Modular Automated Test Equipment (MATE) 390 Enhancement Program

2000 ◽  
Author(s):  
David R. Carey
Keyword(s):  
Test Equipment ◽  
Automated Test Equipment ◽  
Automated Test

An Alternative to High-Temperature and Acid/Solvent-Based Methods for Removing Integrated Circuits from Ceramic or Other Problem Substrates

2005 ◽  
Author(s):  
Carl M. Nail
Keyword(s):  
High Temperature ◽  
Integrated Circuits ◽  
Success Rate ◽  
Mechanical Damage ◽  
Test Equipment ◽  
High Success Rate ◽  
Automated Test Equipment ◽  
Removal Method ◽  
Automated Test ◽  
Conventional Methods

Abstract Dice must often be removed from their packages and reassembled into more suitable packages for them to be tested in automated test equipment (ATE). Removing bare dice from their substrates using conventional methods poses risks for chemical, thermal, and/or mechanical damage. A new removal method is offered using metallography-based and parallel polishing-based techniques to remove the substrate while exposing the die to minimized risk for damage. This method has been tested and found to have a high success rate once the techniques are learned.

GaN 8Gbps High-Speed Relay MMIC for Automated Test Equipment

2021 ◽  
Vol 141 (8) ◽  
pp. 856-859
Author(s):  
Satoshi Koyama ◽  
Taku Sato ◽  
Jun'ichi Okayasu ◽  
Hideyuki Okabe ◽  
Masayuki Kimishima
Keyword(s):  
High Speed ◽  
Test Equipment ◽  
Automated Test Equipment ◽  
Automated Test
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