scholarly journals Fabrication of commercial-scale fiber-reinforced hot-gas filters by chemical vapor deposition

1992 ◽  
Author(s):  
L.R. White
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Fiber Reinforced ◽  
Hot Gas ◽  
Commercial Scale

Synthesis by plasma-enhanced chemical-vapor deposition and characterization of siliconlike films with hydrophobic functionalities for improved long-term geometric stability of fiber-reinforced polymers

2008 ◽  
Vol 23 (4) ◽  
pp. 1042-1050 ◽  
Author(s):  
A. Cremona ◽  
E. Vassallo ◽  
A. Merlo ◽  
A. Srikantha Phani ◽  
L. Laguardia
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
High Strength ◽  
Scratch Resistance ◽  
Fiber Reinforced Polymers ◽  
Fiber Reinforced ◽  
Water Contact ◽  
Fiber Failure

Amorphous siliconlike films with hydrophobic functionalities have been deposited by plasma-enhanced chemical-vapor deposition on carbon-fiber-reinforced polymer (CFRP) unidirectional laminates used for micromechanical applications where high strength-to-weight and high stiffness-to-weight ratios are required. To improve long-term geometrical stability in ultrahigh-precision machine structures, hydrophobic CFRP materials are desirable. Three layers have been grown with different plasma-process parameters from a mixture of hexamethyldisiloxane, O2, and Ar. Chemical composition, water contact angle, surface energy, morphology, and tribological properties have been evaluated to choose the one that best fulfills hydrophobicity, wear, and scratch resistance. Wear tests have also been carried out on CFRP laminates coated with a polyurethane layer to compare the wear performance of the above specimens with that of a conventional hydrophobic coating. Scanning electron microscope images show a very good adhesion of the films to the composite substrate because the failure of the film and of the substrate (such as fiber failure) take place simultaneously.

In situ study of electron beam-induced chemical vapor deposition of Au in an environmental TEM

1995 ◽  
Vol 53 ◽  
pp. 256-257
Author(s):  
J. Drucker ◽  
R. Sharma ◽  
J. Kouvetakis ◽  
K.H.J. Weiss
Keyword(s):  
Electron Beam ◽  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Quantum Effect ◽  
Line Drawing ◽  
Chemical Vapor ◽  
Environmental Cell ◽  
Engineering Changes ◽  
Kinetics Of

Patterning of metals is a key element in the fabrication of integrated microelectronics. For circuit repair and engineering changes constructive lithography, writing techniques, based on electron, ion or photon beam-induced decomposition of precursor molecule and its deposition on top of a structure have gained wide acceptance Recently, scanning probe techniques have been used for line drawing and wire growth of W on a silicon substrate for quantum effect devices. The kinetics of electron beam induced W deposition from WF6 gas has been studied by adsorbing the gas on SiO2 surface and measuring the growth in a TEM for various exposure times. Our environmental cell allows us to control not only electron exposure time but also the gas pressure flow and the temperature. We have studied the growth kinetics of Au Chemical vapor deposition (CVD), in situ, at different temperatures with/without the electron beam on highly clean Si surfaces in an environmental cell fitted inside a TEM column.

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