scholarly journals Interface between a printed circuit board computer aided design tool (Tektronix 4051 based) and a numerical paper tape controlled drill press (Slo-Syn 530: 100 w/ Dumore Automatic Head Number 8391)

1981 ◽  
Author(s):  
B.K. Heckman ◽  
V.K. Chinn
Keyword(s):  
Computer Aided Design ◽  
Printed Circuit Board ◽  
Paper Tape ◽  
Design Tool ◽  
Circuit Board ◽  
Printed Circuit ◽  
Computer Aided ◽  
Aided Design ◽  
Drill Press

FLEXIBLE PROJECT CUSTOMIZATION IN COMPUTER-AIDED DESIGN SYSTEMS

2021 ◽  
Author(s):  
E. A. Sobolev ◽  
Keyword(s):  
Computer Aided Design ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Design System ◽  
Programming Environment ◽  
Printed Circuit ◽  
Computer Aided ◽  
Design Systems ◽  
Aided Design ◽  
New Instruments

The article describes customization methods for printed circuit board projects in computer-aided design system Xpedition Enterprise. Two approaches has been detected, first – setting up project using built-in instruments, second – implementation of a new instruments using integrated programming environment.

scholarly journals MODIFICATION OF TOOL FOR MOVING TRACK SEGMENTS IN DELTA DESIGN CAD

2019 ◽  
pp. 130-133
Author(s):  
A. Yu. Gladkevich
Keyword(s):  
Computer Aided Design ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Design System ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Advantages And Disadvantages ◽  
Development Tools ◽  
Aided Design

Describes the process of improving and developing tools in computer‑aided design system Delta Design. Currently, the modern  process of PCB development is quite complex and time‑consuming process. Existing CAD systems make it easier to design a  printed circuit Board model by providing powerful development tools. Along with the increasing complexity of modern printed  circuit boards, the requirements for development tools are also growing, making them constantly improve. Using the example  of  the  Delta  Design  system,  the  process  of  improving  the  tool  for  moving  track  segments  is  described.  The  analysis  of  the  advantages and disadvantages of the existing tool is made, and the decision on the need to develop a new algorithm is justified.  Of the two proposed variants of such an algorithm, the optimal one was chosen in terms of the quality of the result obtained and  the convenience of operation.

scholarly journals Analisis Karakteristik Elektrik Bentuk Geometri Jalur PCB Menggunakan Pendekatan Finite Element

2018 ◽  
Vol 10 (1) ◽  
pp. 11-17
Author(s):  
Putut Son Maria ◽  
Elva Susianti
Keyword(s):  
Finite Element ◽  
Computer Aided Design ◽  
Printed Circuit Board ◽  
Scientific Literature ◽  
Circuit Board ◽  
Electrical Characteristics ◽  
The Finite Element Method ◽  
Printed Circuit ◽  
The Right ◽  
Aided Design

Some Electronics Computer Aided Design (ECAD) softwares have provided several track shapes to design a Printed Circuit Board (PCB), such as right angle, rounded and trapezoidal. However, it is quite difficult to find scientific literature that can be used as a guide which explains and compiles directly about each character of the geometry. This study aims to analyze and to observe the electrical characteristics of the geometry shape on the Printed Circuit Board (PCB) path by using the finite element method. Each PCB path shape is modeled according to its geometry and physical properties, then calculated for its electrical quantity and be observed for its performance at given current. Simulation and numerical calculations showed that the shape of trapezoidal and rounded geometry have lower resistance and planar inductance of 6.8% and 7.39% respectively than the right angle shape.

Phase Equilibria in Complex Solder Systems

1986 ◽  
Vol 72 ◽  
Author(s):  
M. R. Notis ◽  
S. K. Tarby ◽  
T. Cawley
Keyword(s):  
Phase Equilibria ◽  
Computer Aided Design ◽  
Printed Circuit Board ◽  
Eutectic Temperature ◽  
Ternary Eutectic ◽  
Circuit Board ◽  
Scanning Calorimetry ◽  
Printed Circuit ◽  
Aided Design ◽  
Ternary Eutectic Temperature

AbstractTernary solder alloys have come into wide use in chip bonding, printed circuit board connection, and in ceramic package sealing applications. Little is known concerning phase equilibria in many of these systems. Methods for predicting phase equilibria in the ternary (Pb+Sn)+Ag system using CAD (computer aided design) are described, and a predicted value for the ternary eutectic temperature is compared with values obtained by differential scanning calorimetry (DSC) for this system.

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