scholarly journals Variation of the yield strength and strain-rate sensitivity exponent of type 21-6-9 stainless steel over a wide temperature range

1982 ◽  
Author(s):  
M.E. Kassner
2008 ◽  
Vol 1128 ◽  
Author(s):  
Markus W. Wittmann ◽  
Janelle M. Chang ◽  
Yifeng Liao ◽  
Ian Baker

AbstractThe effects of strain rate and temperature on the yield strength of near-stoichiometric Fe2AlMn single crystals were investigated. In the temperature range 600-800K the yield stress increased with increasing temperature, a response commonly referred to as a yield strength anomaly. No strain rate sensitivity was observed below 750K, but at higher temperatures the yield stress increased with increasing strain rate. Possible mechanisms to explaining the effects of temperature and strain rate are discussed.


2014 ◽  
Vol 1 (5) ◽  
pp. SMM0049-SMM0049 ◽  
Author(s):  
Tyler LEBRUN ◽  
Kenichi TANIGAKI ◽  
Keitaro HORIKAWA ◽  
Hidetoshi KOBAYASHI

1996 ◽  
Vol 460 ◽  
Author(s):  
Yinmin Wang ◽  
Dongliang Lin ◽  
T. L. Lin ◽  
Yun Zhang

ABSTRACTThe compressive ductilities of Ni3Al-Zr-B base alloys with sole addition of magnesium (0.02∼0.06wt.%) and combined addition of magnesium(0.02wt.%) and silicon(0.54∼1.08wt.%) respectively responding to strain rate rising from 10-4sec-1 to 10-1 sec-1 have been studied in a high temperature range of 1073∼1273K. The results show that the compressive strains at rupture(CSR) of the alloys have been greatly improved by sole addition of magnesium and the alloys with combined addition of magnesium and silicon reveal even higher CSR values, furthermore, at temperatures of 1073K and 1273K, the strain rate dependence of CSR reveals to be anomalous, i.e, the CSR value increases as the strain rate rises, and then declines until it surpasses the peak value, which is corresponded to the strain rate of 10-3 sec-1 and 10-3 sec-1 respectively.The beneficial effect of magnesium and silicon exists in their competence of reducing strain rate sensitivity exponent values. The mechanisms of the anomalous ductilizing behavior in the Ni3Al as affected by ternary elements are discussed.


2012 ◽  
Vol 57 (4) ◽  
pp. 1253-1259 ◽  
Author(s):  
T. Tokarski ◽  
Ł. Wzorek ◽  
H. Dybiec

The objective of the present study is to analyze the mechanical properties and thermal stability for rapidly solidified and extruded 5083 aluminum alloy (RS). Compression tests were performed in order to estimate flow stress and strain rate sensitivity relation for 5083 alloy in the temperature range of 20°C to 450°C. For the comparison purposes, conventionally cast and extruded industrial material (IM) was studied as well. Deformation tests performed at room temperature conditions show that rapidly solidified material exhibits about 40% higher yield stress (YS=320 MPa) than conventionally cast material (YS=180 MPa), while the deformation at 450°C results in significant decrease of flow stress parameters for RS material (YS=20 MPa) in comparison to IM material (YS=40 MPa). Strain rate sensitivity parameter determined for high temperature conditions indicates superplasticity behavior of RS material. Structural observations show that under conditions of high-temperature deformation there are no operating recrystallization mechanisms. In general, grain size below 1µm and size of reinforcing phases below 50 nm is preserved within the used deformation temperature range.


2015 ◽  
Vol 2015 ◽  
pp. 1-8 ◽  
Author(s):  
Ming-wei Guo ◽  
Zhen-hua Wang ◽  
Ze-an Zhou ◽  
Shu-hua Sun ◽  
Wan-tang Fu

316LN stainless steel with 0.08%N (08N) and 0.17%N (17N) was compressed at 1073–1473 K and 0.001–10 s−1. The hot deformation behavior was investigated using stress-strain curve analysis, processing maps, and so forth. The microstructure was analyzed through electron backscatter diffraction analysis. Under most conditions, the deformation resistance of 17N was higher than that of 08N. This difference became more pronounced at lower temperatures. The strain rate sensitivity increased with increasing temperature for types of steel. In addition, the higher the N content, the higher the strain rate sensitivity. Hot deformation activation energy increased from 487 kJ/mol to 549 kJ/mol as N concentration was increased from 0.08% to 0.17%. The critical strain for initiation of dynamic recrystallization was lowered with increasing N content. In the processing maps, both power dissipation ratio and unstable region increased with increasing N concentration. In terms of microstructure evolution, N promoted dynamic recrystallization kinetic and decreased dynamic recrystallization grain size. The grain growth rate was lower in 17N than in 08N during heat treatment. Finally, it was found that N favored twin boundary formation.


2015 ◽  
Vol 94 ◽  
pp. 44-47 ◽  
Author(s):  
In-Chul Choi ◽  
Dong-Hyun Lee ◽  
Byungmin Ahn ◽  
Karsten Durst ◽  
Megumi Kawasaki ◽  
...  

2011 ◽  
Vol 133 (3) ◽  
Author(s):  
B. L. Boyce ◽  
L. N. Brewer ◽  
M. K. Neilsen ◽  
M. J. Perricone

The present study examines the thermomechanical strain-rate sensitivity of eutectic 63Sn–37Pb solder over a broad range of strain-rates from 0.0002 s–1 to 200 s–1, thus encompassing failure events between 1 h and 1 ms, at temperatures ranging from −60 °C to + 100 °C. A newly developed servohydraulic tensile method enabled this broad range of strain-rates to be evaluated by a single technique, eliminating ambiguity caused by evaluation across multiple experimental methods. Two solder conditions were compared: a normalized condition representing a solder joint that has largely stabilized ∼30 days after solidification and an aged condition representing ∼30 years at near-ambient temperatures. The tensile behavior of both conditions exhibited dramatic temperature and strain-rate sensitivity. At 100 °C, the yield strength increased from 5 MPa at 0.0002 s–1 to 42 MPa at 200 s–1, while at −60 °C, the yield strength increased from 57 MPa at 0.0002 s–1 to 71 MPa at 200 s–1. The room temperature strain rate-dependent behavior was also measured for the lead free SAC396 alloy. The SAC alloy exhibited thermal strain-rate sensitivity similar to Sn–Pb over this temperature and strain-rate regime. Microstructural characterization using backscatter electron imaging and electron backscatter diffraction showed distinct, morphological changes of the microstructure for different thermomechanical conditions as well as some systematic changes in the crystallographic texture. However, very little intergranular rotation was observed over the range of thermomechanical conditions, suggesting the dominance of a grain boundary sliding (GBS) deformation mechanism. Finally, a recently developed unified-creep-plasticity constitutive model for solder deformation was found to describe the observed behavior with much higher fidelity than the common Johnson–Cook model.


2018 ◽  
Vol 58 (10) ◽  
pp. 1840-1849 ◽  
Author(s):  
Amit Kumar ◽  
Aman Gupta ◽  
Rajesh Kisni Khatirkar ◽  
Nitish Bibhanshu ◽  
Satyam Suwas

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