scholarly journals Curing kinetics of alkyd/melamine resin mixtures

2009 ◽  
Vol 63 (6) ◽  
pp. 629-635 ◽  
Author(s):  
Mirjana Jovicic ◽  
Radmila Radicevic
Keyword(s):  
Castor Oil ◽  
Protective Coatings ◽  
Curing Kinetics ◽  
Isoconversional Method ◽  
Curing Temperature ◽  
Melamine Resin ◽  
Alkyd Resins ◽  
Synthetic Resins ◽  
Isothermal Kinetic ◽  
Kinetics Of

Alkyd resins are the most popular and useful synthetic resins applied as the binder in protective coatings. Frequently they are not used alone but are modified with other synthetic resins in the manufacture of the coatings. An alkyd/melamine resin mixture is the usual composition for the preparation of coating called 'baking enamel' and it is cured through functional groups of resins at high temperatures. In this paper, curing kinetics of alkyd resins based on castor oil and dehydrated castor oil with melamine resin, has been studied by DSC method with programmed heating and in isothermal mode. The results determined from dynamic DSC curves were mathematically transformed using the Ozawa isoconversional method for obtaining the isothermal data. These results, degree of curing versus time, are in good agreement with those determined by the isothermal DSC experiments. By applying the Ozawa method it is possible to calculate the isothermal kinetic parameters for the alkyd/melamine resin mixtures curing using only calorimetric data obtained by dynamic DSC runs. Depending on the alkyd resin type and ratio in mixtures the values of activation energies of curing process of resin mixtures are from 51.3 to 114 kJ mol-1. The rate constant of curing increases with increasing the content of melamine resin in the mixture and with curing temperature. The reaction order varies from 1.12 to 1.37 for alkyd based on dehydrated castor oil/melamine resin mixtures and from 1.74 to 2.03 for mixtures with alkyd based on castor oil. Based on the results obtained, we propose that dehydrated castor oil alkyd/melamine resin mixtures can be used in practice (curing temperatures from 120 to 160?C).

scholarly journals The effects of alkyd/melamine resin ratio and curing temperature on the properties of the coatings

2005 ◽  
Vol 70 (4) ◽  
pp. 593-599 ◽  
Author(s):  
Radmila Radicevic ◽  
Jaroslava Budinski-Simendic
Keyword(s):  
Protective Coatings ◽  
Impact Resistance ◽  
Curing Temperature ◽  
Curing Time ◽  
Melamine Resin ◽  
Coating Properties ◽  
Scanning Calorimetry ◽  
Synthetic Resins ◽  
Degree Of Curing ◽  
Resin Mixture

Abstract: Synthetic resins are used as binders in protective coatings. An alkyd/melamine resin mixture is the usual composition for the preparation of a coating called "baking enamel" cured through functional groups of resins. The effects of the alkyd/butylated melamine resin ratio (from 85/15 to 70/30) and curing temperature (from 100 ?C to 160 ?C) on the crosslinking and properties of the coating are presented in this paper. The degree of curing was determined by differential scanning calorimetry. These data were used for the estimation of the degree of crosslinking. The hardness, elasticity impact resistance, degree of adherence and gloss were also determined. Optimal coating properties could be achieved with an alkyd/melamine resin ratio of 75/25, a curing temperature of 130 ?C and a curing time of 30 min.

Influence of carbon nanofillers on the curing kinetics of epoxy-amine resin

RSC Advances ◽  
2015 ◽  
Vol 5 (110) ◽  
pp. 90437-90450 ◽  
Author(s):  
L. Vertuccio ◽  
S. Russo ◽  
M. Raimondo ◽  
K. Lafdi ◽  
L. Guadagno
Keyword(s):  
Activation Energy ◽  
Curing Kinetics ◽  
Isoconversional Method ◽  
Epoxy Amine ◽  
Carbon Nanofillers ◽  
Advanced Isoconversional Method ◽  
Kinetics Of

Variation of the activation energy with conversion obtained by “advanced isoconversional method”.

Synthesis and Curing Kinetics of UV-Curable Waterborne Bisphenol-S Epoxy Acrylate/Polyurethane-Acrylate Coating

2012 ◽  
Vol 549 ◽  
pp. 457-461
Author(s):  
Jun Gang Gao ◽  
Feng Li Zhu ◽  
Jiang Bo Yang ◽  
Xiao Qian Liu
Keyword(s):  
Uv Curing ◽  
Curing Kinetics ◽  
Mechanical Analysis ◽  
Curing Temperature ◽  
Coating Film ◽  
Epoxy Acrylate ◽  
Bisphenol S ◽  
Uv Curable ◽  
Polyurethane Acrylate ◽  
Kinetics Of

In ouder to prepare the waterborne UV-curable polyurethane acrylate coatings, the anionic polyurethane acrylate emulsifier and bisphenol-S eopxy acrylate were synthesized. The curing process, kinetics and properties of waterborone UV-curable epoxy acrylate/polyurethanes acrylate coating were investigated by FTIR, DSC and DMA. The results show that the static initial curing temperature Ti is 52.36 oC, peak temperature Tp is 71.58 oC, the finished temperature Tf is 89.15 oC. The curing reaction can be described by two-parameter autocatalytic Šesták-Berggren (S-B) model.This coating has a better UV-curing property. The dynamic mechanical analysis showed that the glass transition temperature Tg of coating film is 52.70 oC.

The Synthesis of Silicon-Containing Epoxy Resin and its Application in Environmentally-Friendship Epoxy Molding Compound for IC Packaging

2011 ◽  
Vol 211-212 ◽  
pp. 638-642 ◽  
Author(s):  
Ming Shan Yang ◽  
Jian Wei Liu ◽  
Lin Kai Li
Keyword(s):  
Thermal Stability ◽  
Epoxy Resin ◽  
Curing Kinetics ◽  
Curing Temperature ◽  
Molding Compound ◽  
Ic Packaging ◽  
Ortho Cresol ◽  
Novolac Epoxy ◽  
Kinetics Of ◽  
Thermal Stability Of

Silicon-containing epoxy resin (CNE-Si) was synthesized from diphenylsilandiol (DPSD) and ortho-cresol novolac epoxy resin using SnCl2 as catalyst. The chemical structure of CNE-Si prepared in this paper was characterized by 1H-NMR and FTIR. The thermal stability was analyzed by TGA. The result showed that the –Si- group enhanced the thermal stability of the epoxy resin. The curing kinetics of the system was studied by non-isothermal DSC. The kinetic parameters of the curing reaction including the activation energy were calculated using Kissinger and Ozawa method. The results showed that the system containing CNE-Si has lower curing temperature and more quick curing speed compared to CNE, which can be used for manufacturing the quick-curing EMCs or afterward-curing-free EMCs.

scholarly journals The Curing Kinetics of E-Glass Fiber/Epoxy Resin Prepreg and the Bending Properties of Its Products

Materials ◽  
2021 ◽  
Vol 14 (16) ◽  
pp. 4673
Author(s):  
Lvtao Zhu ◽  
Zhenxing Wang ◽  
Mahfuz Bin Rahman ◽  
Wei Shen ◽  
Chengyan Zhu
Keyword(s):  
Glass Fiber ◽  
Epoxy Resin ◽  
Composite Laminates ◽  
Curing Kinetics ◽  
Curing Temperature ◽  
Scanning Calorimetry ◽  
Three Point Bending ◽  
Reinforced Composite ◽  
Curing Kinetic ◽  
Kinetics Of

The curing kinetics can influence the final macroscopic properties, particularly the three-point bending of the fiber-reinforced composite materials. In this research, the curing kinetics of commercially available glass fiber/epoxy resin prepregs were studied by non-isothermal differential scanning calorimetry (DSC). The curing kinetic parameters were obtained by fitting and the apparent activation energy Ea of the prepreg, the pre-exponent factor, and the reaction order value obtained. A phenomenological nth-order curing reaction kinetic model was established according to Kissinger equation and Crane equation. Furthermore, the optimal curing temperature of the prepregs was obtained by the T-β extrapolation method. A vacuum hot pressing technique was applied to prepare composite laminates. The pre-curing, curing, and post-curing temperatures were 116, 130, and 153 °C respectively. In addition, three-point bending was used to test the specimens’ fracture behavior, and the surface morphology was analyzed. The results show that the differences in the mechanical properties of the samples are relatively small, indicating that the process settings are reasonable.

scholarly journals Curing Kinetics and Mechanism Research of E44/T31 Insulation Paint

2019 ◽  
Vol 25 (4) ◽  
pp. 478-484
Author(s):  
Haoqing XU ◽  
Yuan FANG ◽  
Aizhao ZHOU ◽  
Pengming JIANG ◽  
Shi SHU ◽  
...  
Keyword(s):  
Epoxy Resin ◽  
Epoxy Group ◽  
Curing Kinetics ◽  
Curing Temperature ◽  
Scanning Calorimetry ◽  
Curing Reaction ◽  
Rate Versus ◽  
Reaction Orders ◽  
Dsc Method ◽  
Kinetics Of

Epoxy resin insulation paint was prepared with epoxy resin (E44) as binder and with proper inorganic fillers and curing agent (T31) as additives. The isothermal curing reaction process of paint was studied by the differential scanning calorimetry method (DSC), and the curves of curing reaction rate versus time of paint were obtained. The curing reaction kinetics was investigated by using the phenomenological method, and the corresponding parameters of the n-order model, autocatalytic model and Kamal model were determined by fitting the experimental data, respectively. According to the values of R2 and the sum of square due to error (SSE), a suitable curing reaction kinetic model was determined. The curing reaction mechanism of paint was ascertained by the dynamic temperature DSC method and IR spectroscopy (FTIR) method. The results show that the Kamal model can be used to describe the curing kinetics of epoxy resin paint, and the total reaction orders increase from 1.30 to 2.14. The two rate constants increase with the increase of the curing temperature. The activation energy is 90.5832 kJ/mol and 68.3733 kJ/mol respectively, and the pre-exponential factors are 6.521 × 1015 s-1 and 6.3807 × 109 s-1. The curing reaction of paint consists of two steps: the first step is the addition reaction of epoxy group and primary amine or secondary amine; the second step is the etherification reaction of epoxy group and phenolic hydroxyl or alcoholic hydroxyl. Epoxy resin insulation paint was prepared with epoxy resin (E44) as binders and with proper inorganic fillers and curing agent (T31) as additives. The isothermal curing reaction process of paint was studied by differential scanning calorimetry method (DSC), and the curves of curing reaction rate versus time of paint were obtained. The curing reaction kinetics was studied by using the phenomenological method, the corresponding parameters of the n-order model, autocatalytic model and Kamal model were determined by fitting the experimental data, respectively. According to the values of R2 and the sum of square due to error (SSE), a suitable curing reaction kinetic model was determind. The curing reaction mechanism of paint was ascertained by dynamic temperature DSC method and IR spectrogram (FTIR) method. The results show that the kamal model can be used to describe the curing kinetics of epoxy resin paint, the total reaction orders increase from 1.30 to 2.14. The results also show that the two rate constants increase with increasing curing temperature, The activation energies are 90.5832 kJ/mol and 68.3733 kJ/mol, and the pre-exponential factor are 6.521×1015 s-1 and 6.3807×109 s-1. The curing reaction of paint in two steps, the first step is the addition reaction of epoxy group and primary amine or secondary amine. The second step is the etherification reaction of epoxy group and phenolic hydroxyl or alcoholic hydroxyl.

Curing Kinetics of Phenol Formaldehyde Resin Modified with Sodium Silicate

2012 ◽  
Vol 184-185 ◽  
pp. 1471-1479
Author(s):  
Jin Sun ◽  
Xiao Feng Zhu ◽  
Xiao Bo Wang ◽  
Rui Hang Lin ◽  
Zhen Zhong Gao
Keyword(s):  
Activation Energy ◽  
Sodium Silicate ◽  
Reaction Order ◽  
Phenol Formaldehyde ◽  
Curing Kinetics ◽  
Curing Temperature ◽  
Formaldehyde Resin ◽  
Exponential Factor ◽  
Curing Reaction ◽  
Kinetics Of

The curing kinetics of PF resin modified with sodium silicate had been investigated by differential scanning calorimetry (DSC). The kinetic analysis was performed at heating rates of 5, 10, 15, and 20°C/min，respectively. The kinetic parameters such as reaction order and activation energy were solved by Kissinger and Crane equation. The relationship between curing temperature and heating rate was also investigated. The activation energy and the curing reaction order，which were obtained by kinetic calculation, are 83.00kJ/mol and 0.917, respectively. The curing reaction kinetics equations were built by the obtained best curing temperature, reaction order, pre-exponential factor and reaction rate constant.

Adhesion Strength Study of Silicone Rubber Compounds to Nylon 66

2014 ◽  
Vol 622-623 ◽  
pp. 453-458
Author(s):  
Hui Bin Ou ◽  
Mohamed Sahli ◽  
Thierry Barrière ◽  
J.C. Gelin
Keyword(s):  
Adhesion Strength ◽  
Silicone Rubber ◽  
Curing Kinetics ◽  
Curing Temperature ◽  
Curing Time ◽  
Nylon 66 ◽  
Rotational Rheometer ◽  
Rubber Compounds ◽  
Interfacial Adhesion Strength ◽  
Kinetics Of

In recent years, multi-component injection molding has largely developed in the industries. During the manufacturing process, the critical challenge is in achieving an optimum adhesion between the two materials. This study examines the influence of curing kinetics on the interfacial adhesion strength between a silicone rubber and nylon 66 using a rotational rheometer. The evolution of adhesion strength of assembly during the curing behaviour of silicone rubber was measured by tensile test at different curing temperature and different curing time. The results showed a significant increase in adhesion was obtained while either the curing temperature or the curing time increased. In this study, the rheological property of silicone rubber fluid has been also determined by the rotational rheometer. In addition, the kinetics of the curing reaction of silicone rubber has been studied by differential scanning calorimeter.

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