scholarly journals Parametric study of compound semiconductor etching utilizing inductively coupled plasma source

1996 ◽  
Author(s):  
C. Constantine ◽  
D. Johnson ◽  
C. Barratt
1996 ◽  
Vol 421 ◽  
Author(s):  
C. Constantine ◽  
D. Johnson ◽  
C. Barratt ◽  
R. J. Shul ◽  
G. B. Mcclellan ◽  
...  

AbstractInductively Coupled Plasma (ICP) sources are extremely promising for large-area, highion density etching or deposition processes. In this review we compare results for GaAs and GaN etching with both ICP and Electron Cyclotron Resonance (ECR) sources on the same singlewafer platform. The ICP is shown to be capable of very high rates with excellent anisotropy for fabrication of GaAs vias or deep mesas in GaAs or GaN waveguide structures.


1978 ◽  
Vol 32 (6) ◽  
pp. 572-576 ◽  
Author(s):  
P. B. Zeeman ◽  
S. P. Terblanche ◽  
K. Visser ◽  
F. H. Hamm

In recent experiments with a 9.2 MHz inductively coupled plasma assembly air was used as cooling gas. The molecular N2+ band system appeared on the photographic plates taken in the first order of a 3.4 m Jarrell-Ash Ebert grating spectrograph. The rotational lines of this band system was used to evaluate the temperature of the plasma tail flame at various heights above the load coil. These varied from approximately 8000°K at 17 mm above the coil to 6400 at 41 mm.


1996 ◽  
Vol 143 (4) ◽  
pp. 1375-1383 ◽  
Author(s):  
Naoki Yamada ◽  
Peter L. G. Ventzek ◽  
Y. Sakai ◽  
H. Tagashira ◽  
K. Kitamori

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