scholarly journals Generation of Sn Whiskers During Electrodeposition

2019 ◽  
pp. 625-633 ◽  
Author(s):  
M Saitou ◽  
Keyword(s):  
Sn Whiskers

Growth of Sn whiskers after low temperature implantation of 20 keV He or H

1987 ◽  
Vol 19-20 ◽  
pp. 185-189 ◽  
Author(s):  
D.B. Poker ◽  
J. Schubert ◽  
A. Alexandrou ◽  
J. Froehlingsdorf ◽  
B. Stritzker
Keyword(s):  
Low Temperature ◽  
Sn Whiskers

Sn-whiskers: truths and myths

2007 ◽  
pp. 283-305 ◽  
Author(s):  
J. W. Osenbach ◽  
J. M. DeLucca ◽  
B. D. Potteiger ◽  
A. Amin ◽  
F. A. Baiocchi
Keyword(s):  
Sn Whiskers

Effect of Environment on Sn Whisker Growth during Welding of Electronic Wires

2015 ◽  
Vol 1110 ◽  
pp. 235-240 ◽  
Author(s):  
Tomomi Sakakida ◽  
Tatsuo Kubouchi ◽  
Yasuyuki Miyano ◽  
Mamoru Takahashi ◽  
Osamu Kamiya
Keyword(s):  
Energy Balance ◽  
Weld Metal ◽  
Whisker Growth ◽  
Weld Zone ◽  
Electrolytic Capacitor ◽  
Sn Whisker ◽  
Sn Whiskers ◽  
Weld Metal Microstructure ◽  
Short Circuits ◽  
Metal Microstructure

In Pb-free Al-Sn welding of electrolytic parts, single-crystal Sn whiskers easily form and can cause problems such as short circuits. Here we report that the growth of Sn whiskers in the weld zone of Al electrolytic condenser leads was suppressed in a vacuum environment. We examined the effect of the environment and weld metal microstructure in order to understand how to control and prevent whisker growth. In vacuum, the weld zone did not form whiskers after more than 100 h, whereas in air, whiskers grew within several hours. This suggests that whiskers require oxygen to form. The growth can be explained by the energy balance between the potential energy of the weld metal and the surface energy of the whisker. Our results will contribute to developing techniques for suppressing the formation of Sn whiskers during the percussion welding of Al electrolytic capacitor leads.

Lead free packaging and Sn-whiskers

2004 ◽  
Author(s):  
J.W. Osenbach ◽  
R.L. Shook ◽  
B.T. Vaccaro ◽  
B.D. Potteiger ◽  
A. Amin ◽  
...  
Keyword(s):  
Lead Free ◽  
Sn Whiskers

Intermetallics-induced directional growth of Sn whiskers in Sn-3.5Ag coating on Al substrate

2021 ◽  
Vol 539 ◽  
pp. 148135
Author(s):  
Shuang Tian ◽  
Yushuang Liu ◽  
Qiang Ma ◽  
Peigen Zhang ◽  
Jian Zhou ◽  
...  
Keyword(s):  
Directional Growth ◽  
Sn Whiskers

Methods for fast, reliable growth of Sn whiskers

2016 ◽  
Vol 652 ◽  
pp. 355-366 ◽  
Author(s):  
M.J. Bozack ◽  
S.K. Snipes ◽  
G.N. Flowers
Keyword(s):  
Sn Whiskers

scholarly journals Plastic deformation processes in Cu/Sn bimetallic films

2008 ◽  
Vol 23 (11) ◽  
pp. 2916-2934 ◽  
Author(s):  
K.S. Kumar ◽  
L. Reinbold ◽  
A.F. Bower ◽  
E. Chason
Keyword(s):  
Plastic Deformation ◽  
Subgrain Boundary ◽  
Dislocation Motion ◽  
Whisker Formation ◽  
Sn Whiskers ◽  
Direct Observations ◽  
Transmission Electron ◽  
Pile Up ◽  
Deformation Processes ◽  
Bimetallic Films

Although the driving force for the growth of Sn whiskers from the surface of Sn coatings on copper is thought to be internally generated stress due to the formation of Cu6Sn5 at the Cu/Sn interface, little is known about the nature of this internal stress and how it cracks the surface Sn oxide (an important precursor to whisker formation). Arguments based on elasticity alone do not appear to be sufficient and suggest an important role for plastic deformation. Direct observations, made by transmission electron microscopy of cross-sectioned bimetallic Cu/Sn thin-film specimens, confirm plastic deformation of the Sn grains due to the formation of Cu6Sn5. Dislocation motion and pile-up at the surface Sn oxide, rotation associated with subgrain boundary formation, interaction of the subgrain boundaries with the Sn surface, and diffusional processes are various mechanisms that can produce stress at the Sn surface and crack the Sn oxide.

Sn-whiskers: truths and myths

2006 ◽  
Vol 18 (1-3) ◽  
pp. 283-305 ◽  
Author(s):  
J. W. Osenbach ◽  
J. M. DeLucca ◽  
B. D. Potteiger ◽  
A. Amin ◽  
F. A. Baiocchi
Keyword(s):  
Sn Whiskers
Sign in / Sign up

Export Citation Format

Share Document