scholarly journals Void nucleation in spheroidized steels during tensile deformation

1980 ◽  
Author(s):  
Jr, J R Fisher
Keyword(s):  
Tensile Deformation ◽  
Void Nucleation

scholarly journals Void Nucleation, and Growth during Tensile Deformation of Nanoscale Precipitated Steel and Bainitic Steel

2019 ◽  
Vol 59 (7) ◽  
pp. 1362-1368
Author(s):  
Yasutaka Mugita ◽  
Masatoshi Aramaki ◽  
Masayuki Yamamoto ◽  
Akihisa Takeuchi ◽  
Miyuki Takeuchi ◽  
...  
Keyword(s):  
Tensile Deformation ◽  
Void Nucleation ◽  
Nucleation And Growth ◽  
Bainitic Steel ◽  
Void Nucleation And Growth

APPLICATION OF DAMAGE MODEL WITH MATERIAL FLOW EVALUATION TO HIGH TEMPERATURE COMPRESSION PROCESSES

2012 ◽  
Vol 26 (03) ◽  
pp. 1150012 ◽  
Author(s):  
CHANSEO JEONG ◽  
JUN YANAGIMOTO
Keyword(s):  
Material Flow ◽  
Tensile Deformation ◽  
Sintered Material ◽  
Cylindrical Specimen ◽  
Void Nucleation ◽  
Damage Model ◽  
Ductile Failure ◽  
Experimental Investigations ◽  
Compression Process ◽  
Gurson Model

Mechanisms of ductile failure in a compression process are studied, based on micro-structural considerations, with analytical and experimental investigations performed on a cylindrical specimen. Geometrical softening is able to occur by void if the shear band is generated inside of materials. The original Gurson model is used to analyze tensile deformation, and a modified Gurson model is proposed, which incorporates damage accumulation under shear and compression. This modified Gurson model is also applied to the void closure of sintered material under compression loading. However, the compressed materials must be considered in both the void nucleation and closure, because the void is nucleated and closed at a specific angle. The results of individual analyses of nucleation and closure do not agree with observations, but the analysis considered here, of both the nucleation and closure of a void, corresponds well with experimental results.

scholarly journals Examination of Tensile Deformation and Void Nucleation Behaviors of Duplex Stainless Steel Using Nano-Indentation Hardness Test

2014 ◽  
Vol 100 (10) ◽  
pp. 1261-1266 ◽  
Author(s):  
Masatoshi Aramaki ◽  
Satoshi Uchida ◽  
Kyono Yasuda ◽  
Makoto Oikawa ◽  
Osamu Furukimi
Keyword(s):  
Stainless Steel ◽  
Duplex Stainless Steel ◽  
Tensile Deformation ◽  
Void Nucleation ◽  
Hardness Test ◽  
Indentation Hardness ◽  
Nano Indentation

scholarly journals Void Nucleation, Growth, and Coalescence Observed by Synchrotron Radiation X-ray Laminography during Tensile Deformation of Fe–0.02 mass% N Alloy

2018 ◽  
Vol 58 (5) ◽  
pp. 943-951 ◽  
Author(s):  
Osamu Furukimi ◽  
Shun Harada ◽  
Yasutaka Mugita ◽  
Masatoshi Aramaki ◽  
Masayuki Yamamoto ◽  
...  
Keyword(s):  
Synchrotron Radiation ◽  
Tensile Deformation ◽  
Void Nucleation ◽  
X Ray ◽  
Nucleation Growth

scholarly journals VOID NUCLEATION AND GROWTH DURING TENSILE DEFORMATION IN STEEL

Fracture 84 ◽  
1984 ◽  
pp. 1287-1294 ◽  
Author(s):  
J.T. Barnby ◽  
C.J. Flavell ◽  
A.S. Nadkarni ◽  
Y.W. Shi
Keyword(s):  
Tensile Deformation ◽  
Void Nucleation ◽  
Nucleation And Growth ◽  
Void Nucleation And Growth

scholarly journals Void nucleation behavior of single-crystal high-purity iron specimens subjected to tensile deformation

2017 ◽  
Vol 701 ◽  
pp. 221-225 ◽  
Author(s):  
Osamu Furukimi ◽  
Chatcharit Kiattisaksri ◽  
Yuji Takeda ◽  
Masatoshi Aramaki ◽  
Satoshi Oue ◽  
...  
Keyword(s):  
Single Crystal ◽  
High Purity ◽  
Tensile Deformation ◽  
Void Nucleation ◽  
Nucleation Behavior ◽  
Purity Iron ◽  
High Purity Iron

TEM examination of 2014-SiC metal matrix composite

1988 ◽  
Vol 46 ◽  
pp. 726-727
Author(s):  
M. G. Burke ◽  
M. N. Gungor ◽  
P. K. Liaw
Keyword(s):  
Metal Matrix Composite ◽  
Metal Matrix Composites ◽  
Matrix Composite ◽  
Metal Matrix ◽  
Tensile Deformation ◽  
Microstructural Characterization ◽  
Thin Foil ◽  
Matrix Alloy ◽  
Matrix Composites ◽  
Ion Milling

Aluminum-based metal matrix composites offer unique combinations of high specific strength and high stiffness. The improvement in strength and stiffness is related to the particulate reinforcement and the particular matrix alloy chosen. In this way, the metal matrix composite can be tailored for specific materials applications. The microstructural characterization of metal matrix composites is thus important in the development of these materials. In this study, the structure of a p/m 2014-SiC particulate metal matrix composite has been examined after extrusion and tensile deformation.Thin-foil specimens of the 2014-20 vol.% SiCp metal matrix composite were prepared by dimpling to approximately 35 μm prior to ion-milling using a Gatan Dual Ion Mill equipped with a cold stage. These samples were then examined in a Philips 400T TEM/STEM operated at 120 kV. Two material conditions were evaluated: after extrusion (80:1); and after tensile deformation at 250°C.

In situ observations of electromigration induced void behavior

1995 ◽  
Vol 53 ◽  
pp. 244-245
Author(s):  
T. Marieb ◽  
J. C. Bravman ◽  
P. Flinn ◽  
D. Gardner ◽  
M. Madden
Keyword(s):  
Electron Microscopy ◽  
Void Nucleation ◽  
Plan View ◽  
Transmission Electron ◽  
Nucleation Sites ◽  
Microelectronics Industry ◽  
In Situ Observations ◽  
Backscatter Electron Detector ◽  
Voltage Scanning

Electromigration and stress voiding have been active areas of research in the microelectronics industry for many years. While accelerated testing of these phenomena has been performed for the last 25 years[1-2], only recently has the introduction of high voltage scanning electron microscopy (HVSEM) made possible in situ testing of realistic, passivated, full thickness samples at high resolution.With a combination of in situ HVSEM and post-testing transmission electron microscopy (TEM) , electromigration void nucleation sites in both normal polycrystalline and near-bamboo pure Al were investigated. The effect of the microstructure of the lines on the void motion was also studied.The HVSEM used was a slightly modified JEOL 1200 EX II scanning TEM with a backscatter electron detector placed above the sample[3]. To observe electromigration in situ the sample was heated and the line had current supplied to it to accelerate the voiding process. After testing lines were prepared for TEM by employing the plan-view wedge technique [6].

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