batteries by a predictable stability of passivation layers and an improved battery performance by Zn electrode calendering. Reduced requirements on registration due to increased electrode spacing and an enhanced process stability during encapsulation enable production of printed batteries at industrial-scale.

scholarly journals Passivation capability of carbon black layers for screen-printed battery applications with Ag current collectors

2020 ◽  
Vol 126 (8) ◽  
Author(s):  
Patrick Rassek ◽  
Erich Steiner ◽  
Timothy C. Claypole ◽  
Martin Krebs ◽  
Michael Herrenbauer
Keyword(s):  
Carbon Black ◽  
Current Collectors ◽  
Printed Battery ◽  
Screen Printed

The Stabilizing Effect of Pre-Equilibria: A Trifluoromethyl Complex as CF2 Reservoir in Catalytic Olefin Difluorocarbenation

2020 ◽  
Author(s):  
Thomas Louis-Goff ◽  
Huu Vinh Trinh ◽  
Eileen Chen ◽  
Arnold L. Rheingold ◽  
Christian Ehm ◽  
...  
Keyword(s):  
High Selectivity ◽  
Side Reactions ◽  
Theoretical Studies ◽  
Attractive Feature ◽  
Catalyst Recovery ◽  
Wide Range ◽  
Stabilizing Effect ◽  
Experimental And Theoretical Studies

A new, efficient, catalytic difluorocarbenation of olefins to give 1,1-difluorocyclopropanes is presented. The catalyst, an organobismuth complex, uses TMSCF<sub>3</sub> as a stoichiometric difluorocarbene source. We demonstrate both the viability and robustness of this reaction over a wide range of alkenes and alkynes, including electron-poor alkenes, to generate the corresponding 1,1-difluorocyclopropanes and 1,1-difluorocyclopropenes. Ease of catalyst recovery from the reaction mixture is another attractive feature of this method. In depth experimental and theoretical studies showed that the key difluorocarbene-generating step proceeds through a bismuth non-redox synchronous mechanism generating a highly reactive free CF<sub>2</sub> in an endergonic pre-equilibrium. It is the reversibility when generating the difluorocarbene that accounts for the high selectivity, while minimizing CF<sub>2</sub>-recombination side-reactions.

Strain-engineering in AlGaN/GaN HEMTs: impact of silicon nitride passivation layer on electrical performance

2021 ◽  
Author(s):  
Sanghamitra Das ◽  
Taraprasanna Dash ◽  
Devika Jena ◽  
Eleena Mohapatra ◽  
C K Maiti
Keyword(s):  
Experimental Data ◽  
Compressive Strain ◽  
Cutoff Frequency ◽  
Strain Engineering ◽  
Electrical Performance ◽  
Current Gain ◽  
Great Promise ◽  
High Electron ◽  
Wide Range ◽  
Gan Hemts

Abstract In this work, we present a physics-based analysis of two-dimensional electron gas (2DEG) sheet carrier density and other microwave characteristics such as transconductance and cutoff frequency of AlxGa1-xN/GaN high electron mobility transistors (HEMT). An accurate polarization-dependent charge control-based analysis is performed for microwave performance assessment in terms of current, transconductance, gate capacitances, and cutoff frequency of lattice-mismatched AlGaN/GaN HEMTs. The influence of stress on spontaneous and piezoelectric polarization is included in the simulation of an AlGaN/GaN HEMT. We have shown the change in threshold voltage (Vt) due to tensile and compressive strain with different gate lengths. Also, the influence of stress due to the change in nitride thickness is presented. Our simulation results for drain current, transconductance, and current-gain cutoff frequency for various gate length devices are calibrated and verified with experimental data over a wide range of gate and drain applied voltages, which are expected to be useful for microwave circuit design. The predicted transconductance, drain conductance, and operation frequency are quite close to the experimental data. The AlGaN/GaN heterostructure HEMTs with nitride passivation layers show great promise as a candidate in future high speed and high power applications.

Impact of Substrate and Process on the Electrical Performance of Screen-Printed Nickel Electrodes: Fundamental Mechanism of Ink Film Roughness

2018 ◽  
Vol 1 (12) ◽  
pp. 7164-7173 ◽  
Author(s):  
Bilge Nazli Altay ◽  
Jerome Jourdan ◽  
Vikram S. Turkani ◽  
Hervé Dietsch ◽  
Dinesh Maddipatla ◽  
...  
Keyword(s):  
Electrical Performance ◽  
Nickel Electrodes ◽  
Film Roughness ◽  
Fundamental Mechanism ◽  
Screen Printed

scholarly journals Electrical Behaviour of a Carbon Black-Filled Polymer-Based Concrete

1996 ◽  
Vol 5 (5) ◽  
pp. 096369359600500
Author(s):  
L. Rejón ◽  
R. Flores ◽  
M. A. Ponce ◽  
V.M. Castaño
Keyword(s):  
Carbon Black ◽  
Electrical Performance ◽  
Electrical Behaviour ◽  
Filled Polymer ◽  
Carbon Black Concentration ◽  
Before And After

The electrical performance (current, I vs. voltage, V) of a novel polymer-based composite, modified with varying amounts of carbon black, was studied. Distinctive regimens of the I vs. V curves, before and after a critical carbon black concentration, were found and the feasible mechanisms for such behaviour are discussed.

scholarly journals Thioesters Provide a Robust Path to Prebiotic Peptides

2021 ◽  
Author(s):  
Moran Frenkel-Pinter ◽  
Marcos Bouza ◽  
Facundo M. Fernández ◽  
Luke J. Leman ◽  
Loren Dean Williams ◽  
...  
Keyword(s):  
Building Blocks ◽  
Peptide Bond ◽  
Side Reactions ◽  
Peptide Bond Formation ◽  
One Pot ◽  
Complex Molecules ◽  
Peptide Formation ◽  
Wide Range ◽  
Amide Exchange ◽  
Prebiotic Earth

The condensation of building blocks into oligomers and polymers was an early and important stage in the origins of life. High activation energies, unfavorable thermodynamics and side reactions are bottlenecks for abiotic formation of peptides. Thioesters are hypothesized to have played key roles in prebiotic chemistry on early Earth, serving as energy storing molecules, as synthetic intermediates, and as catalysts in the formation of more complex molecules, including polypeptides. However, all abiotic reactions reported thus far for peptide formation via thioester intermediates have relied on activated building blocks or condensing agents, which are of questionable prebiotic relevance. We report robust, plausible prebiotic reactions of mercaptoacids with amino acids that result in the formation of peptides and thiodepsipeptides, which contain both peptide and thioester bonds. Peptide bond formation proceeds by the condensation of mercaptoacids to form thioesters followed by thioester-amide exchange. Mercaptoacids catalyze thiodepsipeptides and peptide formation under a wide range of pH conditions and at mild temperatures. Our results offer the most robust one-pot pathway for peptide formation ever reported. These results support the hypothesis that thiodepsipeptides formed robustly on prebiotic Earth and were possible contributors to early chemical evolution.

Optimized TSV Module for High Performance 2.5D Device Packaging

2014 ◽  
Vol 2014 (DPC) ◽  
pp. 000737-000767
Author(s):  
Cyprian Uzoh ◽  
Liang Wang ◽  
Zhuowen Sun ◽  
Andrew Cao ◽  
Bong-Sub Lee ◽  
...  
Keyword(s):  
Barrier Layer ◽  
High Performance ◽  
Impurity Content ◽  
Electrical Performance ◽  
Reduced Form ◽  
Sidewall Roughness ◽  
Factors Affecting ◽  
Wide Range ◽  
Silicon Vias ◽  
Module Development

3D-IC has been increasingly adopted by the industry owing to its promise of higher device speed and package bandwidth, improved power consumption, reduced form factor, and lower cost for important applications over a wide range of industrial segments including image sensors, logic-memory and logic-logic integration, MEMS, integrated optical interposers and LEDs. This presentation is a systematic study of multiple experimental factors affecting the electrical performance, reliability and scalability of TSVs. Electrical modeling and simulation was used to determine the key factors influencing singal transmission and return losses in TSVs at high (&gt;1 GHz) frequencies. A variety of process modules and steps for the fabrication of through silicon vias were then systematically optimized to ensure high performance. The modules evaluated include TSV etch, TSV fill, chemical mechanical polishing (CMP), pad finish, bonding schemes, wafer thinning, via reveal, passivation, wiring and bumping. One example is the improvement of TSV profile and sidewall roughness through the optimization of DRIE parameters and wet chemical methods to reduce silicon sidewall roughness from that of a typical Bosch etch to less than 10nm which is critical for adhesion of barrier/seed layer and the final reliability of 2.5D packaging. Scalability of void-free via fill process with respect to TSV diameter and depth was addressed by using highly conformal barrier layers. Adhesion of Cu to the barrier layer was also improved upon detailed analysis to prevent delamination and improve reliability. A bottom up plating chemistry with significantly low impurity content was utilized to mitigate voids, seams and excessive overburden in the TSV. Its impact on stress and delamination issues and subsequent reliability failures was studied in details. The annealing process following TSV formation is systematically studied with varying conditions and characterized with metrology and electrical tests to investigate its effect on microstructure and material properties. The process parameters were tuned for CMP of Cu, adhesion and barrier layer without causing corrosion or delamination between adjacent layers. Process requirements for these modules in TSV process are closely related. This presentation will review the process module development in the context of their effects on the integrated TSV parameters (performance, reliability and scalability). We will also provide an in-depth discussion on process module optimization, electrical and mechanical characterization and cost reduction methodologies.

Electrospray deposition as a smart technique for laccase immobilisation on carbon black-nanomodified screen-printed electrodes

2020 ◽  
Vol 163 ◽  
pp. 112299 ◽  
Author(s):  
Mattea Carmen Castrovilli ◽  
Paola Bolognesi ◽  
Jacopo Chiarinelli ◽  
Lorenzo Avaldi ◽  
Antonella Cartoni ◽  
...  
Keyword(s):  
Carbon Black ◽  
Electrospray Deposition ◽  
Screen Printed Electrodes ◽  
Screen Printed

scholarly journals The effect of plasma functionalization on the print performance and time stability of graphite nanoplatelet electrically conducting inks

2020 ◽  
Author(s):  
Andrew Claypole ◽  
James Claypole ◽  
Tim Claypole ◽  
David Gethin ◽  
Liam Kilduff
Keyword(s):  
Printed Electronics ◽  
Low Cost ◽  
Electrical Performance ◽  
Graphite Nanoplatelets ◽  
Interparticle Interactions ◽  
Electrically Conducting ◽  
Wide Range ◽  
Oscillatory Rheology ◽  
The Stability ◽  
Plasma Functionalization

Abstract Carbon-based pastes and inks are used extensively in a wide range of printed electronics because of their widespread availability, electrical conductivity and low cost. Overcoming the inherent tendency of the nano-carbon to agglomerate to form a stable dispersion is necessary if these inks are to be taken from the lab scale to industrial production. Plasma functionalization of graphite nanoplatelets (GNP) adds functional groups to their surface to improve their interaction with the polymer resin. This offers an attractive method to overcome these problems when creating next generation inks. Both dynamic and oscillatory rheology were used to evaluate the stability of inks made with different loadings of functionalized and unfunctionalized GNP in a thin resin, typical of a production ink. The rheology and the printability tests showed the same level of dispersion and electrical performance had been achieved with both functionalized and unfunctionalized GNPs. The unfunctionalized GNPs agglomerate to form larger, lower aspect particles, reducing interparticle interactions and particle–medium interactions. Over a 12-week period, the viscosity, shear thinning behavior and viscoelastic properties of the unfunctionalized GNP inks fell, with decreases in viscosity at 1.17 s−1 of 24, 30, 39% for the ϕ = 0.071, 0.098, 0.127 GNP suspensions, respectively. However, the rheological properties of the functionalized GNP suspensions remained stable as the GNPs interacted better with the polymer in the resin to create a steric barrier which prevented the GNPs from approaching close enough for van der Waals forces to be effective.

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