CMOS-Process Compatible Embedded Sensors for Power Electronics Devices

2019 ◽  
Author(s):  
Stephen Batcup
Keyword(s):  
Power Electronics ◽  
Embedded Sensors ◽  
Cmos Process

Dual Damascene Process for FatWires in Copper/FSG Technology

2003 ◽  
Vol 766 ◽  
Author(s):  
J. Gambino ◽  
T. Stamper ◽  
H. Trombley ◽  
S. Luce ◽  
F. Allen ◽  
...  
Keyword(s):  
Line Width ◽  
Lower Cost ◽  
Process Window ◽  
Cmos Process ◽  
Dual Damascene ◽  
Damascene Process ◽  
Interconnect Technology

AbstractA trench-first dual damascene process has been developed for fat wires (1.26 μm pitch, 1.1 μm thickness) in a 0.18 μm CMOS process with copper/fluorosilicate glass (FSG) interconnect technology. The process window for the patterning of vias in such deep trenches depends on the trench depth and on the line width of the trench, with the worse case being an intermediate line width (lines that are 3X the via diameter). Compared to a single damascene process, the dual damascene process has comparable yield and reliability, with lower via resistance and lower cost.

A 5-bit 4.2-GS/s Flash ADC in 0.13-µm CMOS Process

2009 ◽  
Vol E92-C (2) ◽  
pp. 258-268 ◽  
Author(s):  
Ying-Zu LIN ◽  
Soon-Jyh CHANG ◽  
Yen-Ting LIU
Keyword(s):  
Cmos Process ◽  
Flash Adc

JET IMPINGEMENT-COOLED MODULE FOR AUTOMOTIVE POWER ELECTRONICS USING WATER-ETHYLENE GLYCOL

2017 ◽  
Author(s):  
Michael A. Henry ◽  
John F. Maddox ◽  
Sushil Bhavnani ◽  
Roy W. Knight ◽  
James Pool
Keyword(s):  
Ethylene Glycol ◽  
Power Electronics ◽  
Jet Impingement
Sign in / Sign up

Export Citation Format

Share Document