When Doing Good May Backfire: Smallholder-Farmer Selection into Yield-Improvement Programs

2021 ◽  
Author(s):  
Utku Serhatli ◽  
Guillaume Roels
Keyword(s):  
Smallholder Farmer ◽  
Yield Improvement ◽  
Farmer Selection ◽  
Improvement Programs

scholarly journals Character Association Studies in Lowland Rice Cultivars of Bihar

2020 ◽  
pp. 31-39
Author(s):  
Nitesh Kushwaha ◽  
Ravi Kant ◽  
Rajesh Kumar ◽  
.` Nilanjaya ◽  
Digvijay Singh ◽  
...  
Keyword(s):  
Grain Yield ◽  
Association Studies ◽  
Block Design ◽  
Main Axis ◽  
Lowland Rice ◽  
Panicle Length ◽  
Root Volume ◽  
Yield Improvement ◽  
Grain Length ◽  
Improvement Programs

The present investigation was carried out with aim to deduce the association among different characters with grain yield, i.e. their mutual relation with help of correlation analysis as well as to identify the component trait which are directly or indirectly contributing to the yield. The experiment was carried out at Rice Breeding Section, Pusa, Samastipur in kharif, 2018 from June, 26 to December 28. Total of twenty-two lowland rice accessions were sown in Randomized complete Block design Fashion (R.C.B.D.), with three replications. Fifteen characters including grain yield were observed for the experiment and data was collected at respective stages. The correlation coefficient analysis revealed that grain length, root volume, panicle length of main axis, number of panicles per hill, showed positive significant correlation with grain yield per plant. Hence, emphasis should be given to these traits in selection process during yield improvement programs. Grain length, root volume, panicle length of main axis and leaf length showed high direct effect on grain yield per plant. Hence, selection based on these characters would be more effective for yield improvement.

Adaptation as Innovation: Lessons from Smallholder Farmer in Rainfed Karnataka

2017 ◽  
Author(s):  
Greeshma Hegde ◽  
Chandni Singh ◽  
Harpreet Kaur
Keyword(s):  
Smallholder Farmer

Defect Snap Shot: Quick Isolation and Mapping of Interconnect Defects for Backend Yield Improvement

2004 ◽  
Author(s):  
Jenny Fan ◽  
Dave Mark
Keyword(s):  
Metal Layer ◽  
Single Layer ◽  
Yield Improvement ◽  
Test Methodology ◽  
Process Complexity

Abstract Metal interconnect defects have become a more serious yield detractor as backend process complexity has increased from a single layer to about 10 layers. This paper introduces a test methodology to monitor and localize the metal defects based on FPGA products. The test patterns are generated for each metal layer. The results not only indicate the severity of defects for each metal layer, but also accurately isolate open/short defects.

In-Line Defect to Bitmap Signature Correlation: A Shortcut to Physical FA Results

2000 ◽  
Author(s):  
Julie Segal ◽  
Arman Sagatelian ◽  
Bob Hodgkins ◽  
Tom Ho ◽  
Ben Chu ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Integrated Circuit ◽  
Failure Mechanisms ◽  
Memory Devices ◽  
Line Defect ◽  
Yield Improvement ◽  
Electrical Test ◽  
Large Numbers ◽  
Improvement Process ◽  
Existing Data

Abstract Physical failure analysis (FA) of integrated circuit devices that fail electrical test is an important part of the yield improvement process. This article describes how the analysis of existing data from arrayed devices can be used to replace physical FA of some electrical test failures, and increase the value of physical FA results. The discussion is limited to pre-repair results. The key is to use classified bitmaps and determine which signature classification correlates to which type of in-line defect. Using this technique, physical failure mechanisms can be determined for large numbers of failures on a scale that would be unfeasible with de-processing and physical FA. If the bitmaps are classified, two-way correlation can be performed: in-line defect to bitmap failure, as well as bitmap signature to in-line defect. Results also demonstrate the value of analyzing memory devices failures, even those that can be repaired, to gain understanding of defect mechanisms.

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