Transverse Uniaxial Composite Thermal Properties Data Base of Thermally Conductive Graphite Fibers with and without Contiguous Grown Graphite Fins

2013 ◽  
Author(s):  
Roger Gerzeski ◽  
Aaron Sprague ◽  
Tyler Cianciolo
2021 ◽  
Vol 16 (2) ◽  
pp. 042-047
Author(s):  
Yanfei Bian ◽  
SHI Jian-zhou ◽  
XIE Ming-jun ◽  
CAI Meng

Annealed pyrolytic graphite (APG) is a material with thermal conductivity of about 1500 W/(m·K). This property may enable the usage of APG’s thermal potential to develop highly thermally conductive composites for devices requiring effective thermal management. In this paper, APG has been encapsulated in aluminum by brazing, and the thermal properties of Al-APG composite baseplates were measured. The results show that the thermal conductivity of the Al-APG composite baseplates is about 620 W/(m·K), which is four times higher than the pure aluminum plate (152 W/(m·K)).


2007 ◽  
Vol 124-126 ◽  
pp. 1079-1082 ◽  
Author(s):  
Sung Ryong Kim ◽  
Dae Hoon Kim ◽  
Dong Ju Kim ◽  
Min Hyung Kim ◽  
Joung Man Park

Thermal properties of PEEK/silicon carbide(SiC) and PEEK/carbon fiber(CF) were investigated from ambient temperature up to 200°C measured by laser flash method. Thermal conductivity was increased from 0.29W/m-K without filler up to 2.4 W/m-K with at 50 volume % SiC and 3.1W/m-K with 40 volume % carbon fiber. Values from Nielsen theory that predicts thermal conductivity of two-phase system were compared to those obtained from experiment.


1990 ◽  
Vol 41 (8) ◽  
pp. 4961-4969 ◽  
Author(s):  
L. Piraux ◽  
V. Bayot ◽  
J. P. Issi ◽  
M. S. Dresselhaus ◽  
M. Endo ◽  
...  

Carbon ◽  
2014 ◽  
Vol 69 ◽  
pp. 424-436 ◽  
Author(s):  
Roger H. Gerzeski ◽  
Aaron Sprague ◽  
Jianjun Hu ◽  
Timothy S. Fisher

Nanoscale ◽  
2017 ◽  
Vol 9 (38) ◽  
pp. 14476-14485 ◽  
Author(s):  
Ying Li ◽  
Fan Xu ◽  
Zaishan Lin ◽  
Xianxian Sun ◽  
Qingyu Peng ◽  
...  

Graphene is ideal filler in nanocomposites due to its unique mechanical, electrical and thermal properties.


1989 ◽  
Vol 111 (3) ◽  
pp. 192-198 ◽  
Author(s):  
D. Suryanarayana

A survey was conducted on the physical properties of several new ceramic systems, such as carbides, borides, oxides, and nitrides, as they appeared in recent literature, and they are briefly reviewed. A few new ceramic materials, such as BeO, BN, AlN, and SiC-BeO, possess superior thermal properties when compared to the alumina (Al2O3) ceramics used in electronic packaging. Among these, the aluminum nitride (AlN) has emerged as unique material that can replace alumina in future electronic packaging for improved thermal performance and reliability.


Rare Metals ◽  
2013 ◽  
Vol 32 (1) ◽  
pp. 75-80 ◽  
Author(s):  
Hao-Ming Zhang ◽  
Xin-Bo He ◽  
Xuan-Hui Qu ◽  
Qian Liu ◽  
Xiao-Yu Shen

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