Chemical and physical characterization of a Kevlar-filled epoxy molding compound

In-situ characterization of moisture absorption and hygroscopic swelling of an epoxy molding compound for electronic packaging

Journal of Thermal Analysis and Calorimetry ◽

10.1007/s10973-021-10941-w ◽

2021 ◽

Author(s):

Yi He ◽

Mohammad Kabiri

Keyword(s):

Electronic Packaging ◽

Moisture Absorption ◽

In Situ Characterization ◽

Epoxy Molding Compound ◽

Molding Compound ◽

Hygroscopic Swelling

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Characterization of the rheological properties of a fast-curing epoxy-molding compound

Journal of Rheology ◽

10.1122/1.550809 ◽

1997 ◽

Vol 41 (2) ◽

pp. 177-195 ◽

Cited By ~ 15

Author(s):

Sejin Han ◽

K. K. Wang ◽

C. A. Hieber ◽

C. Cohen

Keyword(s):

Rheological Properties ◽

Epoxy Molding Compound ◽

Molding Compound

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Characterization of the viscoelastic properties of an epoxy molding compound during cure

Microelectronics Reliability ◽

10.1016/j.microrel.2012.03.025 ◽

2012 ◽

Vol 52 (8) ◽

pp. 1711-1718 ◽

Cited By ~ 24

Author(s):

M. Sadeghinia ◽

K.M.B. Jansen ◽

L.J. Ernst

Keyword(s):

Viscoelastic Properties ◽

Epoxy Molding Compound ◽

Molding Compound

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Characterization of (Tix Cr0.6−x)N0.4 coatings and their tribological behaviors against an epoxy molding compound

Surface and Coatings Technology ◽

10.1016/s0257-8972(01)01401-3 ◽

2001 ◽

Vol 146-147 ◽

pp. 331-337 ◽

Cited By ~ 19

Author(s):

J.H Hsieh ◽

W.H Zhang ◽

C Li ◽

C.Q Sun

Keyword(s):

Epoxy Molding Compound ◽

Molding Compound ◽

Tribological Behaviors

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Preparation and Characterization of a Novel Epoxy Molding Compound with Low Storage Modulus at High Temperature and Low Glass-Transition Temperature

Journal of Electronic Materials ◽

10.1007/s11664-012-2105-7 ◽

2012 ◽

Vol 41 (9) ◽

pp. 2599-2605 ◽

Cited By ~ 5

Author(s):

Hui-wang Cui ◽

Dong-sheng Li ◽

Qiong Fan

Keyword(s):

Glass Transition ◽

High Temperature ◽

Transition Temperature ◽

Glass Transition Temperature ◽

Storage Modulus ◽

Epoxy Molding Compound ◽

Molding Compound

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Thermal Reaction Characterization of an Epoxy Molding Compound

Polymer Journal ◽

10.1295/polymj.33.49 ◽

2001 ◽

Vol 33 (1) ◽

pp. 49-53 ◽

Cited By ~ 2

Author(s):

Man Geng Lu ◽

Hyeong-Ki Choi ◽

Hong-Ki Lee ◽

Mi-Ja Shim ◽

Sang Wook Kim

Keyword(s):

Thermal Reaction ◽

Epoxy Molding Compound ◽

Molding Compound

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Yield stress and rheological characterization of the low shear zone of an epoxy molding compound for encapsulation of semiconductor devices

Polymer Engineering & Science ◽

10.1002/pen.21015 ◽

2008 ◽

Vol 48 (4) ◽

pp. 747-755 ◽

Cited By ~ 1

Author(s):

Masaki Yoshii

Keyword(s):

Yield Stress ◽

Shear Zone ◽

Semiconductor Devices ◽

Rheological Characterization ◽

Epoxy Molding Compound ◽

Molding Compound ◽

Low Shear

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Characterization of oxidized copper leadframes and copper/epoxy molding compound interface adhesion in plastic package

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) ◽

10.1109/adhes.1998.742011 ◽

2002 ◽

Cited By ~ 6

Author(s):

T.-G. Kang ◽

I.-S. Park ◽

J.-H. Kim ◽

K.-S. Choi

Keyword(s):

Interface Adhesion ◽

Epoxy Molding Compound ◽

Molding Compound ◽

Plastic Package

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Characterization of Linear Viscoelastic Behavior of Epoxy Molding Compound Subjected to Uniaxial Compression and Hydrostatic Pressure

IEEE Transactions on Components Packaging and Manufacturing Technology ◽

10.1109/tcpmt.2018.2856249 ◽

2018 ◽

Vol 8 (8) ◽

pp. 1363-1372 ◽

Cited By ~ 4

Author(s):

Hyun Seop Lee ◽

Yong Sun ◽

Changsu Kim ◽

Bongtae Han

Keyword(s):

Hydrostatic Pressure ◽

Uniaxial Compression ◽

Viscoelastic Behavior ◽

Epoxy Molding Compound ◽

Molding Compound ◽

Linear Viscoelastic Behavior ◽

Linear Viscoelastic

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PHYSICAL CHARACTERIZATION OF THIN-FILM POLYMERS EXPOSED TO THE LOW EARTH ORBIT ENVIRONMENT

10.2514/6.1993-1577 ◽

1993 ◽

Author(s):

THOMAS STRGANAC ◽

ALAN LETTON ◽

ALLAN FARROW

Keyword(s):

Thin Film ◽

Low Earth Orbit ◽

Physical Characterization ◽

Earth Orbit

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