scholarly journals Efficient ultrasonic grinding: a new technology for micron-sized coal. Final report, September 15, 1979-December 14, 1980

1981 ◽  
Author(s):  
W.B. Jr. Tarpley ◽  
P.L. Howard ◽  
G.R. Moulder
Keyword(s):  
New Technology ◽  
Final Report ◽  
Ultrasonic Grinding

Explaining the Future

2019 ◽  
Author(s):  
Sunny Bains
Keyword(s):  
Learning Process ◽  
New Technology ◽  
Venture Capitalist ◽  
Final Report ◽  
Years Of Experience ◽  
Worked Example ◽  
Analysis Process ◽  
The Future ◽  
Technical Reasoning

Explaining the Future addresses the questions “will this new technology solve the problem that its inventors claim it will,” “will it succeed for any application at all,” “can we narrow down the options before we spend a lot of money on development,” and “how do we persuade colleagues, investors, clients, or readers of our technical reasoning?” Whether the person answering these questions is a researcher, a consultant, a venture capitalist, or a CTO, they will need to be able to answer them clearly and systematically. Most learn these skills only through years of experience. However, by making them explicit, this book makes the learning process more efficient and speeds its readers toward higher-level careers. First, it will provide the tools to think through matching new (and old) technologies, materials, and processes with applications: it covers the questions to ask, the resources needed to answer them, and who deserves trust. Then, it discusses analyzing the information that has been gathered in a systematic way and dealing with uncertainty. Next, there are chapters on communication, including tailoring documents to a specific audience, making a persuasive and structured technical argument, and writing an explanation that is credible and easy to follow. Finally, the book includes a case study: a real worked example that goes from an idea through the twists and turns of the research and analysis process to a final report.

Microfabrication research at the National Submicron Facility

1983 ◽  
Vol 41 ◽  
pp. 86-89
Author(s):  
E.D. Wolf
Keyword(s):  
Integrated Circuits ◽  
Particle Physics ◽  
High Speed ◽  
New Technology ◽  
High Energy ◽  
High Energy Particle ◽  
New Science ◽  
Wide Range ◽  
Intermediate Domain ◽  
Circuit Function

Most microelectronics devices and circuits operate faster, consume less power, execute more functions and cost less per circuit function when the feature-sizes internal to the devices and circuits are made smaller. This is part of the stimulus for the Very High-Speed Integrated Circuits (VHSIC) program. There is also a need for smaller, more sensitive sensors in a wide range of disciplines that includes electrochemistry, neurophysiology and ultra-high pressure solid state research. There is often fundamental new science (and sometimes new technology) to be revealed (and used) when a basic parameter such as size is extended to new dimensions, as is evident at the two extremes of smallness and largeness, high energy particle physics and cosmology, respectively. However, there is also a very important intermediate domain of size that spans from the diameter of a small cluster of atoms up to near one micrometer which may also have just as profound effects on society as “big” physics.

Characterization of RF Sputtered ZnO Piezoelectric Films Using Transmission Electron Microscope

1975 ◽  
Vol 33 ◽  
pp. 86-87
Author(s):  
Kemining W. Yeh ◽  
Richard S. Muller ◽  
Wei-Kuo Wu ◽  
Jack Washburn
Keyword(s):  
Integrated Circuit ◽  
Acoustic Waves ◽  
New Technology ◽  
Surface Acoustic Waves ◽  
Electromechanical Properties ◽  
Leading Role ◽  
Saw Devices ◽  
Transmission Electron ◽  
High Degree

Considerable and continuing interest has been shown in the thin film transducer fabrication for surface acoustic waves (SAW) in the past few years. Due to the high degree of miniaturization, compatibility with silicon integrated circuit technology, simplicity and ease of design, this new technology has played an important role in the design of new devices for communications and signal processing. Among the commonly used piezoelectric thin films, ZnO generally yields superior electromechanical properties and is expected to play a leading role in the development of SAW devices.

Sign in / Sign up

Export Citation Format

Share Document