Fabrication of High Aspect Ratio Silicon Nanostructure with Sphere Lithography and Metal-Assisted Chemical Etching and its Wettability

2016 ◽  
Vol 10 (6) ◽  
pp. 971-976 ◽  
Author(s):  
Nobuyuki Moronuki ◽  
◽  
Nguyen Phan ◽  
Norito Keyaki ◽  
◽  
...  

Metal-assisted chemical etching (MACE) is a site-selective etching process produced by a catalyst reaction at the interface between noble metal and silicon. This paper aims to make clear the applicability of sphere lithography and MACE to the fabrication of high aspect ratio Si nanostructures. The capacity to control the etched profiles and the scale extension are investigated. First, silica particles (e.g. φ1 μm) were self-assembled on a Si substrate. After the reduction of particle size via argon ion bombardment, a gold layer was deposited using the particles as a mask. The substrate was then etched with a mixture of hydrofluoric acid and hydrogen peroxide. It was found that an array of nanopillars with a regular pitch, good separation, and an aspect ratio of about 52 was produced. The effects of MACE conditions on final profiles were clarified. A limitation of this approach is the small (several millimeters) area fabricated due to the dependence on the vacuum technique (ion bombardment, Au deposition), and the size of the area limits its practical applications. Thus, Ag nanoparticles (e.g. φ150 nm) were applied. The relationship between the concentration of the Ag suspension, the Ag assembled layer, and the morphology of MACE structures was made clear. A spray method was applied to extend the deposited area of Ag particles up to φ100 mm. Finally, the effects of the cross-sectional profile on the contact angle of a water droplet were examined. By applying a high aspect ratio nanostructure on the substrate, the water contact angle increased up to 153 degrees while that without the structure is 58 degrees.

RSC Advances ◽  
2017 ◽  
Vol 7 (71) ◽  
pp. 45101-45106 ◽  
Author(s):  
Gangqiang Dong ◽  
Yurong Zhou ◽  
Hailong Zhang ◽  
Fengzhen Liu ◽  
Guangyi Li ◽  
...  

High aspect ratio silicon nanowires (SiNWs) prepared by metal-assisted chemical etching were passivated by using catalytic chemical vapor deposition (Cat-CVD).


2012 ◽  
Vol 1512 ◽  
Author(s):  
Jian-Wei Ho ◽  
Qixun Wee ◽  
Jarrett Dumond ◽  
Li Zhang ◽  
Keyan Zang ◽  
...  

ABSTRACTA combinatory approach of Step-and-Flash Imprint Lithography (SFIL) and Metal-Assisted Chemical Etching (MacEtch) was used to generate near perfectly-ordered, high aspect ratio silicon nanowires (SiNWs) on 4" silicon wafers. The ordering and shapes of SiNWs depends only on the SFIL nanoimprinting mould used, thereby enabling arbitary SiNW patterns not possible with nanosphere and interference lithography (IL) to be generated. Very densely packed SiNWs with periodicity finer than that permitted by conventional photolithography can be produced. The height of SiNWs is, in turn, controlled by the etching duration. However, it was found that very high aspect ratio SiNWs tend to be bent during processing. Hexagonal arrays of SiNW with circular and hexagonal cross-sections of dimensions 200nm and less were produced using pillar and pore patterned SFIL moulds. In summary, this approach allows highlyordered SiNWs to be fabricated on a wafer-level basis suitable for semiconductor device manufacturing.


Micromachines ◽  
2020 ◽  
Vol 11 (4) ◽  
pp. 378 ◽  
Author(s):  
Hailiang Li ◽  
Changqing Xie

We report a robust, sidewall transfer metal assistant chemical etching scheme for fabricating Al2O3 nanotube arrays with an ultra-high aspect ratio. Electron beam lithography followed by low-temperature Au metal assisted chemical etching (MacEtch) is used to pattern high resolution, high aspect ratio, and vertical silicon nanostructures, used as a template. This template is subsequently transferred by an atomic layer deposition of the Al2O3 layer, followed by an annealing process, anisotropic dry etching of the Al2O3 layer, and a sacrificial silicon template. The process and characterization of the Al2O3 nanotube arrays are discussed in detail. Vertical Al2O3 nanotube arrays with line widths as small as 50 nm, heights of up to 21 μm, and aspect ratios up to 420:1 are fabricated on top of a silicon substrate. More importantly, such a sidewall transfer MacEtch approach is compatible with well-established silicon planar processes, and has the benefits of having a fully controllable linewidth and height, high reproducibility, and flexible design, making it attractive for a broad range of practical applications.


2014 ◽  
Vol 24 (12) ◽  
pp. 125026 ◽  
Author(s):  
Katherine Booker ◽  
Maureen Brauers ◽  
Erin Crisp ◽  
Shakir Rahman ◽  
Klaus Weber ◽  
...  

2021 ◽  
Author(s):  
Nurul Huda Abdul Razak ◽  
Nowshad Amin ◽  
Tiong Sieh Kiong ◽  
Kamaruzzaman Sopian ◽  
Md. Akhtaruzzaman

2018 ◽  
Vol 29 (21) ◽  
pp. 18178-18178 ◽  
Author(s):  
Indrajit V. Bagal ◽  
Muhammad Ali Johar ◽  
Mostafa Afifi Hassan ◽  
Aadil Waseem ◽  
Sang-Wan Ryu

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