scholarly journals New Approaches for Protecting the Computer and Electronic Devices Against Heat Dissipation

2021 ◽  
Vol 11 (3) ◽  
pp. 279-284
Author(s):  
Driss Meddah Medjahed ◽  
Giulio Lorenzini ◽  
Redha Rebhi ◽  
Hijaz Ahmad ◽  
Younes Menni

This research is based on an experimental investigation of four different types of heatsinks, which was backed up by a simulation analysis. The goal of this study is to determine the relevance of various heatsink forms and sizes, as well as to enhance the best situation. The cooling strength of these heatsinks was next investigated experimentally and then numerically, while adjusting in the same initial conditions, finding in principle that the experimental and numerical results agree, with a contrast ratio of less than 10.24%. As a consequence, we concluded that the coolant D3, which is circular and has a heat resistance of 0.582 K. W-1, is stronger than the D2 compact circular cooler, which has a resistance of 0.590 K. W-1. These two varieties were far superior to the regular D1 heatsink, which first debuted in the early days of computers and had a resistance of 0.595 K. W-1, but the best was the mixed engineering D4 heatsink, which had a heat resistance of 0.50 K. W-1. Changes were also made to the geometry of the best heatsink D4, by varying its heights (28, 23, 19, and 15 mm). The heat resistors were arranged in sequence (0.50, 0.560, 0.568, 0.586 kg/s), and the weights were arranger in order (3.12N, 2.56N, 2.11N and 1.67N).

2021 ◽  
Vol 11 (12) ◽  
pp. 5705
Author(s):  
Adrian Stuparu ◽  
Romeo Susan-Resiga ◽  
Alin Bosioc

The present study examines the possibility of using an industrial stirred chemical reactor, originally employed for liquid–liquid mixtures, for operating with two-phase liquid–solid suspensions. It is critical when obtaining a high-quality chemical product that the solid phase remains suspended in the liquid phase long enough that the chemical reaction takes place. The impeller was designed for the preparation of a chemical product with a prescribed composition. The present study aims at finding, using a numerical simulation analysis, if the performance of the original impeller is suitable for obtaining a new chemical product with a different composition. The Eulerian multiphase model was employed along with the renormalization (RNG) k-ε turbulence model to simulate liquid–solid flow with a free surface in a stirred tank. A sliding-mesh approach was used to model the impeller rotation with the commercial CFD code, FLUENT. The results obtained underline that 25% to 40% of the solid phase is sedimented on the lower part of the reactor, depending on the initial conditions. It results that the impeller does not perform as needed; hence, the suspension time of the solid phase is not long enough for the chemical reaction to be properly completed.


2003 ◽  
Vol 14 (07) ◽  
pp. 963-971 ◽  
Author(s):  
E. AHMED ◽  
A. S. HEGAZI ◽  
A. S. ELGAZZAR

The Sato–Crutchfield equations are analytically and numerically studied. The Sato–Crutchfield formulation corresponds to losing memory. Then the Sato–Crutchfield formulation is applied for some different types of games including hawk–dove, prisoner's dilemma and the battle of the sexes games. The Sato–Crutchfield formulation is found not to affect the evolutionarily stable strategy of the ordinary games. But choosing a strategy becomes purely random, independent of the previous experiences, initial conditions, and the rules of the game itself. The Sato–Crutchfield formulation for the prisoner's dilemma game can be considered as a theoretical explanation for the existence of cooperation in a population of defectors.


Author(s):  
Zhuo Cui

This paper presents the effects of heat dissipation performance of pin fins with different heat sink structures. The heat dissipation performance of two types of pin fin arrays heat sink are compared through measuring their heat resistance and the average Nusselt number in different cooling water flow. The temperature of cpu chip is monitored to determine the temperature is in the normal range of working temperature. The cooling water flow is in the range of 0.02L/s to 0.15L/s. It’s found that the increase of pin fins in the corner region effectively reduce the temperature of heat sink and cpu chip. The new type of pin fin arrays increase convection heat transfer coefficient and reduce heat resistance of heat sink.


1996 ◽  
Vol 118 (1) ◽  
pp. 164-172 ◽  
Author(s):  
C. H. Amon ◽  
K. S. Schmaltz ◽  
R. Merz ◽  
F. B. Prinz

A molten metal droplet landing and bonding to a solid substrate is investigated with combined analytical, numerical, and experimental techniques. This research supports a novel, thermal spray shape deposition process, referred to as microcasting, capable of rapidly manufacturing near netshape, steel objects. Metallurgical bonding between the impacting droplet and the previous deposition layer improves the strength and material property continuity between the layers, producing high-quality metal objects. A thorough understanding of the interface heat transfer process is needed to optimize the microcast object properties by minimizing the impacting droplet temperature necessary for superficial substrate remelting, while controlling substrate and deposit material cooling rates, remelt depths, and residual thermal stresses. A mixed Lagrangian–Eulerian numerical model is developed to calculate substrate remelting and temperature histories for investigating the required deposition temperatures and the effect of operating conditions on remelting. Experimental and analytical approaches are used to determine initial conditions for the numerical simulations, to verify the numerical accuracy, and to identify the resultant microstructures. Numerical results indicate that droplet to substrate conduction is the dominant heat transfer mode during remelting and solidification. Furthermore, a highly time-dependent heat transfer coefficient at the droplet/substrate interface necessitates a combined numerical model of the droplet and substrate for accurate predictions of the substrate remelting. The remelting depth and cooling rate numerical results are also verified by optical metallography, and compare well with both the analytical solution for the initial deposition period and the temperature measurements during droplet solidification.


2021 ◽  
Author(s):  
Guilin Liu ◽  
Jing Liu

Abstract The increasingly high power density of today's electronic devices requires the cooling techniques to produce highly effective heat dissipation performance with as little sacrifice as possible to the system compactness. Among the currently available thermal management schemes, the convective liquid metal cooling provides considerably high performance due to their unique thermal properties. This paper firstly reviews the studies on convective cooling using low-melting-point metals published in the past few decades. A group of equations for the thermophysical properties of In-Ga-Sn eutectic alloy is then documented by rigorous literature examination, following by a section of correlations for the heat transfer and flow resistance calculation to partially facilitate the designing work at the current stage. The urgent need to investigate the heat transfer and flow resistance of forced convection of low-melting-point metals in small/mini-channels, typical in compact electronic devices, is carefully argued. Some special aspects pertaining to the practical application of this cooling technique, including the entrance effect, mixed convection, and compact liquid metal heat exchanger design, are also discussed. Finally, future challenges and prospects are outlined.


Author(s):  
Patrick W. Wilkerson ◽  
Andrzej J. Przekwas ◽  
Chung-Lung Chen

Multiscale multiphysics simulations were performed to analyze wirebonds for power electronic devices. Modern power-electronic devices can be subjected to extreme electrical and thermal conditions. Fully coupled electro-thermo-mechanical simulations were performed utilizing CFDRC’s CFD-ACE+ multiphysics simulation software and scripting capabilities. Use of such integrated multiscale multiphysics simulation and design tools in the design process can cut cost, shorten product development cycle time, and result in optimal designs. The parametrically designed multiscale multiphysics simulations performed allowed for a streamlined parametric analysis of the electrical, thermal, and mechanical effects on the wirebond geometry, bonding sites and power electronic device geometry. Multiscale analysis allowed for full device thermo-mechanical analysis as well as detailed analysis of wirebond structures. The multiscale simulations were parametrically scripted allowing for parametric simulations of the device and wirebond geometry as well as all other simulation variables. Analysis of heat dissipation from heat generated in the power-electronic device and through Joule heating were analyzed. The multiphysics analysis allowed for investigation of the location and magnitude of stress concentrations in the wirebond and device. These stress concentrations are not only investigated for the deformed wirebond itself, but additionally at the wirebond bonding sites and contacts. Changes in the wirebond geometry and bonding geometry, easily changed through the parametrically designed simulation scripts, allows for investigation of various wirebond geometries and operating conditions.


Author(s):  
Johannes W. Koopman ◽  
Peter Griebel ◽  
Christoph Hassa

The flow in a three sector model, representing a segment of an annular rich quench lean combustor for an aeroengine is investigated. Detailed knowledge of flow, temperature and species concentration distributions is of decisive importance to control the NOx formation, essential to the RQL concept. Velocities, temperatures and species concentrations are measured. They are partly used to aquire data on the inlet boundaries in the numerical calculation and partly used to compare with the numerical results. The calculation reveals many details which are not accesable in the experiment. It also shows the effects of the specific inlet dataset. Experimental data and numerical results furnish complementary information.


2001 ◽  
Vol 7 (3) ◽  
pp. 253-282 ◽  
Author(s):  
Ch. Srinivasa Rao ◽  
P. L. Sachdev ◽  
Mythily Ramaswamy

The nonlinear ordinary differential equation resulting from the self-similar reduction of a generalized Burgers equation with nonlinear damping is studied in some detail. Assuming initial conditions at the origin we observe a wide variety of solutions – (positive) single hump, unbounded or those with a finite zero. The existence and nonexistence of positive bounded solutions with different types of decay (exponential or algebraic) to zero at infinity for specific parameter ranges are proved.


2021 ◽  
Author(s):  
Hai Zhou ◽  
Haiping Wu ◽  
Jian Xu ◽  
Hongbin Fang

Abstract Origami-inspired structures and materials have shown remarkable properties and performances originating from the intricate geometries of folding. Origami folding could be a dynamic process and origami structures could possess rich dynamic characteristics under external excitations. However, the current state of dynamics of origami has mostly focused on the dynamics of a single cell. This research has performed numerical simulations on multi-stable dual-cell series Miura-Ori structures with different types of inter-cell connections based on a dynamic model that does not neglect in-plane mass. We introduce a concept of equivalent constraint stiffness k* to distinguish different types of inter-cell connections. Results of numerical simulations reveal the multi-stable dual-cell structure will exhibit a variety of complex nonlinear dynamic responses with the increasing of connection stiffness because of the deeper energy well it has. The connection stiffness has a strong effect on the steady-state dynamic responses under different excitation amplitudes and a variety of initial conditions. This effect makes us able to adjust the dynamic behaviors of dual-cell series Miura-Ori structure to our needs in a complex environment. Furthermore, the results of this research could provide us a theoretical basis for the dynamics of origami folding and serve as guidelines for designing dynamic applications of origami metastructures and metamaterials.


Sign in / Sign up

Export Citation Format

Share Document