Risk Minimization by the use of Failure Mode Analysis in the Qualification of New Technology - Recent Project Experience relating to intelligent well completions, permanent downhole gauges, expandables and new sand control technologies.

2005 ◽  
Author(s):  
John Anthony Hother
Keyword(s):  
Failure Mode ◽  
New Technology ◽  
Mode Analysis ◽  
Risk Minimization ◽  
Sand Control ◽  
Failure Mode Analysis ◽  
Control Technologies ◽  
Recent Project ◽  
Well Completions

Case Study and Fault Modeling for Wrong Redundancy Evaluation on DRAM Devices

2007 ◽  
Author(s):  
Martin Versen ◽  
Dorina Diaconescu ◽  
Jerome Touzel
Keyword(s):  
Failure Mode ◽  
Failure Modes ◽  
Fault Modeling ◽  
Mode Analysis ◽  
Root Cause ◽  
Failure Mode Analysis

Abstract The characterization of failure modes of DRAM is often straight forward if array related hard failures with specific addresses for localization are concerned. The paper presents a case study of a bitline oriented failure mode connected to a redundancy evaluation in the DRAM periphery. The failure mode analysis and fault modeling focus both on the root-cause and on the test aspects of the problem.

Shear Bond Strength of Different Adhesive Systems to Primary Dentin and Enamel

2007 ◽  
Vol 31 (1) ◽  
pp. 35-40 ◽  
Author(s):  
Carla Miranda ◽  
Luiz Henrique Maykot Prates ◽  
Ricardo de Souza Vieira ◽  
Maria Cristina Marino Calvo
Keyword(s):  
Bond Strength ◽  
Failure Mode ◽  
Shear Bond Strength ◽  
Adhesive System ◽  
Mode Analysis ◽  
Single Bond ◽  
Adhesive Systems ◽  
Mean Values ◽  
Failure Mode Analysis ◽  
Distal Direction

The aims of this study were to evaluate the shear bond strength (SBS) of four adhesive systems applied to primary dentin and enamel and verify, after SBS testing, the failure mode of the adhesive interface. Sixty extracted sound primary molars were selected and crowns were sectioned in a mesial-distal direction. Specimens were randomly assigned into two groups (adhesion to enamel and adhesion to dentin) and then subdivided into four subgroups according to the adhesive system (n=15): Scotchbond Multi-Purpose (SMP) – Single Bond (SB) – Clearfil SE Bond (and Adper Prompt LPop (APL) – SBS tests were performed and the obtained values were statistically analyzed using ANOVA and Tukey tests (p<0.05). The failure mode analysis was performed with a Scanning Electron Microscope (XL-30, Philips). SBS mean values on enamel were [MPa (SD)]: SMP – 27.89 (7.49); SB – 23.92 (8.8); CSB – 24.36 (6.69); APL – 25.96 (4.08); and on dentin: SMP – 17.29 (4.25); SB – 18.2 (8.74); CSB – 16.13 (7.14); APL – 6.04 (3.35). The predominant failure mode was cohesive (primarily of the bonding agent). On enamel SBS was statistically similar for all four adhesives. On dentin SBS of APL was lower than the other tested adhesives.

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