scholarly journals THE EFFECT OF ANESTHETICS ON THE SURFACE PRECIPITATION REACTION

1934 ◽  
Vol 66 (3) ◽  
pp. 264-275 ◽  
Author(s):  
L. V. HEILBRUNN
Keyword(s):  
Precipitation Reaction ◽  
Surface Precipitation

Plasmolyse und „Surface precipitation reaction“

PROTOPLASMA ◽  
1932 ◽  
Vol 15 (1) ◽  
pp. 522-531 ◽  
Author(s):  
Friedl Weber
Keyword(s):  
Precipitation Reaction ◽  
Surface Precipitation

The surface precipitation reaction in marine eggs

PROTOPLASMA ◽  
1933 ◽  
Vol 17 (1) ◽  
pp. 239-257 ◽  
Author(s):  
D. P. Costello
Keyword(s):  
Precipitation Reaction ◽  
Surface Precipitation

Precipitation in silicon: Microanalysis

1988 ◽  
Vol 46 ◽  
pp. 474-475
Author(s):  
R.W. Carpenter
Keyword(s):  
Transition Metals ◽  
Spatial Resolution ◽  
Thin Foil ◽  
Precipitation Reaction ◽  
High Current ◽  
Reaction Products ◽  
Carbon And Nitrogen ◽  
Dielectric Layers ◽  
Precipitation Processes ◽  
Areas Of Interest

Interest in precipitation processes in silicon appears to be centered on transition metals (for intrinsic and extrinsic gettering), and oxygen and carbon in thermally aged materials, and on oxygen, carbon, and nitrogen in ion implanted materials to form buried dielectric layers. A steadily increasing number of applications of microanalysis to these problems are appearing. but still far less than the number of imaging/diffraction investigations. Microanalysis applications appear to be paced by instrumentation development. The precipitation reaction products are small and the presence of carbon is often an important consideration. Small high current probes are important and cryogenic specimen holders are required for consistent suppression of contamination buildup on specimen areas of interest. Focussed probes useful for microanalysis should be in the range of 0.1 to 1nA, and estimates of spatial resolution to be expected for thin foil specimens can be made from the curves shown in Fig. 1.

A TEM investigation of a hyper-eutectic lead-tin alloy

1988 ◽  
Vol 46 ◽  
pp. 562-563
Author(s):  
John A. Sutliff
Keyword(s):  
Volume Diffusion ◽  
Eutectic Mixture ◽  
Precipitation Reaction ◽  
Directionally Solidified ◽  
X Ray Diffraction ◽  
X Ray ◽  
Transmission Electron ◽  
Diffusion Controlled ◽  
Discontinuous Precipitation Reaction ◽  
Controlled Precipitation

Near-eutectic Pb-Sn alloys are important solders used by the electronics industry. In these solders, the eutectic mixture, which solidifies last, is the important microstructural consituent. The orientation relation (OR) between the eutectic phases has previously been determined for directionally solidified (DS) eutectic alloys using x-ray diffraction or electron chanelling techniques. In the present investigation the microstructure of a conventionally cast, hyper-eutectic Pb-Sn alloy was examined by transmission electron microscopy (TEM) and the OR between the eutectic phases was determined by electron diffraction. Precipitates of Sn in Pb were also observed and the OR determined. The same OR was found in both the eutectic and precipitation reacted materials. While the precipitation of Sn in Pb was previously shown to occur by a discontinuous precipitation reaction,3 the present work confirms a recent finding that volume diffusion controlled precipitation can also occur.Samples that are representative of the solder's cast microstructure are difficult to prepare for TEM because the alloy is multiphase and the phases are soft.

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