scholarly journals Thermal Expansion and Electrical Conductivity of Perovskite Oxide (Ln1-xSrx)CoO3-.DELTA. (Ln=La, Nd and Sm)

2004 ◽  
Vol 112 (1306) ◽  
pp. 342-346 ◽  
Author(s):  
Katsuyoshi KAKINUMA ◽  
Tooru ARISAKA ◽  
Hiroshi YAMAMURA
Keyword(s):  
Electrical Conductivity ◽  
Thermal Expansion ◽  
Perovskite Oxide

Synthesis, structural and electrical conductivity of half-metallic perovskite oxide La2CrNiO6

2021 ◽  
Author(s):  
Tushar Kanti Bhowmik ◽  
Md Sariful Sheikh ◽  
Anup Pradhan Sakhya ◽  
Alo Dutta ◽  
T. P. Sinha
Keyword(s):  
Electrical Conductivity ◽  
Perovskite Oxide ◽  
Half Metallic

Effect of Interconnectivity of Nickel on Electrical and Thermal Properties of Alumina-Ni Interpenetrating Phase Composite

2011 ◽  
Vol 239-242 ◽  
pp. 2679-2682 ◽  
Author(s):  
Rub Nawaz Shahid ◽  
Bin Awais Hasan ◽  
Fahad Ali ◽  
Naeem Ul Haq Tariq
Keyword(s):  
Electrical Conductivity ◽  
Thermal Expansion ◽  
Thermal Properties ◽  
Impedance Spectroscopy ◽  
Electron Spectroscopy ◽  
Coefficient Of Thermal Expansion ◽  
Optimal Combination ◽  
Percolation Limit ◽  
Scanning Electron

In this work percolation range for Al2O3-Ni interpenetrating phase composite (IPC) was studied to find the optimal combination of electrical conductivity and coefficient of thermal expansion (CTE). The impedance spectroscopy and scanning electron spectroscopy were used to study the percolation limit.

Preparation of Expanded Graphite and Graphite Nanosheets for Improving Electrical Conductivity of Polyester Coating Films

2021 ◽  
Vol 21 (12) ◽  
pp. 5846-5858
Author(s):  
Yun Ding ◽  
Mingxia Tian ◽  
Aili Wang ◽  
Hengbo Yin
Keyword(s):  
Electrical Conductivity ◽  
Thermal Expansion ◽  
Milling Time ◽  
Expanded Graphite ◽  
Graphite Powder ◽  
Expandable Graphite ◽  
Coating Films ◽  
Natural Graphite ◽  
Graphite Nanosheets ◽  
Volumetric Rate

Expanded graphite and graphite nanosheets were facilely prepared by the thermal expansion of expandable graphite at 800 °C and sand milling of expanded graphite in water, respectively. When the expandable graphite precursor was prepared by the oxidation and intercalation of natural graphite (5 g) using KMnO4 (6 g) as an oxidant in a concentrated sulfuric acid solution (120 mL) at room temperature (25 °C) for 8 h, the expanded graphite with a maximum volumetric rate of 317 mL g−1 was prepared after the thermal expansion of the expandable graphite precursor at 800 °C for 60 s. The oxidation extent of natural graphite with KMnO4 is crucial for the preparation of expanded graphite. The thicknesses of graphite nanosheets decreased from 8.9 to 3.2 nm when the sand milling time of the expanded graphite in deionized water was prolonged from 6 to 24 h. The prolonging of the sand milling time not only decreased the layer number of the graphite nanosheet but also increased the d002 spacing due to the shocking and shearing forces. The addition of the expanded graphite powder and graphite nanosheets in a polyester paint efficiently improved the electrical conductivity of the resultant polyester coating films.

Structure, thermal expansion and electrical conductivity of La2–Gd NiO4+δ (0.0 ≤x≤ 0.6) cathode materials for SOFC applications

2021 ◽  
Vol 853 ◽  
pp. 156728 ◽  
Author(s):  
Viktor A. Tsvinkinberg ◽  
Anna S. Tolkacheva ◽  
Elena A. Filonova ◽  
Olga I. Gyrdasova ◽  
Sergey M. Pikalov ◽  
...  
Keyword(s):  
Electrical Conductivity ◽  
Thermal Expansion ◽  
Cathode Materials

Properties of Graphite Interconnect Circuit Boards with Anisotropic Thermal Expansion

1990 ◽  
Vol 216 ◽  
Author(s):  
J. Malamas ◽  
R.P. Bambha ◽  
J.B. Ramsey ◽  
W.C. Garrett ◽  
E.G. Kelso ◽  
...  
Keyword(s):  
Thin Films ◽  
Electrical Conductivity ◽  
Thermal Expansion ◽  
Focal Plane ◽  
Thermal Stresses ◽  
Focal Plane Arrays ◽  
Circuit Board ◽  
Circuit Boards ◽  
Anisotropic Thermal Expansion ◽  
Indium Bump

ABSTRACTWe report the investigation of an interconnect circuit board (ICB) with anisotropic thermal expansion for use with bump bonded, indirect hybrid, scanning focal plane arrays. This ICB is designed to reduce significantly the thermal stresses on the indium bump bonds during thermal cycling. Highly oriented pyrolitic graphite (HOPG) was chosen because its anisotropic thermal expansion meets the criteria for forming an indirect hybrid ICB using silicon processor circuits and mecury cadmium telluride detectors. Properties of HOPG influencing its performance as an ICB have been investigated including thermal expansion, electrical conductivity, durability, and adherence of electrically insulating thin films.

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