Subcritical crack growth in oxide and non-oxide ceramics using the constant stress rate test

Fracture toughness is one of the most important parameters for ceramics description. In some cases, material failure occurs at lower stresses than described by KIc parameter. In these terms, determination of fracture toughness only, proves to be insufficient. This may be due to environmental factors, such as humidity, which might cause subcritical crack propagation in a material. Therefore, it is very important to estimate crack growth velocities to predict lifetime of ceramics used under specific conditions. Constant Stress Rate Test is an indirect method of subcritical crack growth parameters estimation. Calculations are made by using strength data, thus avoiding crack measurement. The expansion of flaws causes reduction of material strength. If subcritical crack growth phenomenon occurs, critical value of crack lengths increases with decreasing stress rate due to longer time for flaw to grow before the critical crack propagation at KIc takes place. Subcritical crack growth phenomenon is particularly dangerous for oxide ceramics due to chemical interactions occurring as a result of exposure to humidity. This paper presents results of Constant Stress Rate Test performed for alumina, zirconia, silicon carbide and silicon nitride in order to demonstrate the differences in subcritical crack propagation phenomenon course.