Thermal Exposure of Ammunition on Board Ship. Part 4. Submarines

Introduction: the systems of thermal effects on thermo-dependent, viscous and highly viscous liquids under conditions of the Arctic and the Extreme North are considered. Low efficiency and danger of heating systems based on burned hydrocarbons, heated liquids and steam are shown. Electrothermal heating systems used to maintain thermo-dependent fluids in a fluid state are considered. The evaluation of the effectiveness of the application of the most common electrothermal system — heating cables (tapes). The most effective electrothermal system based on induction technologies has been determined. Materials and methods: considered methods of thermal exposure to maintain the fluid properties of thermo-dependent fluids at low extreme temperatures. Results: presents an induction heating system and options for its implementation in the Extreme North and the Arctic. Conclusions: induction heating system to minimize loss of product quality, improve the system performance under changing process conditions, eliminate fire product, to reduce the influence of the human factor.

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SYNTHESIS OF Sc3TaO7 COMPOUND AND MODELING THE MECHANISM OF PHASE TRANSFORMATIONS ON THERMAL EXPOSURE AND IRRADIATION BY XENON IONS

High Temperature Material Processes An International Quarterly of High-Technology Plasma Processes ◽

10.1615/hightempmatproc.2016017136 ◽

2016 ◽

Vol 20 (2) ◽

pp. 107-114

Author(s):

A. E. Solovyova

Keyword(s):

Phase Transformations ◽

Thermal Exposure

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Sample Preparation and Preservation for TEM Analysis of Copper Interconnect Integrated Circuit

ISTFA 2004: Conference Proceedings from the 30th International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2004p0640 ◽

2004 ◽

Author(s):

Qiang Gao ◽

Mark Zhang ◽

Ming Li ◽

Chorng Niou ◽

W.T. Kary Chien

Keyword(s):

Integrated Circuit ◽

Thermal Exposure ◽

Ambient Atmosphere ◽

Ion Milling ◽

Tem Analysis ◽

Single Beam ◽

Copper Interconnect ◽

Beam Modulation ◽

Area Of Interest ◽

Transmission Electron

Abstract This paper examines copper-interconnect integrated circuit transmission electron microscope (TEM) sample contamination. It investigates the deterioration of the sample during ion milling and storage and introduces prevention techniques. The paper discusses copper grain agglomeration issues barrier/seed step coverage checking. The high temperature needed for epoxy solidifying was found to be harmful to sidewall coverage checking of seed. Single beam modulation using a glass dummy can efficiently prevent contamination of the area of interest in a TEM sample during ion milling. Adoption of special low-temperature cure epoxy resin can greatly reduce thermal exposure of the sample and prevent severe agglomeration of copper seed on via sidewall. TEM samples containing copper will deteriorate when stored in ordinary driers and sulphur contamination was found at the deteriorated point on the sample. Isolation of the sample from the ambient atmosphere has been verified to be very effective in protecting the TEM sample from deterioration.

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