scholarly journals Assessment of an ORION-based experimental platform for measuring the opacity of high-temperature and high-density plasma

2012 ◽  
Author(s):  
P Beiersdorfer ◽  
M Schneider ◽  
R Shepherd
Keyword(s):  
High Temperature ◽  
High Density ◽  
Experimental Platform ◽  
Density Plasma

High-Temperature, High-Density Plasma Production by Vortex-Ring Compression

1978 ◽  
Vol 41 (3) ◽  
pp. 166-170 ◽  
Author(s):  
D. R. Wells ◽  
J. Davidson ◽  
L. G. Phadke ◽  
J. G. Hirschberg ◽  
P. E. Ziajka ◽  
...  
Keyword(s):  
High Temperature ◽  
Vortex Ring ◽  
High Density ◽  
Plasma Production ◽  
Ring Compression ◽  
Density Plasma

Impact of Metal Pad Etch-Induced Plasma Damage on Dynamic Retention Time Degradation during High Temperature Stress in High Density DRAM Technology

2005 ◽  
Author(s):  
D-J Kim ◽  
I-G Kim ◽  
J-Y Noh ◽  
H-J Lee ◽  
S-H Park ◽  
...  
Keyword(s):  
High Temperature ◽  
Temperature Stress ◽  
Retention Time ◽  
High Temperature Stress ◽  
High Density ◽  
Cell Junction ◽  
Antenna Effect ◽  
Plasma Damage ◽  
Root Cause ◽  
Wafer Processing

Abstract As DRAM technology extends into 12-inch diameter wafer processing, plasma-induced wafer charging is a serious problem in DRAM volume manufacture. There are currently no comprehensive reports on the potential impact of plasma damage on high density DRAM reliability. In this paper, the possible effects of floating potential at the source/drain junction of cell transistor during high-field charge injection are reported, and regarded as high-priority issues to further understand charging damage during the metal pad etching. The degradation of block edge dynamic retention time during high temperature stress, not consistent with typical reliability degradation model, is analyzed. Additionally, in order to meet the satisfactory reliability level in volume manufacture of high density DRAM technology, the paper provides the guidelines with respect to plasma damage. Unlike conventional model as gate antenna effect, the cell junction damage by the exposure of dummy BL pad to plasma, was revealed as root cause.

Sign in / Sign up

Export Citation Format

Share Document