scholarly journals The A Consideration about a Thought Verb “OMOU” in the “V+V” Type Compound Verb - Focused on “OMOI-AGARU, to Be Conceited”, “OMOI-SHIRU, to Realize”, “OMOI-DASU, to Remember” -

2015 ◽  
Vol null (71) ◽  
pp. 213-236
Author(s):  
OTANI, Teppei
Keyword(s):  
Type Compound ◽  
Compound Verb

Biogenetic synthesis of an androcymbine-type compound

1968 ◽  
pp. 1605 ◽  
Author(s):  
T. Kametani ◽  
K. Fukumoto ◽  
M. Koizumi ◽  
A. Kozuka
Keyword(s):  
Type Compound

Effect of technological parameters of gas-dynamic deposition on structural-phase transformations in “brass” type coating

2020 ◽  
pp. 554-559
Author(s):  
V.E. Arkhipov ◽  
T.I. Murav’eva ◽  
M.S. Pugachev ◽  
I.V. Shkaley
Keyword(s):  
Deposition Temperature ◽  
Mass Fraction ◽  
Structural Phase ◽  
X Ray Diffraction ◽  
Technological Parameters ◽  
X Ray ◽  
Type Compound ◽  
Gas Dynamic ◽  
Ε Phase ◽  
Overlap Coefficient

The results of effect of deposition temperature and the overlap coefficient on the formation of the phase composition of coating based on Cu, Zn and Al2O3 particles mixture applied by cold gas-dynamic deposition are presented. Using X-ray diffraction and X-ray spectral analysis, it is shown that when using the 55 % overlap coefficient electron-type compound based on CuZn3 (ε-phase) is formed in the coating, the mass fraction of which increases to 11.4 % with increase in the deposition temperature. Deposition with 64 % overlap coefficient is accompanied by the formation not only of the ε-phase, but of electron-type compound based on Cu5Zn8 (γ-phase), the mass fraction of which increases to 33 % at temperature of 450 °C. In the process of coating deposition, the predominant diffusion copper into zinc takes place; the calculations show high value of the diffusion coefficient copper — 1,56•10–13 m2 /s.

Large Positive Thermal Expansion and Small Band Gap in Double-ReO3-Type Compound NaSbF6

2017 ◽  
Vol 56 (9) ◽  
pp. 4990-4995 ◽  
Author(s):  
C. Yang ◽  
B. Y. Qu ◽  
S. S. Pan ◽  
L. Zhang ◽  
R. R. Zhang ◽  
...  
Keyword(s):  
Thermal Expansion ◽  
Band Gap ◽  
Type Compound ◽  
Small Band

Significantly optimized thermoelectric properties in high-symmetry cubic Cu7PSe6 compounds via entropy engineering

2018 ◽  
Vol 6 (15) ◽  
pp. 6493-6502 ◽  
Author(s):  
Rui Chen ◽  
Pengfei Qiu ◽  
Binbin Jiang ◽  
Ping Hu ◽  
Yiming Zhang ◽  
...  
Keyword(s):  
Thermoelectric Properties ◽  
Configurational Entropy ◽  
Thermoelectric Performance ◽  
High Symmetry ◽  
Type Compound

Via introducing Te into the argyrodite-type compound Cu7PSe6, the configurational entropy is increased yielding the significantly enhanced thermoelectric performance.

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