Stress Analysis for Partial Through-hole in a Tensile Plate by Photoelasticity

2016 ◽  
Author(s):  
Jie Cheng ◽  
◽  
Tae-Hyun Baek ◽  
Keyword(s):  
Stress Analysis ◽  
Through Hole

scholarly journals Prediction of Thermal-Cycle Life for Plated Through Hole Based on Thermal-Stress Analysis.

1991 ◽  
Vol 6 (6) ◽  
pp. 306-314 ◽  
Author(s):  
Yoichi KITAMURA ◽  
Takashi TAKAHAMA ◽  
Susumu HOSHINOUCHI
Keyword(s):  
Thermal Stress ◽  
Stress Analysis ◽  
Thermal Cycle ◽  
Cycle Life ◽  
Thermal Stress Analysis ◽  
Plated Through Hole ◽  
Through Hole

J031042 Effects of Glass Fiber Cloth Structure on Thermal Stress Analysis of Substrate with Through-hole

2011 ◽  
Vol 2011 (0) ◽  
pp. _J031042-1-_J031042-3
Author(s):  
Yu YAMAYOSE ◽  
Tetsuya KUGIMIYA ◽  
Kenji HIROHATA ◽  
Akihiko HAPPOYA
Keyword(s):  
Thermal Stress ◽  
Glass Fiber ◽  
Stress Analysis ◽  
Thermal Stress Analysis ◽  
Through Hole

Stress analysis on centric through hole PCB

2012 ◽  
Author(s):  
Z. Sauli ◽  
V. Retnasamy ◽  
N. A. Z. Rahman ◽  
B. Man ◽  
N. S. Nadzri ◽  
...  
Keyword(s):  
Stress Analysis ◽  
Through Hole

scholarly journals Stress Analysis for Through Hole Area in Multilayer Alumina Ceramic Substrate.

1999 ◽  
Vol 107 (1252) ◽  
pp. 1188-1192 ◽  
Author(s):  
Shosaku ISHIHARA ◽  
Tsuyoshi FUJITA ◽  
Akio YASUKAWA
Keyword(s):  
Stress Analysis ◽  
Alumina Ceramic ◽  
Ceramic Substrate ◽  
Hole Area ◽  
Through Hole

Transient Thermal Stress Analysis of a Plated Through Hole Subjected to Wave Soldering

1991 ◽  
Vol 113 (2) ◽  
pp. 149-155 ◽  
Author(s):  
D. Barker ◽  
M. Pecht ◽  
A. Dasgupta ◽  
S. Naqvi
Keyword(s):  
Thermal Stress ◽  
Stress Analysis ◽  
Three Dimensional ◽  
Strain History ◽  
Thermal Stress Analysis ◽  
Soldering Process ◽  
Wave Soldering ◽  
Plated Through Hole ◽  
The Impact ◽  
Through Hole

During a typical wave soldering operation a plated through hole (PTH) is exposed to temperatures which are higher than any rated operating temperatures. Understanding the heat transfer and the potential PTH damage mechanisms, which arise during the wave soldering process, is critical to PTH quality control and reliability. In particular, cracks may be initiated during the wave soldering transient and become manifest only after operational cycling. This paper presents a transient nonlinear thermal stress analysis of a nonsolder filled PTH that is subjected to a typical wave soldering process. A full three-dimensional orthotropic analysis and an axisymmetric analysis with cylindrically anisotropic properties are used and the results compared. Temperature and stress/strain history curves are examined to determine the impact of the wave soldering operation on the PTH fatigue life. The effect of PWB innerplanes on the PTH maximum stress and strain is also investigated.

FORCE DISTRIBUTIONS AND STRESS ANALYSIS OF THE INTOR-CH SUPERCONDUCTING COIL

1984 ◽  
Vol 45 (C1) ◽  
pp. C1-901-C1-904 ◽  
Author(s):  
C. Marinucci ◽  
L. Palladino ◽  
G. Pasotti ◽  
M. V. Ricci ◽  
G. Vécsey
Keyword(s):  
Stress Analysis ◽  
Superconducting Coil
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