scholarly journals A finite element analysis of room temperature silicon crystals for the Advanced Photon Source bending-magnet and insertion-device beams

1994 ◽  
Author(s):  
L. Assoufid ◽  
W.K. Lee ◽  
D.M. Mills
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Room Temperature ◽  
Element Analysis ◽  
Silicon Crystals ◽  
Insertion Device ◽  
Photon Source

Finite Element Simulating of C/SiC Composite Bolt

2012 ◽  
Vol 268-270 ◽  
pp. 3-6
Author(s):  
Tao Huang ◽  
Yi Yan Zhang
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Elevated Temperature ◽  
Room Temperature ◽  
Engineering Application ◽  
Contact Friction ◽  
Element Analysis ◽  
Valuable Data ◽  
The Finite Element Analysis ◽  
Sic Composites

A numerical investigation was conducted to determine the mechanical behavior of C/SiC composites bolt under room temperature and elevated temperature. The influence of the contact friction coefficient on the stress and displacement was considered in the finite element analysis. The FEA results provided some valuable data for the engineering application of C/SiC composites bolt.

Analysis of Temperature Distribution on Warm Forming of Aluminum-Magnesium Alloy

2011 ◽  
Vol 264-265 ◽  
pp. 329-336 ◽  
Author(s):  
Fahrettin Ozturk ◽  
Mehmet A. Arslan
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Temperature Distribution ◽  
Magnesium Alloy ◽  
Room Temperature ◽  
Initial Temperature ◽  
Warm Forming ◽  
Mg Alloy ◽  
Element Analysis ◽  
Aluminum Magnesium Alloy

In this study, a temperature distribution of 5083-O aluminum-magnesium (Al-Mg) alloy is analyzed at various die and blank initial temperature conditions using finite element analysis approach. Temperature distribution results of the blank reveal that the dies must be heated to predetermined temperatures for successful warm forming, even the blank is kept at room temperature.

Finite Element Analysis and Mechanical Behavior of 316L Stainless Steel Processed by Room Temperature Rolling

2019 ◽  
Vol 969 ◽  
pp. 508-516 ◽  
Author(s):  
Rahul Singh ◽  
Surya Deo Yadav ◽  
Nikhil Malviya ◽  
Sunkulp Goel ◽  
R. Jayaganthan ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Finite Element Analysis ◽  
Finite Element ◽  
Stainless Steel ◽  
Austenitic Stainless Steel ◽  
Room Temperature ◽  
Magnetic Measurements ◽  
Solution Treatment ◽  
Element Analysis ◽  
Room Temperature Rolling

The present work deals with plastic deformation of 316L austenitic stainless steel (ASS) using room temperature rolling process. After solution treatment (annealing) as-received 316L ASS has been rolled for up to 90% of thickness reduction. To investigate the effect of processing on mechanical properties microstructural study, tensile and hardness tests have been conducted. The ultimate tensile strength has been improved from 767 MPa (before deformation) to 1420 MPa (after 90% deformation), and hardness value has been increased from 208 VHN (before deformation) to 449 VHN (after 90% reduction). Magnetic measurements and XRD characterization have been performed to confirm the formation of martensitic phase. Finite element analysis have also been simulated employing DEFORM-3D software to get the insight about deformation behavior. Keywords: Room temperature rolling, Finite Element Analysis, Mechanical properties, Austenitic stainless steel.

Direct Study of the Thermal Conductivity in Aluminum Nanowires

2009 ◽  
Vol 1221 ◽  
Author(s):  
Nenad Stojanovic ◽  
D.H.S. Maithripala ◽  
Jordan M. Berg ◽  
Mark Holtz
Keyword(s):  
Thermal Conductivity ◽  
Finite Element Analysis ◽  
Finite Element ◽  
Electrical Resistivity ◽  
Thermal Properties ◽  
Electron Transport ◽  
Theoretical Prediction ◽  
Room Temperature ◽  
Total Thermal Conductivity ◽  
Element Analysis

AbstractThermal conductivity and electrical resistivity of 1 μm long aluminum nanowires, 75, 100, and 150nm in width and 100nm thick, were measured at room temperature. The method consists of microfabricated electrothermal test devices and a model-based data processing approach using finite-element analysis (FEA). The electrical and thermal properties of the nanowires differ significantly from bulk values while electrical resistivity agrees well with theoretical prediction. Electron transport equation models, which adequately describe the resistivity data, consistently underestimate the thermal conductivity. Incorporating a phonon contribution of ˜ 21 W/m·K to the total thermal conductivity is found to accurately describe the measured values.

Measurement of Creep and Relaxation Behaviors of Wafer-Level CSP Assembly Using Moire´ Interferometry

2003 ◽  
Vol 125 (2) ◽  
pp. 282-288 ◽  
Author(s):  
Suk-Jin Ham ◽  
Soon-Bok Lee
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Real Time ◽  
Room Temperature ◽  
Moiré Interferometry ◽  
Moire Interferometry ◽  
Wafer Level ◽  
Element Analysis ◽  
The Real ◽  
Thermal Chamber

In this paper, the creep and relaxation behaviors of a wafer-level CSP assembly under two types of thermal loading conditions were investigated using high sensitivity moire´ interferometry. One is a thermal load from 100°C to room temperature and the other is from room temperature to 100°C. In the second case, the real-time technique was used to monitor and measure the shear deformations of solder joints and the warpage of the assembly during the test. For the real-time measurements of thermal deformations, a small-sized thermal chamber having an optical window was developed. In addition, the test results obtained from the moire´ interferometry measurements were compared with the predicted values obtained from finite element analysis. It is shown that the deformation values predicted from finite element analysis have a good agreement with those obtained from the tests.

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