scholarly journals DEVELOPMENT OF AN ELECTROLESS GOLD PLATING BATH. Completion Report

1963 ◽  
Author(s):  
B Luce
Keyword(s):  
Gold Plating ◽  
Plating Bath ◽  
Electroless Gold

scholarly journals Electroless deposition of Ni–P/Au coating on Cu substrate with improved corrosion resistance from Au(iii)–DMH based cyanide-free plating bath using hypophosphite as a reducing agent

RSC Advances ◽  
2021 ◽  
Vol 11 (62) ◽  
pp. 39153-39168
Author(s):  
Bo Wu ◽  
Baizhao Tan ◽  
Guizhen Tan ◽  
Ming Zeng ◽  
Jinyi Luo ◽  
...  
Keyword(s):  
Corrosion Resistance ◽  
Electroless Deposition ◽  
Reducing Agent ◽  
Gold Plating ◽  
Plating Bath ◽  
Cu Substrate ◽  
Black Pad ◽  
Electroless Gold

In the Au(iii)–DMH based cyanide-free electroless gold plating bath, the added hypophosphite inhibited the black pad and improved the corrosion resistance of the Cu/Ni–P/Au coating.

scholarly journals A Very Stable Non-cyanide Electroless Gold Plating Bath Using Thiourea and hydroquinone as a Cooperating Double Reductant System.

1998 ◽  
Vol 49 (12) ◽  
pp. 1298-1304 ◽  
Author(s):  
Takashi INOUE ◽  
Setsuo ANDO ◽  
Jiro USHIO ◽  
Hiroaki OKUDAIRA ◽  
Hiroko TAKEHARA ◽  
...  
Keyword(s):  
Gold Plating ◽  
Plating Bath ◽  
Electroless Gold

scholarly journals Electroless Gold Plating Using Erythorbic Acid as Reducing Agent

2006 ◽  
Vol 74 (6) ◽  
pp. 479-483 ◽  
Author(s):  
Tadashi KURASHINA ◽  
Hiroshi NISHINAKAYAMA ◽  
Norio KANEKO ◽  
Naoyuki SHINOHARA ◽  
Hidemi NAWAFUNE
Keyword(s):  
Reducing Agent ◽  
Gold Plating ◽  
Erythorbic Acid ◽  
Electroless Gold

ChemInform Abstract: SOME PRACTICAL ASPECTS OF ELECTROLESS GOLD PLATING

1974 ◽  
Vol 5 (15) ◽  
pp. no-no
Author(s):  
Y. OKINAKA ◽  
R. SARD ◽  
C. WOLOWODIUK ◽  
W. H. CRAFT ◽  
T. F. RETAJCZYK
Keyword(s):  
Gold Plating ◽  
Electroless Gold
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