scholarly journals Complemento de VS.NET para la definición óptima de pruebas de software de caja negra mediante arreglos de cobertura

2018 ◽  
Vol 17 (33) ◽  
pp. 121-137
Author(s):  
Jaime Herney Meneses Ruiz ◽  
Eduar Alexis Peña Velasco ◽  
Carlos Alberto Cobos Lozada ◽  
Jimena Adriana Timaná Peña ◽  
Jose Torres-Jimenez
Keyword(s):  

Las pruebas de software pueden llegar a superar el 50 % del costo total de un proyecto de software, motivo por el cual las empresas necesitan una alternativa que permita reducir su costo y el tiempo de su realización. Esta investigación propone el uso de unas estructuras combinatoriales conocidas como arreglos de cubrimiento (CA) y arreglos de cubrimiento mixtos (MCA), que garantizan la detección hasta del 100 % de los errores con una mínima cantidad de pruebas. Con este enfoque, se desarrolló un complemento de Visual Studio.NET para la optimización de las pruebas y se evaluó su uso con estudiantes de último semestre de Ingeniería de Sistemas y de una empresa de software. Los resultados obtenidos son prometedores y motivan al grupo de investigación a divulgar su trabajo en el nivel nacional. El proyecto de investigación fue financiado por la Vicerrectoría de Investigaciones de la Universidad del Cauca.

2011 ◽  
Vol 328-330 ◽  
pp. 775-778
Author(s):  
Yong Hui Tang ◽  
Hong Ying Zhang ◽  
Guo Xiang Lin

This paper studies on the design methods and key technologies of the system of rolling mill equipments management based on Web, in accordance with the the practical needs. This system adopted B/S as its structure, while developing software for rolling mill equipments management on the platform of Microsoft Visual Studio.NET. The system uses a three-tier hierarchical structure: User layer, Web Server layer and Database server layer. User layer refers to the user through the browser to complete the system remote services and information sharing. Web server layer is the link to contact the browser and the database, and used to store system function modular and application program. Database server layer is mainly used to store various data required for the system after being put into practice for a period, the efficiency of maintenance and management of rolling mill equipments has been increased obviously, thus the method can be used in the maintenance of rolling mill equipments.


Author(s):  
Bill Sempf ◽  
Donald Xie ◽  
James Greenwood ◽  
Rob Harrop ◽  
Colt Kwong ◽  
...  
Keyword(s):  

2002 ◽  
Vol 34 (1) ◽  
Author(s):  
Roseann Krane ◽  
Harriette Kisilinsky ◽  
Alfred Thompson ◽  
Pat Phillips
Keyword(s):  

2002 ◽  
Vol 34 (1) ◽  
pp. 247-248
Author(s):  
Roseann Krane ◽  
Alfred Thompson ◽  
Harriette Kisilinsky ◽  
Pat Phillips
Keyword(s):  

2013 ◽  
Vol 2013 ◽  
pp. 1-5 ◽  
Author(s):  
Wang Hongwei ◽  
Liu Hui

Objective. The purpose of this study was to describe a new data visualisation system by plotting the human face to observe the comprehensive effects of multivariate data.Methods. The Graphics Device Interface (GDI+) in the Visual Studio.NET development platform was used to write a program that enables facial image parameters to be recorded, such as cropping and rotation, and can generate a new facial image according toZvalues from sets of normal data (Z>3was still counted as 3). The measured clinical laboratory parameters related to health status were obtained from senile people, glaucoma patients, and fatty liver patients to illustrate the facial data visualisation system.Results. When the eyes, nose, and mouth were rotated around their own axes at the same angle, the deformation effects were similar. The deformation effects for any abnormality of the eyes, nose, or mouth should be slightly higher than those for simultaneous abnormalities. The facial changes in the populations with different health statuses were significant compared with a control population.Conclusions. The comprehensive effects of multivariate may not equal the sum of each variable. The 3Zfacial data visualisation system can effectively distinguish people with poor health status from healthy people.


2002 ◽  
pp. 55-81
Author(s):  
Adam Sills ◽  
Mesbah Ahmed ◽  
Dotthatcom.com ◽  
Frank Boumphrey ◽  
Jonothon Ortiz
Keyword(s):  

2012 ◽  
Vol 629 ◽  
pp. 667-670 ◽  
Author(s):  
Yun Yang ◽  
Yue Zhu

In this article, Using the latest Visual studio.net 2005 supplied C # serial class implements PC and single-chip microcomputer of serial communication. Summarizes the card the integrated function of the integrated management system, and probes into how to use C# serial kind of design for serial communication program, through the C# serial class in one card the specific application of integrated management system, and analyzes the application of C# serial kind characteristics, proved the C# serial class can make serial communication program design flexibility, can improve the reliability of the data in the serial port transmission. The actual operation shows that this kind of programming method is stable, reliable and practical.


2015 ◽  
Vol 786 ◽  
pp. 361-366 ◽  
Author(s):  
Mohammad Hafifi Hafiz Ishak ◽  
Mohd Zulkifly Abdullah ◽  
M.K. Abdullah ◽  
A. Abdul Aziz ◽  
W.K. Loh ◽  
...  

Finite volume method (FVM) based simulation of 3D fluid-structure interaction (FSI) of stacked chip package during the encapsulation process of moulded underfill (MUF) in different aspect ratio is presented in this paper. The 3D model of flip chip package is built and meshed using ANSYS ICEM, and simulated by FLUENT software. Castro–Macosko viscosity model and volume of fluid (VOF) technique are applied for flow front tracking of the encapsulant. Curing kinetics is taken into consideration in the simulation using Kamal’s equation. To solve the Castro–Macosko and Kamal models, suitable user defined functions (UDFs) are developed using MS VISUAL STUDIO.NET software and incorporated into the FLUENT. The parameter such as different aspect ratio of stacked die of mold cavity on the flow front behaviour is mainly studied. Mechanical stresses experienced by the silicon die will also be monitored for risk of die cracking. The visualisation of the 3D stacking-chip package encapsulation process was presented at different filling times. The encapsulation model aided a clear visualisation and improved fundamental understanding of the design of a 3D integrated circuit encapsulation. The proposed analysis is expected to be a reference and guide in the design and improvement of 3D integration packages.


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