scholarly journals Yield Improvement in Steel Casting (Yield II)

2002 ◽  
Author(s):  
Richard A. Hardin ◽  
Christoph Beckermann ◽  
Tim Hays
Keyword(s):  
Steel Casting ◽  
Yield Improvement ◽  
Casting Yield

KUBOTA ALLOY HD

Alloy Digest ◽  
2011 ◽  
Vol 60 (12) ◽  
Keyword(s):  
Stainless Steel ◽  
Corrosion Resistance ◽  
Physical Properties ◽  
Tensile Properties ◽  
Steel Casting ◽  
Casting Alloy

Abstract Kubota Alloy HD (UNS J93005) is a heat-resisting stainless steel casting alloy suitable for long-term service at temperatures up to 1095 deg C (2000 deg F). The nearest wrought equivalent is type 327. This datasheet provides information on composition, physical properties, hardness, and tensile properties as well as creep. It also includes information on corrosion resistance as well as casting and joining. Filing Code: SS-1110. Producer or source: Kubota Metal Corporation, Fahramet Division.

KUBOTA HH II

Alloy Digest ◽  
2006 ◽  
Vol 55 (11) ◽  
Keyword(s):  
Stainless Steel ◽  
High Temperature ◽  
Austenitic Stainless Steel ◽  
Physical Properties ◽  
Tensile Properties ◽  
Steel Casting ◽  
Heat Resistant ◽  
Temperature Performance

Abstract Kubota alloy HH II is a heat-resistant fully austenitic stainless steel casting for multiple furnace parts. This datasheet provides information on composition, physical properties, elasticity, and tensile properties as well as creep. It also includes information on high temperature performance as well as casting and joining. Filing Code: SS-980. Producer or source: Kubota Metal Corporation, Fahramet Division.

KUBOTA ALLOY HC

Alloy Digest ◽  
2010 ◽  
Vol 59 (5) ◽  
Keyword(s):  
Stainless Steel ◽  
Corrosion Resistance ◽  
Physical Properties ◽  
Tensile Properties ◽  
Steel Casting

Abstract Kubota Alloy HC is a heat resisting stainless steel casting suitable for long term service at temperatures up to 1093 deg C (2000 deg F). This alloy can maintain resistance to sulfur bearing environments up to 1093 deg C (2000 deg F). This datasheet provides information on composition, physical properties, hardness, and tensile properties. It also includes information on corrosion resistance as well as casting and joining. Filing Code: SS-1065. Producer or source: Kubota Metal Corporation, Fahramet Division.

ACI TYPE HN

Alloy Digest ◽  
1982 ◽  
Vol 31 (6) ◽  
Keyword(s):  
Stainless Steel ◽  
Corrosion Resistance ◽  
High Temperature ◽  
Steel Casting ◽  
Nickel Content ◽  
Heat Treating ◽  
High Temperature Corrosion ◽  
Temperature Performance ◽  
Wide Range ◽  
Iron Chromium

Abstract Type HN is an iron-chromium-nickel alloy containing sufficient chromium for good high-temperature corrosion resistance and with nickel content in excess of the chromium. This alloy has properties somewhat similar to the more widely used ACI Type HT alloy but with better ductility. Type HN is used for highly stressed components in the 1800-2000 F temperature range. It is used in the aircraft, automotive, petroleum, petrochemical and power industries for a wide range of components and parts. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties as well as creep. It also includes information on high temperature performance and corrosion resistance as well as casting, heat treating, machining, and joining. Filing Code: SS-410. Producer or source: Various stainless steel casting companies.

Defect Snap Shot: Quick Isolation and Mapping of Interconnect Defects for Backend Yield Improvement

2004 ◽  
Author(s):  
Jenny Fan ◽  
Dave Mark
Keyword(s):  
Metal Layer ◽  
Single Layer ◽  
Yield Improvement ◽  
Test Methodology ◽  
Process Complexity

Abstract Metal interconnect defects have become a more serious yield detractor as backend process complexity has increased from a single layer to about 10 layers. This paper introduces a test methodology to monitor and localize the metal defects based on FPGA products. The test patterns are generated for each metal layer. The results not only indicate the severity of defects for each metal layer, but also accurately isolate open/short defects.

In-Line Defect to Bitmap Signature Correlation: A Shortcut to Physical FA Results

2000 ◽  
Author(s):  
Julie Segal ◽  
Arman Sagatelian ◽  
Bob Hodgkins ◽  
Tom Ho ◽  
Ben Chu ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Integrated Circuit ◽  
Failure Mechanisms ◽  
Memory Devices ◽  
Line Defect ◽  
Yield Improvement ◽  
Electrical Test ◽  
Large Numbers ◽  
Improvement Process ◽  
Existing Data

Abstract Physical failure analysis (FA) of integrated circuit devices that fail electrical test is an important part of the yield improvement process. This article describes how the analysis of existing data from arrayed devices can be used to replace physical FA of some electrical test failures, and increase the value of physical FA results. The discussion is limited to pre-repair results. The key is to use classified bitmaps and determine which signature classification correlates to which type of in-line defect. Using this technique, physical failure mechanisms can be determined for large numbers of failures on a scale that would be unfeasible with de-processing and physical FA. If the bitmaps are classified, two-way correlation can be performed: in-line defect to bitmap failure, as well as bitmap signature to in-line defect. Results also demonstrate the value of analyzing memory devices failures, even those that can be repaired, to gain understanding of defect mechanisms.

BiCMOS Die Sort Yield Improvement from Isolation of a Localized Defect Mechanism and Precision TEM Cross Section

1997 ◽  
Author(s):  
J. Douglass ◽  
T. D. Myers ◽  
F. Tsai ◽  
R. Ketcheson ◽  
J. Errett
Keyword(s):  
Electron Microscopy ◽  
Cross Section ◽  
Focused Ion Beam ◽  
Yield Loss ◽  
Process Analysis ◽  
Ion Beam ◽  
Yield Improvement ◽  
Transmission Electron ◽  
Defect Mechanism ◽  
Water Residue

Abstract This paper describes how the authors used a combination of focused ion beam (FIB) microprobing, transmission electron microscopy (TEM), and data and process analysis to determine that localized water residue was causing a 6% yield loss at die sort.

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