Self optimizing LCOS-SLM based beam splitter for high precision material processing

Author(s):  
Patrick Gretzki ◽  
Jens Holtkamp ◽  
Arnold Gillner
2016 ◽  
Vol 43 (12) ◽  
pp. 1210001
Author(s):  
罗敬 Luo Jing ◽  
刘东 Liu Dong ◽  
徐沛拓 Xu Peituo ◽  
白剑 Bai Jian ◽  
刘崇 Liu Chong ◽  
...  

2005 ◽  
Vol 76 (12) ◽  
pp. 125108 ◽  
Author(s):  
R. C. Bradshaw ◽  
D. P. Schmidt ◽  
J. R. Rogers ◽  
K. F. Kelton ◽  
R. W. Hyers

2019 ◽  
Vol 8 (3-4) ◽  
pp. 241-251 ◽  
Author(s):  
Linas Jonušauskas ◽  
Dovilė Mackevičiūtė ◽  
Gabrielius Kontenis ◽  
Vytautas Purlys

AbstractThe ever-growing trend of device multifunctionality and miniaturization puts enormous burden on existing manufacturing technologies. The requirements for precision, throughput, and cost become increasingly harder to achieve with minimal room for compromises. Femtosecond lasers, which saw immense development throughout the last few decades, have been proven time and time again to be a superb tool capable of standing up to the challenges posed by modern science and the industry for ultrahigh-precision material processing. Thus, this paper is dedicated to provide an outlook on how femtosecond pulses are revolutionizing modern manufacturing. We will show how they are exploited for various kinds of material processing, including subtractive (ablation, cutting, and etching), additive (lithography and laser-induced forward transfer), or hybrid subtractive-additive cases. The advantages of using femtosecond lasers in such applications, with main focus on how they enable the most precise kinds of material processing, will be highlighted. Future prospects concerning emerging industrial applications and the future of the technology itself will be discussed.


2011 ◽  
Vol 284 (19) ◽  
pp. 4650-4653 ◽  
Author(s):  
Kaiyong Yang ◽  
Xingwu Long ◽  
Yun Huang ◽  
Suyong Wu

2012 ◽  
Vol 44 (3) ◽  
pp. 549-554 ◽  
Author(s):  
L. Ali ◽  
S.M. Javed Akhtar ◽  
S. Mehmood ◽  
M. Ashraf ◽  
S.I. Bhatti ◽  
...  

Author(s):  
J. C. Russ ◽  
T. Taguchi ◽  
P. M. Peters ◽  
E. Chatfield ◽  
J. C. Russ ◽  
...  

Conventional SAD patterns as obtained in the TEM present difficulties for identification of materials such as asbestiform minerals, although diffraction data is considered to be an important method for making this purpose. The preferred orientation of the fibers and the spotty patterns that are obtained do not readily lend themselves to measurement of the integrated intensity values for each d-spacing, and even the d-spacings may be hard to determine precisely because the true center location for the broken rings requires estimation. We have implemented an automatic method for diffraction pattern measurement to overcome these problems. It automatically locates the center of patterns with high precision, measures the radius of each ring of spots in the pattern, and integrates the density of spots in that ring. The resulting spectrum of intensity vs. radius is then used just as a conventional X-ray diffractometer scan would be, to locate peaks and produce a list of d,I values suitable for search/match comparison to known or expected phases.


Author(s):  
K. Z. Botros ◽  
S. S. Sheinin

The main features of weak beam images of dislocations were first described by Cockayne et al. using calculations of intensity profiles based on the kinematical and two beam dynamical theories. The feature of weak beam images which is of particular interest in this investigation is that intensity profiles exhibit a sharp peak located at a position very close to the position of the dislocation in the crystal. This property of weak beam images of dislocations has an important application in the determination of stacking fault energy of crystals. This can easily be done since the separation of the partial dislocations bounding a stacking fault ribbon can be measured with high precision, assuming of course that the weak beam relationship between the positions of the image and the dislocation is valid. In order to carry out measurements such as these in practice the specimen must be tilted to "good" weak beam diffraction conditions, which implies utilizing high values of the deviation parameter Sg.


Author(s):  
Klaus-Ruediger Peters

Differential hysteresis processing is a new image processing technology that provides a tool for the display of image data information at any level of differential contrast resolution. This includes the maximum contrast resolution of the acquisition system which may be 1,000-times higher than that of the visual system (16 bit versus 6 bit). All microscopes acquire high precision contrasts at a level of <0.01-25% of the acquisition range in 16-bit - 8-bit data, but these contrasts are mostly invisible or only partially visible even in conventionally enhanced images. The processing principle of the differential hysteresis tool is based on hysteresis properties of intensity variations within an image.Differential hysteresis image processing moves a cursor of selected intensity range (hysteresis range) along lines through the image data reading each successive pixel intensity. The midpoint of the cursor provides the output data. If the intensity value of the following pixel falls outside of the actual cursor endpoint values, then the cursor follows the data either with its top or with its bottom, but if the pixels' intensity value falls within the cursor range, then the cursor maintains its intensity value.


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