scholarly journals ANALYSIS OF THE HOT SPOT PROBLEM IN THE MPRE.

1966 ◽  
Author(s):  
M. E. LaVerne
Keyword(s):  
Hot Spot ◽  
Author(s):  
Mohit Kumar ◽  
Sonu Mittal ◽  
Md. Amir Khusru Akhtar

Background: This paper presents a novel Energy Efficient Clustering and Routing Algorithm (EECRA) for WSN. It is a clustering-based algorithm that minimizes energy dissipation in wireless sensor networks. The proposed algorithm takes into consideration energy conservation of the nodes through its inherent architecture and load balancing technique. In the proposed algorithm the role of inter-cluster transmission is not performed by gateways instead a chosen member node of respective cluster is responsible for data forwarding to another cluster or directly to the sink. Our algorithm eases out the load of the gateways by distributing the transmission load among chosen sensor node which acts as a relay node for inter-cluster communication for that round. Grievous simulations show that EECRA is better than PBCA and other algorithms in terms of energy consumption per round and network lifetime. Objective: The objective of this research lies in its inherent architecture and load balancing technique. The sole purpose of this clustering-based algorithm is that it minimizes energy dissipation in wireless sensor networks. Method: This algorithm is tested with 100 sensor nodes and 10 gateways deployed in the target area of 300m × 300m. The round assumed in this simulation is same as in LEACH. The performance metrics used for comparisons are (a) network lifetime of gateways and (b) energy consumption per round by gateways. Our algorithm gives superior result compared to LBC, EELBCA and PBCA. Fig 6 and Fig 7 shows the comparison between the algorithms. Results: The simulation was performed on MATLAB version R2012b. The performance of EECRA is compared with some existing algorithms like PBCA, EELBCA and LBCA. The comparative analysis shows that the proposed algorithm outperforms the other existing algorithms in terms of network lifetime and energy consumption. Conclusion: The novelty of this algorithm lies in the fact that the gateways are not responsible for inter-cluster forwarding, instead some sensor nodes are chosen in every cluster based on some cost function and they act as a relay node for data forwarding. Note the algorithm does not address the hot-spot problem. Our next endeavor will be to design an algorithm with consideration of hot-spot problem.


2020 ◽  
pp. 33-46
Author(s):  
A. Sariga ◽  
◽  
◽  
J. Uthayakumar

Wireless sensor network (WSN) is an integral part of IoT and Maximizing the network lifetime is a challenging task. Clustering is the most popular energy efficient technique which leads to increased lifetime stability and reduced energy consumption. Though clustering offers several advantages, it eventually raises the burden of CHs located in proximity to the Base Station (BS) in multi-hop data transmission which makes the CHs near BS die earlier than other CHs. This issue is termed as hot spot problem and unequal clustering protocols were introduced to handle it. Presently, some of the clustering protocols are developed using Type-2 Fuzzy Logic (T2FL) but none of them addresses hot spot problem. This paper presents a Type-2 Fuzzy Logic based Unequal Clustering Algorithm (T2FLUCA) for the elimination of hot spot problem and also for lifetime maximization of WSN. The proposed algorithm uses residual energy, distance to BS and node degree as input to T2FL to determine the probability of becoming CHs (PCH) and cluster size. For experimentation, T2FLUCA is tested on three different scenarios and the obtained results are compared with LEACH, TEEN, DEEC and EAUCF in terms of network lifetime, throughput and average energy consumption. The experimental results ensure that T2FLUCA outperforms state of art methods in a significant way.


Author(s):  
Eason Chen ◽  
Jeng Yuan Lai ◽  
Yu-Po Wang ◽  
C. S. Hsiao

With the evolving function integration and power consumption of high-end IC applications, thermal management has become one of the most important concerns of semiconductor designers. In particular, hot spot problem, in recent years, has turned into a popular topic in IC chip thermal management that it comes from the uneven power consumptions in various logical blocks and results in local high temperature that would increase IC chip failure risks. In this paper, thermal evaluations for hot spot impacts on Flip-Chip Ball Grid Array (FC-BGA) packages were presented using CFD modeling technique. The evaluation topics covered hot spot power density effects on substrate designs and heat sink module characterizations including passive heat sink and fan heat sink performance under various hot spot conditions. Finally, thermal suggestions were concluded for package designers to improve the substrate design in substrate via arrangements to effectively dissipate hot spot source. Also heat sink module performance was derived for different ratings of hot spots and external heat sink performance is obtained for the hot spot impact elimination.


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