scholarly journals Synergetic effect of additives on the hardness and adhesion of thin electrodeposited copper films

2017 ◽  
Vol 14 (1) ◽  
pp. 1-11
Author(s):  
Ivana Mladenovic ◽  
Jelena Lamovec ◽  
Vesna Jovic ◽  
Vesna Radojevic
Keyword(s):  
Copper Substrate ◽  
Synergetic Effect ◽  
Copper Film ◽  
Chloride Ion ◽  
Copper Films ◽  
Adhesion Properties ◽  
Fine Grained ◽  
Film Hardness ◽  
Sulphate Electrolyte ◽  
Composite Hardness

Thin copper films were electrodeposited on a polycrystalline coldrolled copper substrate. The composition of the laboratory-made copper sulphate electrolyte was changed by the addition of various additives. The influence of chloride ion (Cl-), polyethylene glycol (PEG) and 3-mercapto-1-propane sulfonic acid (MPSA) on mechanical and adhesion properties of the electrodeposited copper films was investigated using Vickers microindentation technique. Calculations of the film hardness and adhesion were carried out using composite hardness models of Korsunsky and Chen-Gao. The hardness of the composite system is influenced by the adhesion of the copper film to the substrate. Increasing adhesion corresponds to increasing values of the calculated adhesion parameter b, named the critical reduced depth. When additives are added to a plating solution, the copper deposition mechanism is changed and fine-grained microstructure without the formation of microscopic nodules is obtained.

THE ADHESION OF COPPER FILMS COATED ON SILICON AND GLASS SUBSTRATES

2000 ◽  
Vol 14 (03) ◽  
pp. 103-108 ◽  
Author(s):  
M. CHEN ◽  
J. GAO
Keyword(s):  
Vickers Microhardness ◽  
Deformation Mode ◽  
Copper Films ◽  
Micro Hardness ◽  
Adhesion Properties ◽  
Cu Films ◽  
Glass Substrates ◽  
Hardness Model ◽  
Composite Hardness ◽  
Hard Substrates

A new method is developed to evaluate the adhesion properties of thin films. This method is based on a composite hardness model. In our experiments, Cu films which were deposited on Si and glass substrates by pulsed laser ablation were indented and scratched by a Vickers microhardness tester and a diamond cutter, respectively. It was found that adhesion influenced the micro-hardness of films for soft films deposited on hard substrates. This result was explained by the elastic–plastic deformation mode of indentation.

Room-Temperature UHV-Deposited Titanium Monoxide Films on Oxidized Polycrystalline Copper

2001 ◽  
Vol 672 ◽  
Author(s):  
V. M. Fuenzalida ◽  
C. R. Grahmann ◽  
C. Herrera ◽  
R. A. Zárate ◽  
C. Avila ◽  
...  
Keyword(s):  
Photoelectron Spectroscopy ◽  
Room Temperature ◽  
Copper Substrate ◽  
Copper Film ◽  
Copper Surface ◽  
Native Oxide ◽  
Titanium Monoxide ◽  
Copper Films ◽  
Polycrystalline Copper ◽  
Tungsten Boat

ABSTRACTPolycrystalline copper films thicker than 100 nm were evaporated on silicon wafers with their native oxide under ultrahigh vacuum conditions leading to an rms roughness of ~2 nm of the copper film. X-ray photoelectron spectroscopy (XPS) revealed a clean copper surface with only traces of oxygen. The samples were exposed to air, leading to an oxide film consisting of CuO. TiO films were subsequently deposited onto the oxidized copper films from a resistively heated tungsten boat with the substrate at room temperature. The TiO films exhibited good adherence and were amorphous. XPS measurements revealed that the TiO films were contamination-free and that the first layers of TiO reduced the thin native oxide of the copper substrate from Cu(II) into Cu(I) or Cu(0) and transformed the TiO into TiO2 at the interface.

scholarly journals Application of the Composite Hardness Models in the Analysis of Mechanical Characteristics of Electrolytically Deposited Copper Coatings: The Effect of the Type of Substrate

Metals ◽  
2021 ◽  
Vol 11 (1) ◽  
pp. 111
Author(s):  
Ivana O. Mladenović ◽  
Nebojša D. Nikolić ◽  
Jelena S. Lamovec ◽  
Dana Vasiljević-Radović ◽  
Vesna Radojević
Keyword(s):  
Mechanical Characteristics ◽  
Dislocation Creep ◽  
Average Current Density ◽  
Fine Grained ◽  
Copper Coatings ◽  
Electrochemically Deposited ◽  
Composite Models ◽  
Average Current ◽  
Composite Hardness ◽  
Coating Hardness

The mechanical characteristics of electrochemically deposited copper coatings have been examined by application of two hardness composite models: the Chicot-Lesage (C-L) and the Cheng-Gao (C-G) models. The 10, 20, 40 and 60 µm thick fine-grained Cu coatings were electrodeposited on the brass by the regime of pulsating current (PC) at an average current density of 50 mA cm−2, and were characterized by scanning electron (SEM), atomic force (AFM) and optical (OM) microscopes. By application of the C-L model we determined a limiting relative indentation depth (RID) value that separates the area of the coating hardness from that with a strong effect of the substrate on the measured composite hardness. The coating hardness values in the 0.9418–1.1399 GPa range, obtained by the C-G model, confirmed the assumption that the Cu coatings on the brass belongs to the “soft film on hard substrate” composite hardness system. The obtained stress exponents in the 4.35–7.69 range at an applied load of 0.49 N indicated that the dominant creep mechanism is the dislocation creep and the dislocation climb. The obtained mechanical characteristics were compared with those recently obtained on the Si(111) substrate, and the effects of substrate characteristics such as hardness and roughness on the mechanical characteristics of the electrodeposited Cu coatings were discussed and explained.

Adhesion mechanisms of copper films deposited onto laser-irradiated alumina

1997 ◽  
Vol 12 (11) ◽  
pp. 3174-3181 ◽  
Author(s):  
Jae-Won Park ◽  
Anthony J. Pedraza ◽  
Douglas H. Lowndes ◽  
William R. Allen
Keyword(s):  
Laser Irradiation ◽  
Copper Film ◽  
Alumina Substrate ◽  
Interfacial Region ◽  
Transitional Region ◽  
Copper Films ◽  
High Adhesion ◽  
Strong Adhesion ◽  
Oxygen Excess ◽  
Higher Temperature

Strong adhesion between a deposited copper film and an alumina substrate takes place when the substrate is laser-irradiated prior to deposition. A post-deposition annealing is required to achieve the strong bonding. In this work, the interfacial region between the copper film and the alumina substrate was analyzed using Auger Electron Spectroscopy (AES). It was found that a transitional region is always present in couples that have a high adhesion strength, while little or no transitional region was found in weakly bonded couples. The transitional region depends on the laser irradiation atmosphere. In the case of laser irradiation in air, oxygen excess was found on the surface of the alumina substrate, and in the copper/alumina couple the transitional region consists of a copper oxide and a Cu–Al double oxide. When the laser irradiation was performed in a reducing atmosphere (Ar–4% H2), substoichiometric alumina and metallic aluminum were found on the surface of the substrate and also a reaction between copper and the substoichiometric aluminum oxide was detected in the subsurface. Although the substoichiometric alumina is formed on the surface irradiated in Ar–4% H2, a stable Al2O3 thin layer is formed on the outmost surface because the irradiated substrate is exposed to the atmosphere before deposition. This reoxidized layer remains whole at the interface of the couple upon low temperature (at least up to 300 °C) annealing, while it is ruptured upon higher temperature annealing (500 °C in this work). In the latter case, the copper film can contact and react with the substoichiometric alumina formed in the subsurface of the substrate irradiated in the Ar–4% H2 atmosphere. It is concluded that the Cu–Al–O interfacial compound formed in the transitional region causes the strong adhesion between the copper film and the alumina substrate.

Constitutive Response of Passivated Copper Films: Experiments and Analyses

2001 ◽  
Vol 695 ◽  
Author(s):  
Y.-L. Shen ◽  
U. Ramamurty
Keyword(s):  
Thermal Loading ◽  
Silicon Oxide ◽  
Kinematic Hardening ◽  
Copper Film ◽  
Temperature Response ◽  
Copper Interconnects ◽  
Constitutive Law ◽  
Copper Films ◽  
Rate Dependent ◽  
Constitutive Response

ABSTRACTThe constitutive behavior of passivated copper films is studied. Stresses in copper films of thickness ranging from 1000 nm to 40 nm, passivated with silicon oxide on a quartz or silicon substrate, were measured using the curvature method. The thermal cycling spans a temperature range from - 196 to 600°C. It is seen that the strong relaxation at high temperatures normally found in unpassivated films is nonexistent for passivated films. The copper film did not show any rate-dependent effect over a range of heating/cooling rate from 5 to 25°C/min. Further analyses showed that significant strain hardening exists during the course of thermal loading. In particular, the measured stress- temperature response can only be fitted with a kinematic hardening model, if a simple constitutive law within the continuum plasticity framework is to be used. The analytic procedures for extracting the film properties are presented. Implications to stress modeling of copper interconnects in actual devices are discussed.

scholarly journals Implementation of the Chicot–Lesage Composite Hardness Model in a Determination of Absolute Hardness of Copper Coatings Obtained by the Electrodeposition Processes

Metals ◽  
2021 ◽  
Vol 11 (11) ◽  
pp. 1807
Author(s):  
Ivana O. Mladenović ◽  
Jelena S. Lamovec ◽  
Dana G. Vasiljević-Radović ◽  
Rastko Vasilić ◽  
Vesna J. Radojević ◽  
...  
Keyword(s):  
Preferred Orientation ◽  
Sulfate Electrolyte ◽  
X Ray Diffraction ◽  
Fine Grained ◽  
Atomic Force ◽  
Copper Coatings ◽  
Hardness Model ◽  
Composite Hardness ◽  
Coating Hardness

The influence of various electrolysis parameters, such as the type of cathode, composition of the electrolyte and electrolysis time, on the morphology, structure and hardness of copper coatings has been investigated. Morphology and structure of the coatings were analyzed by scanning electron microscope (SEM), atomic force microscope (AFM) and X-ray diffraction (XRD), while coating hardness was examined by Vickers microindentation test applying the Chicot–Lesage (C–L) composite hardness model. Depending on the conditions of electrolysis, two types of Cu coatings were obtained: fine-grained mat coatings with a strong (220) preferred orientation from the sulfate electrolyte and smooth mirror bright coatings with a strong (200) preferred orientation from the electrolyte with added leveling/brightening additives. The mat coatings showed larger both measured composite and calculated coating hardness than the mirror bright coatings, that can be explained by the phenomena on boundary among grains. Independent of electrolysis conditions, the critical relative indentation depth (RID) of 0.14 was established for all types of the Cu coatings, separating the zone in which the composite hardness can be equaled with the coating hardness and the zone requiring an application of the C–L model for a determination of the absolute hardness of the Cu coatings.

scholarly journals The Influence of the Hybridization of Steel and Polyolefin Fiber on the Mechanical Properties of Base Concrete Designed for Marine Shotcreting Purposes

2021 ◽  
Vol 11 (20) ◽  
pp. 9456
Author(s):  
Changjoon Lee ◽  
Andres Salas Montoya ◽  
Hoon Moon ◽  
Hyunwook Kim ◽  
Chulwoo Chung
Keyword(s):  
Steel Fiber ◽  
Mechanical Performance ◽  
Synergetic Effect ◽  
Chloride Ion ◽  
Concrete Specimen ◽  
Hybrid Fiber ◽  
Electrically Conductive ◽  
Chloride Ion Penetration ◽  
Binder Ratio ◽  
Ion Penetration

The present study investigated the influence of the hybridization of steel and polyolefin fiber on the mechanical performance and chloride ion penetration of base concrete designed for marine shotcreting purposes. The purpose of fiber hybridization is to reduce the risk of corrosion that might occur during service life. Sets of hybrid fiber reinforced base concrete, whose water to binder ratio was 0.338, were prepared. The fiber contents in the base concrete were 0.54 and 1.08 vol%, and the volume proportion of polyolefin fiber in the hybrid fiber varied from 0 to 100%. Although the effect of fiber hybridization was not clearly observed from the compressive strength, a synergetic effect which increased both the flexural strength and toughness occurred at a fiber content of 1.08 vol%. The optimum ratio of steel and polyolefin fiber was 50:50. With respect to chloride ion penetration, an increasing amount of steel fiber increased the amount of current passing through the base concrete specimen due to the presence of electrically conductive steel fiber. However, chloride ion diffusivity was not greatly affected by the presence of steel fiber.

Thermomechanical Stresses in Copper Films at Elevated Temperature

2010 ◽  
Vol 2010 (HITEC) ◽  
pp. 000129-000135 ◽  
Author(s):  
Martin Lederer ◽  
Javad Zarbakhsh ◽  
Rui Huang ◽  
Thomas Detzel ◽  
Brigitte Weiss
Keyword(s):  
Elevated Temperature ◽  
Thermal Cycling ◽  
Copper Film ◽  
Film Stress ◽  
Elastic Response ◽  
Copper Films ◽  
Thermomechanical Stress ◽  
Wafer Curvature ◽  
Electronic Parts ◽  
Stoney Formula

Thermomechanical stresses in metallic films are a root cause for material fatigue which limits the lifetime of electronic devices. Since the yield stress of metals is temperature dependent, plastic deformations during thermal cycling are increased at elevated temperature. This effect reduces the reliability of electronic parts. In order to investigate this problem, a 20μm thick copper film was deposited on a silicon wafer. After annealing at 400°C, the sample was exposed to thermal cycles in the temperature range between room temperature and 600°C. The different values for the CTE of copper and silicon lead to a curvature of the sample. The wafer curvature was measured by a multi-laser beam method. On the basis of the experimental results, a new theoretical model was developed, which describes the stress evolution in the film during thermal cycling. In this investigation, the relation between wafer curvature and film stress is calculated by analogy to a model by Freund [1] which is an improvement to the well known Stoney formula. In addition to the elastic response, the new model considers plasticity of the copper film as well as temperature dependence of creep. It is demonstrated that the model can well describe the experiment and thus thermomechanical stress in copper films.

On the length scale of cyclic strain localization in fine-grained copper films

2010 ◽  
Vol 90 (1) ◽  
pp. 69-76 ◽  
Author(s):  
B. Zhang ◽  
K.H. Sun ◽  
Y. Liu ◽  
G.P. Zhang
Keyword(s):  
Strain Localization ◽  
Cyclic Strain ◽  
Length Scale ◽  
Copper Films ◽  
Fine Grained

Room Temperature Self-Annealing of Electroplated and Sputtered Copper Films

1999 ◽  
Vol 562 ◽  
Author(s):  
Michelle Chen ◽  
Suraj Rengarajan ◽  
Peter Hey ◽  
Yezdi Dordi ◽  
Hong Zhang ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Room Temperature ◽  
Copper Film ◽  
Copper Films ◽  
Organic Additives ◽  
X Ray Diffraction ◽  
X Ray ◽  
Transmission Electron ◽  
Electroplated Copper ◽  
Effect Of Copper

ABSTRACTSelf-annealing properties of electroplated and sputtered copper films at room temperature were investigated in this study, in particular, the effect of copper film thickness, electrolyte systems used, as well as their level of organic additives for electroplating. Real-time grain growth was observed by transmission electron microscopy. Sheet resistance and X-ray diffraction measurements further confirmed the recrystallization of the electroplated copper film with time. The recrystallization of electroplated films was then compared with that of sputtered copper films.

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