scholarly journals Influence of Magnetic Agitation and Bubble Stirring on Electrodeposited Copper in an Acidic CuSO4 Solution

2021 ◽  
pp. ArticleID:210416
Author(s):  
Changlu Shan ◽  
Keyword(s):  
Cuso4 Solution

scholarly journals Features of the diamond films growth on the tungsten carbide surface by a copper underlayer

2019 ◽  
pp. 72-81
Author(s):  
D. S. Vokhmyanin ◽  
S. A. Oglezneva
Keyword(s):  
Surface Layer ◽  
Phase Composition ◽  
Hard Alloy ◽  
Diamond Film ◽  
Diamond Films ◽  
Surface Preparation ◽  
Growth Stages ◽  
Compressive Stresses ◽  
Diamond Crystals ◽  
Cuso4 Solution

Surface preparation is a prerequisite for ensuring the required properties of a diamond film obtained by gas-phase deposition. The paper considers the effect of temperature and concentration of the etchant CuSO4 on the structural and phase composition of the surface of hard-alloy materials. The structural and phase composition of a continuous polycrystalline diamond film at its growth stages was also studied. Adhesion of the obtained diamond films to the surface of carbide materials was qualitatively determined. It has been established that surface treatment of a hard alloy in a CuSO4 solution at a temperature t = 23 °C leads to unequal removal of the cobalt bond with chipping of WC grains and the formation of a porous structure in the surface layer of the WC–6%Co alloy. The treatment with an etchant CuSO4 at t = –2 °С ensures uniform etching of the Co-bond along the WC grain boundaries and the formation of a chemically uniform surface. The orientational growth and adhesion of the diamond film depend on the elemental composition of the surface of the WC–Co alloy after treatment with a CuSO4 solution. If the treatment was carried out at a tsolution = 23 °C, then during the synthesis of the diamond film, the removal of copper from the defective surface layer of WC is difficult. This provides the multidirectional growth of diamond crystals in the film in two directions: <111> and <110>, which causes critical biaxial compressive stresses (2,5 GPa) and leads to low adhesion of the film to the surface of the hard alloy. If the treatment was carried out at tsolution = –2 °C, then the orientational growth of diamond crystals in the film occurs in one preferential crystallographic direction <111>. It reduces the biaxial compressive stresses (1,7 GPa) and increases the adhesive adhesion of the film to the surface of the hard alloy . The structure defect, calculated from the ratio of the lines of integrated intensities I1333 / I1580 using the Raman spectroscopy, decreases with concentration growth for negative temperatures and increases for positive ones of CuSO4 solution during surface preparation.

Coulometric microrespirometry

1982 ◽  
Vol 243 (1) ◽  
pp. R185-R192
Author(s):  
A. A. Heusner ◽  
J. P. Hurley ◽  
R. Arbogast
Keyword(s):  
Closed System ◽  
Unit Volume ◽  
O2 Consumption ◽  
Comparative Physiology ◽  
Organ Cultures ◽  
Temperature Range ◽  
Metabolic Studies ◽  
Upper Limit ◽  
Cuso4 Solution ◽  
Better Than

Capacitive coulometry is based on the automatic quantitative replacement of O2 consumed by an animal in a closed system with electrolytic O2, produced by discharging a capacitor through a CuSO4 solution. The sensitivity of the device is better than 0.1 nl. The unit volume of O2 produced (1 nl) is both accurate and precise within 1% in a temperature range from 2.8 to 40 degrees C. The upper limit of recordable O2 consumption is 1 ml/h. The microrespirometer can be autoclaved, making the technique ideally suited for metabolic studies in microbiology, cell and organ cultures, and comparative physiology.

The formation of patterns of electrochemical deposits in an ultra-thin layer of CuSO4 solution

2007 ◽  
Vol 611 (1-2) ◽  
pp. 169-174 ◽  
Author(s):  
G.W. Yu ◽  
J.Y. Wang ◽  
D. Liu ◽  
H. Liu
Keyword(s):  
Thin Layer ◽  
Cuso4 Solution

Ultrasonic crystallizer of CuSO4 solution: Engineering simulation

2013 ◽  
Vol 86 (7) ◽  
pp. 1141-1145
Author(s):  
V. Ya. Kats ◽  
G. Mazor ◽  
S. Kats ◽  
B. M. Tarakanov
Keyword(s):  
Cuso4 Solution

scholarly journals Research of the characteristics of particles obtained by treating of CuSO4 solution by the contact nonequilibrium plasma

2015 ◽  
Vol 6 (7(26)) ◽  
pp. 36
Author(s):  
Ольга Вячеславовна Сергеева ◽  
Александр Андреевич Пивоваров
Keyword(s):  
Nonequilibrium Plasma ◽  
Cuso4 Solution

Electrodeposition of submicron/nanoscale Cu2O/Cu junctions in an ultrathin CuSO4 solution layer

2010 ◽  
Vol 638 (2) ◽  
pp. 225-230 ◽  
Author(s):  
Guangwei Yu ◽  
Xiaobo Hu ◽  
Duo Liu ◽  
Daliang Sun ◽  
Jing Li ◽  
...  
Keyword(s):  
Solution Layer ◽  
Cuso4 Solution

Copper dissolution phenomena along a vertical plane anode in CuSO4 solution

2001 ◽  
Vol 46 (5) ◽  
pp. 681-690 ◽  
Author(s):  
Y. Konishi ◽  
Y. Tanaka ◽  
Y. Kondo ◽  
Y. Fukunaka
Keyword(s):  
Vertical Plane ◽  
Copper Dissolution ◽  
Cuso4 Solution

Nucleation and growth of Cu onto polycrystalline Pt electrode from acidic CuSO4 solution in the presence of H2SeO3

2005 ◽  
Vol 10 (7) ◽  
pp. 447-457 ◽  
Author(s):  
Dijana Šimkūnaitė ◽  
Emilija Ivaškevič ◽  
Aleksandras Kaliničenko ◽  
Antanas Steponavičius
Keyword(s):  
Nucleation And Growth ◽  
Pt Electrode ◽  
Cuso4 Solution

Deposition of Cu onto polycrystalline Pt electrode from acidic CuSO4 solution in the presence of H2SeO3

2003 ◽  
Vol 81 (6) ◽  
pp. 199-206 ◽  
Author(s):  
Dijana Šimkūnaitė ◽  
Antanas Steponavičius ◽  
Vitalija Jasulaitienė ◽  
Eimutis Matulionis
Keyword(s):  
Pt Electrode ◽  
Cuso4 Solution
Sign in / Sign up

Export Citation Format

Share Document