scholarly journals High temperature solder alloys for underhood applications. Progress report

10.2172/91947 ◽  
1995 ◽  
Author(s):  
C.A. Drewien ◽  
F.G. Yost ◽  
S. Sackinger ◽  
J. Kern ◽  
M.W. Weiser
Keyword(s):  
High Temperature ◽  
Progress Report ◽  
Solder Alloys ◽  
High Temperature Solder

Study of off-eutectic Zn–xMg high temperature solder alloys

2016 ◽  
Vol 27 (8) ◽  
pp. 8734-8744 ◽  
Author(s):  
Roisul Hasan Galib ◽  
Rahat Al Hasan ◽  
Ahmed Sharif
Keyword(s):  
High Temperature ◽  
Solder Alloys ◽  
High Temperature Solder

scholarly journals High temperature solder alloys for underhood applications: Final report

1996 ◽  
Author(s):  
J.A. Kern ◽  
C.A. Drewien ◽  
F.G. Yost ◽  
S. Sackinger ◽  
M.W. Weiser
Keyword(s):  
High Temperature ◽  
Final Report ◽  
Solder Alloys ◽  
High Temperature Solder

scholarly journals Erratum to: Study of off-eutectic Zn–xMg high temperature solder alloys

2016 ◽  
Vol 27 (9) ◽  
pp. 9981-9981 ◽  
Author(s):  
Roisul Hasan Galib ◽  
Rahat Al Hasan ◽  
Ahmed Sharif
Keyword(s):  
High Temperature ◽  
Solder Alloys ◽  
High Temperature Solder

Electrochemical behavior of Zn-xSn high-temperature solder alloys in 0.5 M NaCl solution

2017 ◽  
Vol 716 ◽  
pp. 231-239 ◽  
Author(s):  
Zhenghong Wang ◽  
Chuantong Chen ◽  
Jinting Jiu ◽  
Shijo Nagao ◽  
Masaya Nogi ◽  
...  
Keyword(s):  
High Temperature ◽  
Electrochemical Behavior ◽  
Nacl Solution ◽  
Solder Alloys ◽  
High Temperature Solder

scholarly journals Joining of Cu, Ni, and Ti Using Au-Ge-Based High-Temperature Solder Alloys

2014 ◽  
Vol 23 (5) ◽  
pp. 1585-1592 ◽  
Author(s):  
Nico Weyrich ◽  
Shan Jin ◽  
Liliana I. Duarte ◽  
Christian Leinenbach
Keyword(s):  
High Temperature ◽  
Solder Alloys ◽  
High Temperature Solder

Study of Zn-Mg-Ag High-Temperature Solder Alloys

2019 ◽  
pp. 135-146
Author(s):  
Roisul H. Galib ◽  
Md. Ashif Anwar ◽  
Ahmed Sharif
Keyword(s):  
High Temperature ◽  
Solder Alloys ◽  
High Temperature Solder

Grain Refinements of Cu6Sn5 in Sn-3wt%Ag-5wt%Cu High Temperature Solder Alloys

2018 ◽  
Vol 273 ◽  
pp. 20-26
Author(s):  
Xin Fu Tan ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Stuart D. McDonald ◽  
Kazuhiro Nogita
Keyword(s):  
High Temperature ◽  
Nucleation Temperature ◽  
Solder Alloys ◽  
Unmodified Alloy ◽  
Mixed Effect ◽  
Intermetallic Particles ◽  
Addition Rate ◽  
Mg Addition ◽  
Element Addition ◽  
High Temperature Solder

This paper investigated the effect of trace addition of Al and Mg on the grain refinements of Cu6Sn5in Sn-3wt%Ag-5wt%Cu high temperature solder alloys. Furthermore, the effect of Al and Mg addition on the Sn/Ag3Sn eutectic were also investigated. It was found that the addition of both Al and Mg successfully refined the Cu6Sn5in Sn-3wt%Ag-5wt%Cu solder alloy. In addition, Al suppresses the formation of Ag3Sn in the Sn/Ag3Sn eutectic; while Mg promotes the formation of fine Sn/Ag3Sn eutectic microstructure. The refinement of Cu6Sn5is believed to be due to heterogeneous nucleation by Al and Mg rich intermetallic particles respectively. Effect of Al and Mg addition on the undercooling of the Sn/Ag3Sn eutectic was found to be similar, both reducing undercooling effectively at a low addition rate of 0.025wt%. The addition of Al and Mg have mixed effect on the nucleation temperature of Cu6Sn5. It is found that the nucleation temperature of Cu6Sn5is increased with 0.025wt% Al and 0.1wt% Mg addition to the unmodified alloy, while the nucleation temperature slowly decreases again as the trace element addition rate increases.

Creep Study for Fatigue Life Assessment of Two Lead-Free High Temperature Solder Alloys

1996 ◽  
Vol 445 ◽  
Author(s):  
J. Liang ◽  
P. S. Lee ◽  
N. Gollhardt ◽  
S. Schroeder ◽  
W. Morris
Keyword(s):  
High Temperature ◽  
Fatigue Life ◽  
Creep Deformation ◽  
Failure Criteria ◽  
Life Assessment ◽  
Lead Free ◽  
Creep Model ◽  
Secondary Creep ◽  
Solder Alloys ◽  
High Temperature Solder

AbstractCreep of two lead-free high temperature solder alloys, 95Sn-5Ag and 99Sn-1.0Cu was studied in this investigation. Room and high temperature creep tests were performed to examine deformation mechanisms and to establish mathematical models of creep deformation for the alloys. A state variable creep model was introduced to model both primary and secondary creep deformation of these two alloys which show a very significant primary creep. Fatigue life models of the alloys were established based on an energy-based failure criteria, which was deduced from variable strain amplitude tests at a constant strain rate of 0.003/sec, and from variable strain rates tests with two constant strain amplitudes of 0.005 and 0.01. Applications of the creep model includes determination of peak loads and hysteresis strain energy density in strain-controlled fatigue tests. It is demonstrated that the creep model can be very helpful to establish fatigue failure criteria and to assess fatigue lives of these two alloys.

Study on the properties of Zn–xNi high temperature solder alloys

2015 ◽  
Vol 27 (4) ◽  
pp. 3608-3618 ◽  
Author(s):  
Sanjoy Mallick ◽  
Md Sharear Kabir ◽  
Ahmed Sharif
Keyword(s):  
High Temperature ◽  
Solder Alloys ◽  
High Temperature Solder
Sign in / Sign up

Export Citation Format

Share Document