Formation Sequence of Intermetallics and Kinetics of Reaction Layer Growth During Solid State Reaction between Titanium and Aluminum

2020 ◽  
Author(s):  
Amlan Kar ◽  
Satish V. Kailas ◽  
Satyam Suwas
Keyword(s):  
Solid State ◽  
Reaction Layer ◽  
Solid State Reaction ◽  
Layer Growth ◽  
Kinetics Of Reaction ◽  
Kinetics Of

Influence of Content of Ni and Ag on Microstructure and Joint Strength of Lead-Free Solder Joint with Sn-Ag-Cu-Ni-Ge

2007 ◽  
Vol 353-358 ◽  
pp. 2033-2036 ◽  
Author(s):  
Ikuo Shohji ◽  
Satoshi Tsunoda ◽  
Hirohiko Watanabe ◽  
Tatsuhiko Asai
Keyword(s):  
Reaction Layer ◽  
Joint Strength ◽  
Heat Exposure ◽  
Layer Growth ◽  
Lead Free ◽  
Joint Interface ◽  
Lead Free Solder ◽  
Free Solder ◽  
Kinetics Of ◽  
Soldered Joint

An influence of content of Ni and Ag in a Sn-Ag-Cu-Ni-Ge lead-free solder has been investigated on microstructure and joint strength of the soldered joint under heat exposure conditions. The growth kinetics of the reaction layer formed at the joint interface has been investigated, and the apparent activation energy of the reaction layer growth has been also examined. Moreover, the soldered joints with Sn-Ag and Sn-Ag-Cu solders were prepared and were compared with the joints with the Sn-Ag-Cu-Ni-Ge solders.

Kinetics of the solid state reaction between zinc oxide and aluminum oxide

1980 ◽  
Vol 11 (3) ◽  
pp. 455-461 ◽  
Author(s):  
K. Nagata ◽  
K. Sato ◽  
K. S. Goto
Keyword(s):  
Zinc Oxide ◽  
Solid State ◽  
Aluminum Oxide ◽  
Solid State Reaction ◽  
Kinetics Of
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