Influence of Application Time on Dentin Bond Performance in Different Etching Modes of Universal Adhesives

2020 ◽  
Vol 45 (2) ◽  
pp. 183-195 ◽  
Author(s):  
T Saito ◽  
T Takamizawa ◽  
R Ishii ◽  
A Tsujimoto ◽  
E Hirokane ◽  
...  
Keyword(s):  
Application Time ◽  
Universal Adhesive ◽  
Bond Performance ◽  
Etch And Rinse ◽  
Air Blowing ◽  
Universal Adhesives ◽  
The Difference ◽  
Adhesive Application ◽  
Almost All ◽  
Self Etch

SUMMARY We attempted to determine the effect of universal adhesive application time on dentin bond performance in different etching modes based on shear bond strength (SBS) tests and surface free energy (SFE) measurements. The five universal adhesives used were Adhese Universal (AU), Clearfil Universal Bond Quick (CQ), G-Premio Bond (GP), Scotchbond Universal (SU), and Tokuyama Universal Bond (TU). Bovine dentin specimens were divided into four groups of 10 for each adhesive. SBS and SFE were determined after applying the following surface treatments: 1) self-etch (SE) mode with immediate air blowing after adhesive application (IA treatment), 2) SE mode with prolonged application time (PA treatment), 3) etch-and-rinse (ER) mode with IA treatment, and 4) ER mode with PA treatment. Bonded specimens were subjected to SBS testing. The SFE of adhesive-treated dentin surfaces was measured after rinsing with acetone and water. Three-way analysis of variance revealed that dentin SBS values (p<0.001) were significantly influenced by the factors of adhesive type and application duration, but the factor of pre-etching was not significant (p=0.985). The manufacturer's instructions require longer application times for AU and SU, which showed significantly lower SBS values in IA than in PA treatment in both etching modes. However, the difference in the other adhesives was not significant between the IA and PA treatments in either etching mode. The total SFE (γS) was dependent on the adhesive and etching mode. The γS value of the initial group (SiC paper ground group) at baseline was 69.5 (mN·m−1) and that of the pre-etching group at baseline was 30.6 (mN·m−1). For all the adhesives, γS in SE mode showed significantly higher values than in ER mode, regardless of the application time. In SE mode, almost all universal adhesives tested showed lower γS values in PA treatment than in IA treatment. For ER mode, all the adhesives showed significantly higher γS values than those of the pre-etching baseline, regardless of the application time. Most adhesives did not show any significant differences in γS values between IA and PA treatments, regardless of etching mode.

scholarly journals Influence of Conditioning Time of Universal Adhesives on Adhesive Properties and Enamel-Etching Pattern

2016 ◽  
Vol 41 (5) ◽  
pp. 481-490 ◽  
Author(s):  
AM Cardenas ◽  
F Siqueira ◽  
J Rocha ◽  
AL Szesz ◽  
M Anwar ◽  
...  
Keyword(s):  
Bond Strength ◽  
Degree Of Conversion ◽  
Adhesive Properties ◽  
Universal Adhesive ◽  
Etching Pattern ◽  
Etch And Rinse ◽  
Universal Adhesives ◽  
Microshear Bond Strength ◽  
Self Etch

SUMMARY Objectives: To evaluate the effect of application protocol in resin–enamel microshear bond strength (μSBS), in situ degree of conversion, and etching pattern of three universal adhesive systems. Methods and Materials: Sixty-three extracted third molars were sectioned in four parts (buccal, lingual, and proximals) and divided into nine groups, according to the combination of the main factors—Adhesive (Clearfil Universal, Kuraray Noritake Dental Inc, Tokyo, Japan; Futurabond U, VOCO, Cuxhaven, Germany; and Scotchbond Universal Adhesive, 3M ESPE, St Paul, MN, USA)—and enamel treatment/application time (etch-and-rinse mode [ER], self-etch [SE] application for 20 seconds [SE20], and SE application for 40 seconds [SE40]). Specimens were stored in water (37°C/24 h) and tested at 1.0 mm/min (μSBS). The degree of conversion of the adhesives at the resin–enamel interfaces was evaluated using micro-Raman spectroscopy. The enamel-etching pattern was evaluated under a scanning electron microscope. Data were analyzed with two-way analysis of variance and Tukey test (α=0.05). Results: In general, the application of the universal adhesives in the SE40 produced μSBS and degree of conversion that were higher than in the SE20 (p<0.01) and similar to the ER mode. The deepest enamel-etching pattern was obtained in the ER mode, followed by the SE40. Conclusions: The active and prolonged application of universal adhesives in the SE mode may be a viable alternative to increase the degree of conversion, etching pattern, and resin–enamel bond strength.

In Vitro Longevity of Bonding Properties of Universal Adhesives to Dentin

2015 ◽  
Vol 40 (3) ◽  
pp. 282-292 ◽  
Author(s):  
MA Muñoz ◽  
I Luque-Martinez ◽  
P Malaquias ◽  
V Hass ◽  
A Reis ◽  
...  
Keyword(s):  
Repeated Measures ◽  
Water Storage ◽  
Storage Period ◽  
Dihydrogen Phosphate ◽  
Scanning Electron Microscopy Data ◽  
Universal Adhesive ◽  
Etch And Rinse ◽  
Universal Adhesives ◽  
Self Etch

SUMMARY Purpose To evaluate the immediate and 6-month resin-dentin bond strength (μTBS) and nanoleakage (NL) of universal adhesives that contain or do not contain methacryloyloxydecyl dihydrogen phosphate (MDP) and are used in the etch-and-rinse and self-etch strategies. Methods and Materials Forty caries-free extracted third molars were divided into eight groups for μTBS (n=5). The groups were bonded with the Clearfil SE Bond (CSE) and Adper Single Bond 2 (SB) as controls; Peak Universal, self-etch (PkSe) and etch-and rinse (PkEr); Scotchbond Universal Adhesive, self-etch (ScSe) and etch-and-rinse (ScEr); and All Bond Universal, self-etch (AlSe) and etch-and-rinse (AlEr). After composite restorations, specimens were longitudinally sectioned to obtain resin-dentin bonded sticks (0.8 mm2). The μTBS of the specimens was tested immediately (IM) or after 6 months of water storage (6M) at 0.5 mm/min. Some sticks at each storage period were immersed in silver nitrate and photo developed, and the NL was evaluated with scanning electron microscopy. Data were analyzed with two-way repeated-measures analysis of variance and Tukey test (α=0.05). Results At the IM period, PkSe and PkEr showed μTBS similar to the control adhesives (p>0.05) but increased NL pattern and lower μTBS after 6M (p<0.05). ScSe and ScEr showed intermediary μTBS values at the IM period but remained stable after 6 months (p>0.05). AlSe showed the lowest μTBS (p<0.05), but μTBS and NL remained stable after 6M (p>0.05). AlEr showed higher IM μTBS but showed higher degradation after 6M (p<0.05). Conclusions Universal adhesives that contain MDP showed higher and more stable μTBS with reduced NL at the interfaces after 6 months of water storage.

scholarly journals Effect of extended application time of universal adhesives on bond strength of brackets and enamel integrity

2021 ◽  
Vol 10 (13) ◽  
pp. e199101320832
Author(s):  
May Anny Alves Fraga ◽  
Daniela Feu Rosa Kroeff de Souza Laignier ◽  
Carolina Sandra Yamashita Garfias ◽  
Américo Bortolazzo Correr ◽  
Licia Pacheco Teixeira ◽  
...  
Keyword(s):  
Bond Strength ◽  
Shear Bond Strength ◽  
Test Machine ◽  
Application Time ◽  
Universal Adhesive ◽  
Bonding System ◽  
Adhesive Remnant Index ◽  
Extended Application ◽  
Etch And Rinse ◽  
Universal Adhesives

The objective of this study to evaluate the effect of universal adhesives application time to enamel through shear bond strength (SBS), adhesive remnant index (ARI), and morphological enamel integrity. Bovine incisors were divided into four groups according to bonding system protocol (n=20): (1) conventional etch-and-rise adhesive – Transbond XT Primer (P-XT); (2) one-step self-etching adhesive –­ Transbond Self Etching Primer (T-SEP); (3) one universal adhesive – Single Bond Universal, which were rubbed for 20s (SBU-20) or (4) 40s (SBU-40). Transbond XT composite was used to bond the brackets to enamel. SBS was evaluated in a universal test machine at 0.5mm/minute. ARI was determined under x12.5 magnification and enamel damage was evaluated through scanning electron microscope (SEM) after debonding (n=10). SBS data were compared using one-way ANOVA and Tukey’s test. The Kruskal–Wallis test was used to compare the ARI scores (α =0.05). The P-XT and T-SEP groups showed significantly higher bond strength than SBU-20 and SBU-40 (p<0.05). The ARI was similar for all groups (p>0.05). SEM showed enamel damage only in T-SEP and P-XT groups. Conventional ‘etch and rinse’ and ‘self-etch’ adhesives had the highest shear bond strength, but they were associated with more enamel damage compared to universal adhesives. The application of universal adhesives with the time recommended by the manufacturer — ensure satisfactory bond strength and enamel integrity.

scholarly journals The Influence of Application Protocol of Simplified and Universal Adhesives on the Dentin Bonding Performance

2019 ◽  
Vol 10 (1) ◽  
pp. 124 ◽  
Author(s):  
Anna Zecin-Deren ◽  
Monika Lukomska-Szymanska ◽  
Agata Szczesio-Wlodarczyk ◽  
Ireneusz Piwonski ◽  
Jerzy Sokolowski ◽  
...  
Keyword(s):  
Bond Strength ◽  
Shear Bond Strength ◽  
Adhesive Layer ◽  
Study Groups ◽  
Single Bond ◽  
Application Time ◽  
Bonding Performance ◽  
Etch And Rinse ◽  
Universal Adhesives ◽  
Self Etch

Contemporary adhesives use etch-and-rinse, self-etch, and multimode adhesive strategies. Simplified and universal adhesives present lower bond strength to dentin than conventional, two-bottle etch-and-rinse adhesives. The purpose of this study was to evaluate bonding performance of simplified and universal adhesives to dentin after modifying their application protocol (multiplying applications and extending application time). Adhesive layer thickness (ALT) and shear bond strength (SBS), as well as the correlation between these parameters was calculated. Two universal (Single Bond Universal and Prime & Bond One Select) and two self-etch adhesives (Adper Easy One and Xeno V) were tested. Significant differences in ALT were detected between the adhesives, as well as within the same adhesive between study groups. Tested adhesives presented the thinnest adhesive layer when applied 2 times in 20 s. Single Bond Universal obtained the highest SBS results of all adhesives. Most adhesives (except for Prime & Bond One Select) obtained the highest SBS, when applied two or three times in 40 or 60 s, respectively. No correlation between the ALT and SBS was found. The study showed that increasing the number of applications and extending the application time of self-etch and universal adhesives can be recommended to improve their performance.

Shear Bond Strength of Different MDP-Containing Adhesive Systems on Enamel and Dentin from Primary Teeth

2021 ◽  
Vol 45 (3) ◽  
pp. 186-192
Author(s):  
Min Jin Kim ◽  
Joonhee Kim ◽  
Ji-Soo Song ◽  
Shin Hye Chung ◽  
Hong-Keun Hyun
Keyword(s):  
Bond Strength ◽  
Shear Bond Strength ◽  
Primary Teeth ◽  
Primary Molars ◽  
Single Bond ◽  
Adhesive Systems ◽  
Universal Adhesive ◽  
Etch And Rinse ◽  
Universal Adhesives ◽  
Self Etch

Objective: To compare the shear bond strength (SBS) after thermocycling of four universal adhesives applied in self-etch mode on dentin and etch-and-rinse mode on enamel. Study design: Flat 144 buccal or lingual dentin and enamel surfaces from 72 non-carious primary molars were prepared. Samples were segregated into 12 groups (n=12): Adper Single Bond 2 etch-and-rinse (SB_T) and Clearfil SE Bond self-etch (SE_S) applied to enamel and dentin served as controls. Scotch Bond Universal Adhesive (SBU), Clearfil S3 Bond Universal Adhesive (SEU), Tetric N-Bond Universal Adhesive (TEN), and All Bond Universal (BIS) were applied in etch-and-rinse mode to enamel and in self-etch mode to dentin. They were thermocycled for 5000 cycles. SBS testing and the evaluation of fracture mode were performed. Results: SB_T showed statistically higher SBS than other adhesive groups using etch-and-rinse mode on enamel. SE_S and BIS had statistically higher SBS than other adhesive groups using self-etch mode on dentin. Mixed failure was the most common failure mode in each group. Conclusion: The universal adhesives did not show higher SBS than SB_T when using etch-and-rinse on enamel. All universal adhesives showed higher SBS than SB_T and had SBS similar to SE_S, except SBU when using self-etch mode on dentin.

scholarly journals Variable Smear Layer and Adhesive Application: The Pursuit of Clinical Relevance in Bond Strength Testing

2019 ◽  
Vol 20 (21) ◽  
pp. 5381 ◽  
Author(s):  
Abu Faem Mohammad Almas Chowdhury ◽  
Rafiqul Islam ◽  
Arefin Alam ◽  
Mariko Matsumoto ◽  
Monica Yamauti ◽  
...  
Keyword(s):  
Smear Layer ◽  
Third Molars ◽  
Single Application ◽  
Universal Adhesive ◽  
Diamond Bur ◽  
Universal Adhesives ◽  
Bond Strengths ◽  
Adhesive Application ◽  
Adhesive Molecules ◽  
Self Etch

The removal or modification of smear layers that cover the dentin is critical to allow the penetration of adhesive molecules and to ensure a strong bond between resin and dentin. Aiming to establish a model for clinically-relevant dentin-bond testing, we evaluated the effects of smear layers created by abrasives having similar coarseness (180-grit SiC paper; fine-grit diamond bur) and application modes (single application; double application) on the microtensile bond strengths (µTBS) of two currently available universal adhesives (G-Premio Bond; Scotchbond Universal Adhesive) and a two-step self-etch adhesive (Clearfil Megabond 2). Sixty extracted human third molars were used for the μTBS test. Data were analyzed by three-way ANOVA and Tukey’s test (α = 0.05). Fracture modes were determined using stereomicroscopy. An additional 24 third molars were prepared for observation of the resin–dentin interface by TEM and adhesive-smear layer interaction by SEM. μTBS was significantly affected by the adhesives and their application modes (p < 0.001), implying that the double application of universal adhesives should be recommended to improve their performance. The effect of smear layers was not significant (p > 0.05), indicating that 180-grit SiC papers could be used to prepare dentin as a substitute for fine-grit diamond burs for dentin-bond testing in laboratory settings.

scholarly journals Performance of a Universal Adhesive on Etched and Non-Etched Surfaces: Changes in Dentin Permeability

2021 ◽  
Vol 5 (1) ◽  
Keyword(s):  
Conductance Measurement ◽  
Universal Adhesive ◽  
Functional Monomers ◽  
Dentin Permeability ◽  
Etch And Rinse ◽  
One Step ◽  
Universal Adhesives ◽  
Difficult Challenge ◽  
Self Etch ◽  
Phosphate Groups

Hybridization process for dentin is well known, but remains a difficult challenge as it is dependent on many factors related to dentin substrate, adhesive nature including its solvent. The development of universal adhesives followed the all-in-one concept of existing one-step self-etch adhesives, thus requiring water in their formulation to ionize hydrophilic acid monomers. Most often, carboxylate and/or phosphate groups are their primary functional monomers [1]. Jee, et al. published in 2016 that ethanol molecules penetrate via increasing solvent accessible surfaces induced by the rearrangement of collagen monomers in the gap region [2]. The aim of this study is to evaluate the discrepancy in dentin permeability after application of a universal adhesive used in self-etching (SE) mode or etch and rinse (E&R) mode, by means of hydraulic conductance measurement.

Enamel Bond Strength of New Universal Adhesive Bonding Agents

2015 ◽  
Vol 40 (4) ◽  
pp. 410-417 ◽  
Author(s):  
DE McLean ◽  
EJ Meyers ◽  
VL Guillory ◽  
KS Vandewalle
Keyword(s):  
Bond Strength ◽  
Shear Bond Strength ◽  
Adhesive Bonding ◽  
Shear Failure ◽  
Universal Adhesive ◽  
Bonding Agents ◽  
Etch And Rinse ◽  
Significant Difference ◽  
Universal Adhesives ◽  
Self Etch

SUMMARY Purpose Universal bonding agents have been introduced for use as self-etch or etch-and-rinse adhesives depending on the dental substrate and clinician's preference. The purpose of this study was to evaluate the shear bond strength (SBS) of composite to enamel using universal adhesives compared to a self-etch adhesive when applied in self-etch and etch-and-rinse modes over time. Methods and Materials Extracted human third molars were used to create 120 enamel specimens. The specimens were ground flat and randomly divided into three groups: two universal adhesives and one self-etch adhesive. Each group was then subdivided, with half the specimens bonded in self-etch mode and half in etch-and-rinse mode. The adhesives were applied as per manufacturers' instructions, and composite was bonded using a standardized mold and cured incrementally. The groups were further divided into two subgroups with 10 specimens each. One subgroup was stored for 24 hours and the second for six months in 37°C distilled water and tested in shear. Failure mode was also determined for each specimen. Results A three-way analysis of variance (ANOVA) found a significant difference between groups based on bonding agent (p&lt;0.001) and surface treatment (p&lt;0.001) but not on time (p=0.943), with no significant interaction (p&gt;0.05). Clearfil SE in etch-and-rinse and self-etch modes had more mixed fractures than either universal adhesive in either mode. Conclusions Etching enamel significantly increased the SBS of composite to enamel. Clearfil SE had significantly greater bond strength to enamel than either universal adhesive, which were not significantly different from each other.

Effect of Active Application on Bond Durability of Universal Adhesives

2019 ◽  
Vol 44 (2) ◽  
pp. 188-199 ◽  
Author(s):  
N Moritake ◽  
T Takamizawa ◽  
R Ishii ◽  
A Tsujimoto ◽  
WW Barkmeier ◽  
...  
Keyword(s):  
Shear Bond Strength ◽  
Storage Conditions ◽  
Cycle Period ◽  
Distilled Water ◽  
Etch And Rinse ◽  
Application Mode ◽  
Universal Adhesives ◽  
Adhesive Application ◽  
Self Etch ◽  
Bond Durability

SUMMARY The purpose of this study was to determine the effect of different adhesive application methods and etching modes on the dentin bond durability of universal adhesives under thermal cycling (TC). All-Bond Universal (Bisco), Adhese Universal (Ivoclar Vivadent), and Scotchbond Universal (3M ESPE) were used as adhesives. In total, 600 bovine teeth with exposed dentin were divided into 12 groups according to the type of adhesive and subjected to the following bonding procedures: 1) etch-and-rinse mode with active application; 2) etch-and-rinse mode with inactive application; 3) self-etch mode with active application; and 4) self-etch mode with inactive application. Bonded specimens were stored in distilled water at 37°C for 24 hours and then subjected to 5000, 10,000, 30,000, or 50,000 TC between 5°C and 55°C before shear bond strength (SBS) testing, creating a division into a total of five different storage conditions. Baseline specimens were stored in distilled water at 37°C for 24 hours. The SBS test was performed at a cross-head speed of 1.0 mm/min. Three-way analysis of variance revealed that all the factors of application mode, adhesive, and thermal cycle period significantly influenced the SBS values (p&lt;0.001), regardless of the etching mode. In the baseline groups, all of the tested adhesives with active application had higher SBS values than those with inactive application, regardless of etching mode. In the TC groups, significantly lower SBS values were observed at 50,000 TC with inactive application compared to those with active application, regardless of the etching mode. From the scanning electron microscopy observation of demineralized and deproteinized resin/dentin interfaces, dense resin tags longer than 50 μm were observed in the etch-and-rinse with active application group. On the other hand, the resin tags in self-etch mode were sparse, thin, and much shorter than those in etch-and-rinse mode. Comparing the penetration status of the resin tags with active and inactive application in self-etch mode, the resin tag penetration with inactive application was much lower than that with active application. Active application is effective in enhancing the dentin bond durability of universal adhesives. When using universal adhesives with different etching modes, practitioners should select the optimal etching mode and appropriate application method in accordance with the cavity conditions.

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