Filter Cake Cleanup Using HCl/Glycolic Acid System

Author(s):  
S. M. Elkatatny ◽  
A. M. Al Moajil ◽  
H. A. Nasr-El-Din
2021 ◽  
Vol 11 (4) ◽  
pp. 1761-1780
Author(s):  
Nianyin Li ◽  
Fei Chen ◽  
Jiajie Yu ◽  
Peihong Han ◽  
Jia Kang

AbstractHydraulic fracturing is an important technical means to improve the development effect of low-permeability oil and gas reservoirs. However, for low pressure, low-permeability, tight, and high-clay sandstone gas reservoirs, conventional propped fracturing can cause serious damage to the reservoir and restrict the fracturing effect. The pre-acid fracturing technology combines acid treatment technology with sand-fracturing technology. A pre-acid system that meets special performance requirements is injected before fracturing. The pre-acid reduces the formation fracture pressure and removes clay damage. During acid flowback, the fracturing fluid is promoted to break the gel, dissolve the fracturing fluid residue and polymer filter cake, clean the supporting cracks, and effectively improve the fracturing effect. This study analyzes the process principle and technical advantages of the pre-acid fracturing technology based on the laboratory evaluation of the fracturing damage mechanism of low-permeability tight gas reservoirs. To meet the performance requirements of low-permeability tight gas reservoirs and pre-acid fracturing technology, a set of polyhydrogen acid system with long-lasting slow reactivity, low damage, and low corrosion was developed and used as the pre-fracturing acid. The acid system is mainly composed of the main agent SA601 and the auxiliary agent SA701. Then, on the basis of laboratory experiments, this acid system is used as the fracturing pre-acid to evaluate the fracturing improvement effect. The results show that the fracturing fluid system can better dissolve the fracturing fluid filter cake and remove the fracturing fluid damage.


2017 ◽  
Vol 70 (7) ◽  
pp. 937-945
Author(s):  
Jae Hoon Jeong ◽  
Byung Hwi Kim ◽  
Dae Hee Kim ◽  
Baek-kyu Kim ◽  
Chang Sik Pak ◽  
...  
Keyword(s):  

2019 ◽  
Vol 11 (20) ◽  
pp. 5715 ◽  
Author(s):  
Salaheldin Elkatatny

Removal of the oil-based filter cake is a complex task especially in horizontal and multilateral wells. The presence of oil makes the removal process more challenging because the oil coats the weighting materials and prevents acid–filter cake interaction. Therefore, different additives are required to change the wettability of the filter cake to enhance the removal efficiency. This paper introduces a new biodegradable acid system (NBAS) that can efficiently remove oil-based filter cake in horizontal and multilateral wells where calcium carbonate is used as a weighting agent. The new biodegradable acid system (NBAS) consists of 50 vol.% biodegradable acid and 5 vol.% mutual solvent, and the remaining percent is deionized water. High-pressure high-temperature (HPHT) filtration experiments were performed to evaluate the filter cake removal efficiency and the retained permeability. The filtration and removal experiments were conducted using real core samples (Indiana limestone and Berea sandstone) at a temperature of 212 °F and 300 psi differential pressure. Afterward, the NBAS was evaluated by measuring physical properties and conducting corrosion, compatibility, and thermal stability studies. The obtained results showed that the NBAS was compatible and thermally stable for more than 48 h at 212 °F and 300 psi. The NBAS has a density of 1.05 g/cm3, viscosity of 1.47 cP, and surface tension of 32 dynes/cm at room temperature. The corrosion rate of the developed system was 0.03 lb/ft2, which is acceptable according to oil and gas industry best practices. Removal experiments showed that the filter cake was completely removed from the core samples. For Berea sandstone, 100% of the permeability was regained, while the retained permeability for Indiana limestone was 122.5%, confirming the complete removal of external and internal filter cake as well as core samples stimulation. The new acid system can be considered as an efficient solution for oil-based filter cake removal that is biodegradable and cost-effective, where the reservoir permeability can be regained in one-stage only.


Author(s):  
T.W. Lee

Abstract WET ETCHING is an important part of the failure analysis of semiconductor devices. Analysis requires etches for the removal, delineation by decoration or differential etching, and study of defects in layers of various materials. Each lab usually has a collection of favored etch recipes. Some of these etches are available premixed from the fab chemical supply. Some of these etches may be unique, or even proprietary, to your company. Additionally, the lab etch recipe list will usually contain a variety of classical "named etches". These recipes, such as Dash Etch, have persisted over time. Although well-reported in the literature, lab lists may not accurately represent these recipes, or contain complete and accurate instructions for their use. Time seems to have erased the understanding of the purpose of additives such as iodine, in some of these formulas. To identify the best etches and techniques for a failure analysis operations, a targeted literature review of articles and patents was undertaken. It was a surprise to find that much of the work was quite old, and originally done with germanium. Later some of these etches were modified for silicon. Much of this work is still applicable today. Two main etch types were found. One is concerned with the thinning and chemical polishing of silicon. The other type is concerned with identifying defects in silicon. Many of the named etches were found to consist of variations in a specific acid system. The acid system has been well characterized with ternary diagrams and 3-D surfaces. The named etches were plotted on this diagram. The original formulas and applications of the named etches were traced to assure accuracy, so that the results claimed by the original authors, may be reproduced in today's lab. The purpose of this paper is to share the condensed information obtained during this literature search. Graphical data has been corrected for modem dimensions. Selectivities have been located and discussed. The contents of more than 25 named etches were spreadsheeted. It was concluded that the best approach to delineation is a two-step etch, using uncomplicated and well-characterized standard formulas. The first step uses a decoration or differential etch technique to define the junctions. Formulations for effective decoration etches were found to be surprisingly simple. The second step uses a selective etch to define the various interconnections and dielectric layers. Chromium compounds can be completely eliminated from these formulas, to meet environmental concerns. This work, originally consisting of 30 pages with 106 references, has been condensed to conform with the formatting requirements of this publication.


2013 ◽  
Vol 32 (5) ◽  
pp. 532-535
Author(s):  
Xin-xia WANG ◽  
Ya-ling LIN ◽  
Guo-qing ZHANG ◽  
Gui-chen ZHOU ◽  
Ying LU ◽  
...  

2013 ◽  
Vol 32 (9) ◽  
pp. 954-958
Author(s):  
Dong-juan XING ◽  
Wei-hua SONG ◽  
Shao-juan GONG ◽  
Ai-min XU ◽  
Xiao-wei LI ◽  
...  

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