High Frequency Seismic Signal Propagation Studies

1986 ◽  
Author(s):  
Frode Ringdal
2020 ◽  
Vol 20 (16) ◽  
pp. 9417-9426
Author(s):  
Ahmad Darwish ◽  
Shady S. Refaat ◽  
Haitham Abu-Rub ◽  
Hamid A. Toliyat

2020 ◽  
Author(s):  
Aymeric Spiga ◽  
Naomi Murdoch ◽  
Don Banfield ◽  
Ralph Lorenz ◽  
Claire Newman ◽  
...  

<p>The InSight instrumentation for atmospheric science combines high frequency, high accuracy and continuity. This makes InSight a mission particularly suitable for studies of the variability in the Planetary Boundary Layer (PBL) of Mars -- all the more since this topic is of direct interest for quake detectability given that turbulence is the main contributor to atmosphere-induced seismic signal. For the strong daytime buoyancy-driven PBL convection, InSight significantly extends the statistics of dust-devil-like convective vortices and turbulent wind gustiness, both of which are of strong interest for aeolian science. For the moderate nighttime shear-induced PBL convection, InSight enables to explore phenomena and variability left unexplored by previous in-situ measurements on Mars. In both daytime and nighttime environments, how the gravity waves and infrasound signals discovered by InSight are being guided within the PBL is also a central topic to InSight's atmospheric investigations, with the tantalizing possibility to identify possible sources for those phenomena. InSight has been operating at the surface of Mars since 18 months, thus the seasonal evolution of the many phenomena occurring in the PBL will be an emphasis of this report. Comparisons with turbulence-resolving modeling such as Large-Eddy Simulations will be also discussed.</p>


2012 ◽  
Vol 2012 (1) ◽  
pp. 000239-000243
Author(s):  
Srinidhi Raghavan Narasimhan ◽  
A. Ege Engin

The 3D IC integration technology and silicon interposers rely on through silicon vias (TSVs) for vertical interconnections. Hence, the medium carrying high frequency signals is lossy silicon (Si). Fundamental understanding of wave propagation through TSVs is essential for successful implementation of 3D IC integration technology as well as for the development of Si interposers at RF/microwave frequencies. The focus of this paper is characterization and modelling of TSVs and Si to explore high speed signal propagation through the lossy Si medium. To understand better the physical significance of the TSV, we will establish a framework for wave propagation through TSVs based on dielectric quasi-TEM, skin effect, and slow-wave modes similar to MIS micro-strip lines. For validation of the existence of these modes, full wave simulation results will be compared with simpler two dimensional transmission line simulators.


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