scholarly journals PHOTOELASTIC ANALYSIS OF STRESS WAVES RESULTING FROM EXPLODING WIRES

1966 ◽  
Author(s):  
W.H. Thompson
Keyword(s):  
Stress Waves ◽  
Exploding Wires ◽  
Photoelastic Analysis

Photoelastic analysis of stress waves in building subjected to vertical impact under laboratory earthquake experiments

2009 ◽  
Vol 36 (9) ◽  
pp. 1150-1155 ◽  
Author(s):  
Ryoei Hayasi ◽  
Yoshiharu Masuda ◽  
Shozo Hashimoto ◽  
Shinhou Kuriyama
Keyword(s):  
Stress Waves ◽  
Photoelastic Analysis ◽  
Vertical Impact

Photoelastic Study of High-Frequency Stress Waves Propagating in Bars and Plates

1968 ◽  
Vol 35 (4) ◽  
pp. 747-753 ◽  
Author(s):  
J. A. Clark ◽  
A. J. Durelli ◽  
V. J. Parks
Keyword(s):  
High Frequency ◽  
Sine Wave ◽  
Stress Waves ◽  
Center Line ◽  
Stress Distributions ◽  
Variable Delay ◽  
Fine Grain ◽  
Photoelastic Analysis ◽  
Phase And Group Velocities ◽  
Group Velocities

This paper deals with the photoelastic analysis of stress waves in bars and plates subjected to damped sinusoidal loading. The device used to apply the loading is a piezoelectric transducer which produces about 10 cycles of a decaying sine wave. The wavelength of the stress wave which propagates along the square bar is comparable to the thickness of the bar. A strobotac, or a microflash, is used as light source flashing with a continuously variable delay. The isochromatics and isoclinics can be seen directly by eye as static patterns. More than 100 repetitions of illumination can be used, permitting the use of fine grain film. The specimens are relatively thick, but by using embedded polarizers and analyzers, two-dimensional solutions can be obtained. Good correlations with theoretical computations are shown for phase and group velocities. Stress distributions are determined along the center line and the edge of the bar.

Experimental analysis of high-frequency stress waves in a ring

1969 ◽  
Vol 4 (4) ◽  
pp. 297-305 ◽  
Author(s):  
A J Durelli ◽  
J A Clark ◽  
A Kochev
Keyword(s):  
High Frequency ◽  
Stress Waves ◽  
Stress Distributions ◽  
Principal Stresses ◽  
Tangential Stresses ◽  
Photoelastic Analysis ◽  
Photoelastic Data ◽  
Axis Of Symmetry ◽  
Capacitance Gauge

This paper deals with the photoelastic analysis of stress waves in a thick ring subjected to transient high-frequency loading. The device used to apply the loading is a piezo-electric transducer which initially produces four cycles of a 31·25 kHz toneburst. The loading pulse can be reproduced with high precision. The ring is illuminated with a flash of approximately 0·5 μs duration which can be delayed in a continuously adjustable manner. Isochromatics and isoclinics can be directly observed as static patterns. Photoelastic data are supplemented by measurements obtained with a capacitance gauge used as a dynamic lateral extensometer. Satisfactory agreement is found between tangential stresses near the free boundary of the ring determined from photoelastic data and those determined from capacitance-gauge measurements. As examples of complete determination of stress distributions, the separated principal stresses are obtained along an axis of symmetry and a vectorial representation of the principal stresses is given. A wave interpretation of the data is developed and comparisons are made with available solutions of related problems.

Study of cylindrical stress waves generated by exploding wires

1972 ◽  
Vol 12 (2) ◽  
pp. 104-106 ◽  
Author(s):  
J. L. Rose ◽  
P. C. Chou
Keyword(s):  
Stress Waves ◽  
Exploding Wires

Photoelastic Analysis of Biomechanical Behavior of Single and Multiple Fixed Partial Prostheses With Different Prosthetic Connections

2011 ◽  
Vol 22 (6) ◽  
pp. 2060-2063 ◽  
Author(s):  
Bianca Piccolotto Tonella ◽  
Eduardo Piza Pellizzer ◽  
Rosse Mary Falcón-Antenucci ◽  
Renato Ferraço ◽  
Daniel Augusto de Faria Almeida
Keyword(s):  
Biomechanical Behavior ◽  
Photoelastic Analysis

scholarly journals The Influence of Cement Layer Thickness on the Stress State of Metal Inlay Restorations—Photoelastic Analysis

Materials ◽  
2021 ◽  
Vol 14 (3) ◽  
pp. 599
Author(s):  
Grzegorz Sokolowski ◽  
Michal Krasowski ◽  
Agata Szczesio-Wlodarczyk ◽  
Bartlomiej Konieczny ◽  
Jerzy Sokolowski ◽  
...  
Keyword(s):  
Stress State ◽  
Layer Thickness ◽  
Resin Composite ◽  
Water Immersion ◽  
Cylindrical Sample ◽  
Resin Cement ◽  
Adhesive Resin ◽  
Cement Layer ◽  
Contraction Stress ◽  
Photoelastic Analysis

The successful restoration of teeth requires a good connection between the inlay and natural tissue. A strong bond may improve retention and reinforce tooth structure. The purpose of this study was to evaluate the influence of cement layer thickness on contraction stress generated during photopolymerization, and to determine the changes in stress state of the cement occurring during aging in water (over 84 days). Two cements were used: resin composite cement (NX3) and self-adhesive resin cement (Maxcem Elite Chroma). A cylindrical sample made of CuZn alloy was used to imitate the inlay. The stress state was measured by photoelastic analysis. The contraction stress of the inlay restoration was calculated for cement layer thicknesses of 25 µm, 100 µm, 200 µm, and 400 µm. For both tested materials, the lowest contraction stress was observed for the thinnest layer (25 µm), and this increased with thickness. Following water immersion, a significant reduction in contraction stress was observed due to hygroscopic expansion. Applying a thin layer (approximately 25 µm) of composite and self-adhesive resin cements resulted in high levels of expansion stresses (over −6 MPa) after water aging.

scholarly journals Design and Analysis of a Novel Piezoceramic Stack-based Smart Aggregate

Sensors ◽  
2020 ◽  
Vol 20 (22) ◽  
pp. 6438
Author(s):  
Guangtao Lu ◽  
Xin Zhu ◽  
Tao Wang ◽  
Zhiqiang Hao ◽  
Bohai Tan
Keyword(s):  
Resonance Frequency ◽  
Electromechanical Coupling ◽  
Structural Parameters ◽  
Electromechanical Coupling Factor ◽  
Coupling Factor ◽  
Stress Waves ◽  
Parallel Connection ◽  
Smart Aggregate ◽  
In Series ◽  
Piezoelectric Wafers

A novel piezoceramic stack-based smart aggregate (PiSSA) with piezoceramic wafers in series or parallel connection is developed to increase the efficiency and output performance over the conventional smart aggregate with only one piezoelectric patch. Due to the improvement, PiSSA is suitable for situations where the stress waves easily attenuate. In PiSSA, the piezoelectric wafers are electrically connected in series or parallel, and three types of piezoelectric wafers with different electrode patterns are designed for easy connection. Based on the theory of piezo-elasticity, a simplified one-dimensional model is derived to study the electromechanical, transmitting and sensing performance of PiSSAs with the wafers in series and parallel connection, and the model was verified by experiments. The theoretical results reveal that the first resonance frequency of PiSSAs in series and parallel decreases as the number or thickness of the PZT wafers increases, and the first electromechanical coupling factor increases firstly and then decrease gradually as the number or thickness increases. The results also show that both the first resonance frequency and the first electromechanical coupling factor of PiSSA in series and parallel change no more than 0.87% as the Young’s modulus of the epoxy increases from 0.5 to 1.5 times 3.2 GPa, which is helpful for the fabrication of PiSSAs. In addition, the displacement output of PiSSAs in parallel is about 2.18–22.49 times that in series at 1–50 kHz, while the voltage output of PiSSAs in parallel is much less than that in parallel, which indicates that PiSSA in parallel is much more suitable for working as an actuator to excite stress waves and PiSSA in series is suitable for working as a sensor to detect the waves. All the results demonstrate that the connecting type, number and thickness of the PZT wafers should be carefully selected to increase the efficiency and output of PiSSA actuators and sensors. This study contributes to providing a method to investigate the characteristics and optimize the structural parameters of the proposed PiSSAs.

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