Effect of recombination on ultrashort pulse laser material removal by Coulomb explosion

2005 ◽  
Author(s):  
Rohit B. Viegas ◽  
Cho Lik Chan
Keyword(s):  
Pulse Laser ◽  
Ultrashort Pulse ◽  
Material Removal ◽  
Coulomb Explosion ◽  
Ultrashort Pulse Laser ◽  
Laser Material

scholarly journals Simulation of the laser-material interaction of ultrashort pulse laser processing of silicon nitride workpieces and the key factors in the ablation process

2021 ◽  
Author(s):  
Babak Soltani ◽  
Faramarz Hojati ◽  
Amir Daneshi ◽  
Bahman Azarhoushang
Keyword(s):  
Mathematical Model ◽  
Laser Ablation ◽  
Pulse Laser ◽  
Ultrashort Pulse ◽  
Laser Processing ◽  
Laser Power ◽  
Removal Rate ◽  
Ultrashort Pulse Laser ◽  
Laser Material ◽  
Material Interaction

AbstractUnderstanding the laser ablation mechanism is highly essential to find the effect of different laser parameters on the quality of the laser ablation. A mathematical model was developed in the current investigation to calculate the material removal rate and ablation depth. Laser cuts were created on the workpiece with different laser scan speeds from 1 to 10 mm s−1 by an ultrashort pulse laser with a wavelength of about 1000 nm. The calculated depths of laser cuts were validated via practical experiments. The variation of the laser power intensity on the workpiece’s surface during laser radiation was also calculated. The mathematical model has determined the laser-material interaction mechanism for different laser intensities. The practical sublimation temperature and ablated material temperature during laser processing are other data that the model calculates. The results show that in laser power intensities (IL) higher than 1.5 × 109 W cm−2, the laser-material interaction is multiphoton ionisation with no effects of thermal reaction, while in lower values of IL, there are effects of thermal damages and HAZ adjacent to the laser cut. The angle of incidence is an essential factor in altering incident IL on the surface of the workpiece during laser processing, which changes with increasing depth of the laser cut.

A study of material removal rates for shallow drilling with an ultrashort pulse laser

2009 ◽  
Author(s):  
B. R. Campbell ◽  
L. A. Forster ◽  
J. A. Moore ◽  
T. M. Lehecka ◽  
J. G. Thomas ◽  
...  
Keyword(s):  
Pulse Laser ◽  
Ultrashort Pulse ◽  
Material Removal ◽  
Removal Rates ◽  
Ultrashort Pulse Laser

Ultrashort Pulse Laser Material Processing

2016 ◽  
Vol 13 (5) ◽  
pp. 46-50 ◽  
Author(s):  
Jens Bliedtner ◽  
Christian Schindler ◽  
Michael Seiler ◽  
Sebastian Wächter ◽  
Maria Friedrich ◽  
...  
Keyword(s):  
Material Processing ◽  
Pulse Laser ◽  
Ultrashort Pulse ◽  
Laser Material Processing ◽  
Ultrashort Pulse Laser ◽  
Laser Material

scholarly journals X-ray emission as a potential hazard during ultrashort pulse laser material processing

2018 ◽  
Vol 124 (6) ◽  
Author(s):  
Herbert Legall ◽  
Christoph Schwanke ◽  
Simone Pentzien ◽  
Günter Dittmar ◽  
Jörn Bonse ◽  
...  
Keyword(s):  
Material Processing ◽  
Pulse Laser ◽  
Ultrashort Pulse ◽  
Potential Hazard ◽  
Laser Material Processing ◽  
Ultrashort Pulse Laser ◽  
Laser Material ◽  
X Ray

Polarization-dependent Memory of Light via Ultrashort Pulse Laser Irradiation

PIERS Online ◽  
2008 ◽  
Vol 4 (2) ◽  
pp. 221-226
Author(s):  
Yasuhiko Shimotsuma ◽  
Masaaki Sakakura ◽  
Peter G. Kazansky ◽  
Jianrong Qiu ◽  
Kiyotaka Miura ◽  
...  
Keyword(s):  
Laser Irradiation ◽  
Pulse Laser ◽  
Ultrashort Pulse ◽  
Pulse Laser Irradiation ◽  
Ultrashort Pulse Laser
Sign in / Sign up

Export Citation Format

Share Document