scholarly journals Characterization of Min-K TE-1400 Thermal Insulation (Two-Year Gradient Stress Relaxation Testing Update)

2009 ◽  
Author(s):  
James Gordon Hemrick ◽  
Edgar Lara-Curzio ◽  
James King
Keyword(s):  
Stress Relaxation ◽  
Thermal Insulation

Stress relaxation and optical characterization of TiO2 and SiO2 films grown by dual ion beam deposition

2008 ◽  
Vol 516 (23) ◽  
pp. 8604-8608 ◽  
Author(s):  
C. Bundesmann ◽  
I.-M. Eichentopf ◽  
S. Mändl ◽  
H. Neumann
Keyword(s):  
Stress Relaxation ◽  
Ion Beam ◽  
Optical Characterization ◽  
Sio2 Films ◽  
Ion Beam Deposition ◽  
Beam Deposition

scholarly journals On-Chip Thermal Insulation Using Porous GaN

Proceedings ◽  
2018 ◽  
Vol 2 (13) ◽  
pp. 776 ◽  
Author(s):  
Bogdan F. Spiridon ◽  
Peter H. Griffin ◽  
John C. Jarman ◽  
Yingjun Liu ◽  
Tongtong Zhu ◽  
...  
Keyword(s):  
Thermal Insulation ◽  
High Speed ◽  
Thermal Characterization ◽  
Semiconductor Materials ◽  
3Ω Method ◽  
Theoretical Predictions ◽  
Order Of Magnitude ◽  
On Chip ◽  
Fundamental Requirement

This study focuses on the thermal characterization of porous gallium nitride (GaN) usingan extended 3ω method. Porous semiconductor materials provide a solution to the need for on-chipthermal insulation, a fundamental requirement for low-power, high-speed and high-accuracythermal sensors. Thermal insulation is especially important in GaN devices, due to the intrinsicallyhigh thermal conductivity of the material. The results show one order of magnitude reduction inthermal conductivity, from 130 W/mK to 10 W/mK, in line with theoretical predictions for porousmaterials. This achievement is encouraging in the quest for integrating sensors with opto-, powerandRF-electronics on a single GaN chip.

Characterization of corrosive agents in polyurethane foams for thermal insulation of pipelines

2007 ◽  
Vol 52 (27) ◽  
pp. 7780-7785 ◽  
Author(s):  
F.V.V. de Sousa ◽  
R.O. da Mota ◽  
J.P. Quintela ◽  
M.M. Vieira ◽  
I.C.P. Margarit ◽  
...  
Keyword(s):  
Thermal Insulation ◽  
Polyurethane Foams

scholarly journals Processing and Characterization of Silicon Nitride Nanofiber Paper

2013 ◽  
Vol 2013 ◽  
pp. 1-7 ◽  
Author(s):  
Kei-Peng Jen ◽  
Ronald Warzoha ◽  
Ji Guo ◽  
Michael Tang ◽  
Sridhar Santhanam
Keyword(s):  
Silicon Nitride ◽  
Thermal Insulation ◽  
Reduction Process ◽  
Thermal Characterization ◽  
Nitride Phase ◽  
Mechanical Stiffness ◽  
Precursor Material ◽  
Processing Step

Papers of silicon nitride nanofibers were synthesized by a carbothermal reduction process. These nanofiber papers were synthesized in situ and did not require a secondary processing step. The process utilized silica nanopowders and silica gel as the precursor material. Processing geometry played a crucial role in regulating the growth of the nanofiber papers. Characterization of the nanofiber papers indicated that the nanofibers were of the alpha silicon nitride phase. Both mechanical stiffness and strength of the nanofiber papers were measured. Thermal conductivity and specific heat of the papers were also measured and were found to be lower than many common thermal insulation materials at much smaller thicknesses and were comparable to those values that are typically reported for carbon-nanotube-based buckypaper. Results of the mechanical and thermal characterization indicate that these silicon nitride nanofiber papers can be utilized for specialized thermal insulation applications.

scholarly journals Mechanical Characterization of Spray-Dried Granules by Compression and Stress-Relaxation Technique. Analysis of Relaxation Behavior.

1999 ◽  
Vol 107 (1252) ◽  
pp. 1183-1187 ◽  
Author(s):  
JunIchiro TSUBAKI ◽  
Takamasa MORI ◽  
Toshiyuki KONISHI ◽  
Akihisa TSURUTA ◽  
Hidetoshi MORI ◽  
...  
Keyword(s):  
Stress Relaxation ◽  
Mechanical Characterization ◽  
Relaxation Behavior ◽  
Relaxation Technique ◽  
Spray Dried ◽  
Technique Analysis

scholarly journals Recyclable Organocatalyzed Poly(Thiourethane) Covalent Adaptable Networks

Polymers ◽  
2020 ◽  
Vol 12 (12) ◽  
pp. 2913
Author(s):  
Francesco Gamardella ◽  
Sara Muñoz ◽  
Silvia De la Flor ◽  
Xavier Ramis ◽  
Angels Serra
Keyword(s):  
Stress Relaxation ◽  
Mechanical Characterization ◽  
Tensile Tests ◽  
Thermomechanical Analysis ◽  
Hexamethylene Diisocyanate ◽  
Relaxation Rates ◽  
Ftir Studies ◽  
New Type ◽  
And Performance

A new type of tetraphenylborate salts derived from highly basic and nucleophilic amines, namely 1,5-diazabicyclo[4.3.0]non-5-ene (DBN), 1,8-diazabicyclo(5.4.0)undec-7-ene (DBU) and triazabicyclodecene (TBD), was applied to the preparation of networked poly(thiourethane)s (PTUs), which showed a vitrimer-like behavior, with higher stress-relaxation rates than PTUs prepared by using dibutyl thin dilaurate (DBTDL) as the catalyst. The use of these salts, which release the amines when heated, instead of the pure amines, allows the formulation to be easily manipulated to prepare any type of samples. The materials prepared from stoichiometric mixtures of hexamethylene diisocyanate (HDI), trithiol (S3) and with a 10% of molar excess of isocyanate or thiol were characterized by FTIR, thermomechanical analysis, thermogravimetry, stress-relaxation tests and tensile tests, thus obtaining a complete thermal and mechanical characterization of the materials. The recycled materials obtained by grinding the original PTUs and hot-pressing the small pieces in the optimized time and temperature conditions were fully characterized by mechanical, thermomechanical and FTIR studies. This allowed us to confirm their recyclability, without appreciable changes in the network structure and performance. From several observations, the dissociative interchange trans-thiocarbamoylation mechanism was evidenced as the main responsible of the topological rearrangements at high temperature, resulting in a vitrimeric-like behavior.

scholarly journals Microstructural and Thermo-Physical Characterization of a Water Hyacinth Petiole for Thermal Insulation Particle Board Manufacture

Materials ◽  
2019 ◽  
Vol 12 (4) ◽  
pp. 560 ◽  
Author(s):  
Adela Salas-Ruiz ◽  
María del Mar Barbero-Barrera ◽  
Trinidad Ruiz-Téllez
Keyword(s):  
Particle Size ◽  
Thermal Insulation ◽  
Water Hyacinth ◽  
Eichhornia Crassipes ◽  
Construction Material ◽  
Chemical Characterization ◽  
Thermal Characterization ◽  
Particle Board ◽  
Global Concern

Water Hyacinth (Eichhornia crassipes) is a dangerous and invasive aquatic species, of which global concern has sharply risen due to its rapid growth. Despite ample research on its possible applications in the construction field, there are no clear references on the optimal use of the plant in finding the most efficient-use building material. In this paper, a microstructural and chemical characterization of the Water Hyacinth petiole was performed, in order to find the most efficient use as a construction material. Subsequently, two types of binder-less insulation panels were developed, with two types of particle size (pulp and staple). A physical, mechanical, and thermal characterization of the boards was performed. These results demonstrated that it is possible to manufacture self-supporting Water Hyacinth petiole panels without an artificial polymer matrix for thermal insulation. The boards showed good thermal conductivity values, ranging from 0.047–0.065 W/mK. In addition, clear differences were found in the properties of the boards, depending on the type of Water Hyacinth petiole particle size, due to the differences in the microstructure.

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