Absorption of laser energy by a welding arc

2003 ◽  
Author(s):  
B. Hu ◽  
I. M. Richardson
Keyword(s):  
Laser Energy ◽  
Welding Arc

MANAGEMENT OF BLADDER STONE WITH HOLMIUM-YAG LASER AT KARDINAH HOSPITAL TEGAL

2020 ◽  
Vol 27 (1) ◽  
pp. 1-4
Author(s):  
Fatan Abshari ◽  
Zulfikar Ali
Keyword(s):  
General Hospital ◽  
Laser Energy ◽  
Major Complication ◽  
Mucosal Injury ◽  
Cross Sectional Study ◽  
Stone Size ◽  
Cross Sectional ◽  
Yag Laser ◽  
Bladder Stones ◽  
Large Size

Objective: Transurethral lithotripsy using Holmium-YAG laser has been reported to be beneficial in breaking up bladder stones with large size (>4cm in diameter) with lower risk of mucosal injury and hematuria. The aim of this study is to evaluate the utilization of Holmium-YAG laser for the management of bladder stones at Kardinah General Hospital, Tegal. Material & Methods: This is a cross-sectional study conducted from January 2017 to March 2017. Patient’s demography, which included age, sex, length of surgery, stone size, and laser’s energy count were recorded. Results: We included 120 patients in this study. Mean of patients age in this study was 51.93 years old with age range were 41-85 years old. Most of the patients were male (109 vs 11) with a mean size of stone 25.09 ± 3.04 mm. Length of surgery ranges from 15 to 75 minutes and mean energy of the laser 28.99 ± 19.34 kJ. There was 100% stone’s clearance following surgery with no major complication occurred. Conclusion: Holmium-YAG laser is effective in managing bladder stones at Kardinah General Hospital particularly for large size stones. Length of surgery and energy of laser used depend on the stone size in which bigger stone size is associated with longer surgery time and bigger laser energy needed.

Cross-Correlation Method for the Formation of Laser Energy Fields with Complex Distributions

2013 ◽  
Vol 58 (2) ◽  
pp. 122-125 ◽  
Author(s):  
O.V. Gnatovskyy ◽  
◽  
A.M. Negriyko ◽  
V.O. Gnatovskyy ◽  
A.V. Sidorenko ◽  
...  
Keyword(s):  
Cross Correlation ◽  
Laser Energy ◽  
Correlation Method

WLCSP Laminate Removal Using NIR Laser

2018 ◽  
Author(s):  
Chun Haur Khoo
Keyword(s):  
Near Infrared ◽  
Laser Energy ◽  
Photon Emission ◽  
Mechanical Damage ◽  
Consumer Products ◽  
Fault Isolation ◽  
Wafer Level ◽  
Isolation Technique ◽  
Laminate Layer ◽  
Nir Laser

Abstract Driven by the cost reduction and miniaturization, Wafer Level Chip Scale Packaging (WLCSP) has experienced significant growth mainly driven by mobile consumer products. Depending on the customers or manufacturing needs, the bare silicon backside of the WLCSP may be covered with a backside laminate layer. In the failure analysis lab, in order to perform the die level backside fault isolation technique using Photon Emission Microscope (PEM) or Laser Signal Injection Microscope (LSIM), the backside laminate layer needs to be removed. Most of the time, this is done using the mechanical polishing method. This paper outlines the backside laminate removal method of WLCSP using a near infrared (NIR) laser that produces laser energy in the 1,064 nm range. This method significantly reduces the sample preparation time and also reduces the risk of mechanical damage as there is no application of mechanical force. This is an effective method for WLCSP mounted on a PCB board.

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