Colloidal processing of PMN-PT thick films for piezoelectric sensor applications

2021 ◽  
Author(s):  
Hongyu Luo
Keyword(s):  
Thick Films ◽  
Piezoelectric Sensor ◽  
Colloidal Processing ◽  
Sensor Applications

High-performance, high-temperature piezoelectric BiB3O6 crystals

2015 ◽  
Vol 3 (2) ◽  
pp. 329-338 ◽  
Author(s):  
Fapeng Yu ◽  
Qingming Lu ◽  
Shujun Zhang ◽  
Hewei Wang ◽  
Xiufeng Cheng ◽  
...  
Keyword(s):  
High Temperature ◽  
High Performance ◽  
Piezoelectric Properties ◽  
Temperature Stability ◽  
Piezoelectric Sensor ◽  
High Temperature Stability ◽  
Sensor Applications

BiB3O6 crystals possess large piezoelectric coefficients and high-temperature stability of their piezoelectric properties, which is promising for piezoelectric sensor applications.

scholarly journals Microstructural Characterization of Thick PZT films on Cu Foils Deposited by Electrophoresis

2008 ◽  
Vol 14 (S3) ◽  
pp. 23-26 ◽  
Author(s):  
Aiying Wu ◽  
P.M. Vilarinho ◽  
A.I. Kingon ◽  
I. Reaney
Keyword(s):  
Printed Circuit Boards ◽  
Mechanical Response ◽  
Thick Films ◽  
Microstructural Characterization ◽  
Circuit Boards ◽  
Sensor Applications ◽  
Device Reliability ◽  
Device Structures ◽  
Pzt Films ◽  
Pyroelectric Detectors

Piezoelectric and electrostrictive responses in poled and unpoled ferroelectric and relaxor ferroelectric compositions are of importance in transducers for converting electrical to mechanical impulses and vice-versa. Sensor applications make use of the very high piezoelectric constant dijk of the converse effect, which also permit efficient conversion of electrical to mechanical response. One of the most important families of materials for piezoelectric applications is Pb(Zr,Ti)O3(PZT). The most widely studied composition of PZT lies at the boundary between the tetragonal and rhombohedral phases, known as the morphotropic phase boundary (MPB) and exhibits greatly enhanced dielectric and piezoelectric properties in bulk and thin film. In modern electronic applications, pyroelectric detectors, piezoelectric microsensors, and micromechanical pumps require the integration of PZT films into a variety of device structures. To get sufficiently large piezoelectric strains for optimization of the performance and reliability of the device, thick films in the thickness range of 5–50 μm are desired. On the other hand burying the device components within the substrate is of utmost importance for miniaturization. In comparison to traditional surface mounted components embedded ones will free surface space for a higher functionality of the device, reduce solder points and increase device reliability. Additionally, to reduce the device costs the use of flexible copper foil as substrates is of particular interest. Its high conductivity and compatibility with printed circuit boards makes copper an attractive candidate substrate for embedded application. However, depositing PZT thick films on copper is not trivial, due to the conflict between the high temperature required to sinter PZT (∼1150°C) and low melting temperature of Cu (∼1050°C), in addition to the easy oxidation of Cu. As a consequence the preparation of PZT thick films on Cu involves a complex route to decrease the ceramic sintering temperature and to control the oxygen partial pressure. So far, no successful deposition of PZT thick films on copper foils was reported.

Screen-printed gold thick films for electrochemical sensor applications

2011 ◽  
Vol 42 (9) ◽  
pp. 777-783 ◽  
Author(s):  
T. J. Rabbow ◽  
N. Junker ◽  
M. Schneider ◽  
A. Michaelis
Keyword(s):  
Electrochemical Sensor ◽  
Thick Films ◽  
Sensor Applications ◽  
Screen Printed

Piezoelectric Structural Sensor Technology for Extreme Environments

2010 ◽  
Vol 2010 (HITEC) ◽  
pp. 000355-000358
Author(s):  
Michael Ian Lapsley ◽  
Edward F. Alberta ◽  
Raffi Sahul ◽  
Wesley Hackenberger ◽  
Xiaoning Jiang ◽  
...  
Keyword(s):  
Thermal Expansion ◽  
High Temperature ◽  
Extreme Environments ◽  
Piezoelectric Sensor ◽  
Sensor Technology ◽  
High Resistivity ◽  
Sensor Applications ◽  
Low Dielectric ◽  
Thermal Expansion Coefficients ◽  
High Temperature Sensor

High temperature sensors are desired for down-hole well monitoring, future propulsion components, as well as improving performance and maintainability of power production facilities and other rotary combustion engines. Recently discovered high temperature oxyborate crystals showed stable piezoelectric properties and high resistivity at temperatures close to its melting point (∼ 1500°C, or 2730°F ), which is very promising for high temperature sensor applications. In this paper the feasibility of using oxyborate based high temperature piezoelectric crystal (HTPC) for high temperature piezoelectric sensor applications is demonstrated. Oxyborate HTPC with various crystal cuts and vibration modes were investigated to obtain high temperature resistivity, dielectric, piezoelectric and thermal expansion properties. YCa4O(BO3)3 crystals (YCOB) showed excellent piezoelectricity, low dielectric loss and high resistivity at temperatures up to 1000°C (> 1800°F). The measured thermal expansion coefficients of YCOB are about ∼3–8 ppm/K, depending on different orientations. High temperature accelerometers were demonstrated using YCOB HTPC at temperatures up to 1000°C with sensitivity remaining steady (∼ 2.4 pC/g) across the temperature range of 20°C-1000°C.

Hybrid Micro-Optical Sensors via Sol-Gel Soft Lithography

2000 ◽  
Vol 628 ◽  
Author(s):  
Mark A. Clarner ◽  
Michael J. Lochhead
Keyword(s):  
Optical Sensors ◽  
Soft Lithography ◽  
Sol Gel ◽  
Silica Gels ◽  
Ph Sensing ◽  
Ambient Conditions ◽  
Sensor Applications ◽  
Patterned Structures ◽  
Biological Functionality ◽  
Indicator Dyes

ABSTRACTOrganically modified silica gels and dye-doped silica gels have been patterned into micrometer-scale structures on a substrate using micro molding in capillaries (MIMIC). This approach is from a class of elastomeric stamping and molding techniques collectively known as soft lithography. Soft lithography and sol-gel processing share attractive features in that they are relatively benign processes performed at ambient conditions, which makes both techniques compatible with a wide variety of organic molecules, molecular assemblies, and biomolecules. The combination of sol-gel and soft lithography, therefore, holds enormous promise as a tool for microfabrication of materials with optical, chemical, or biological functionality that are not readily patterned with conventional methods. This paper describes our investigation of micro-patterned organic-inorganic hybrid materials containing indicator dyes for microfluidic sensor applications. Reversible colorimetric pH sensing via entrapped reagents is demonstrated in a prototype microfluidic sensor element. Patterned structures range from one to tens of micrometers in cross-section and are up to centimeters in length. Fundamental chemical processing issues associated with mold filling, cracking and sensor stability are discussed.

Analysis of AC-DC Converter Circuit Performance with Difference Piezoelectric Transducer Array Connection

2020 ◽  
Vol 12 (7) ◽  
Author(s):  
Nik Ahmad Zainal Abidin ◽  
◽  
Norkharziana Mohd Nayan ◽  
Azuwa Ali ◽  
N. A. Azli ◽  
...  
Keyword(s):  
Piezoelectric Transducer ◽  
Simulation Analysis ◽  
Piezoelectric Sensor ◽  
Transducer Array ◽  
Circuit Performance ◽  
Array Configuration ◽  
Full Wave ◽  
Bridge Rectifier ◽  
In Series ◽  
Parallel Voltage

This research presents a simulation analysis for the AC-DC converter circuit with a different configurations of the array connection of the piezoelectric sensor. The selection of AC-DC converter circuits is full wave bridge rectifier (FWBR), parallel SSHI (P-SSHI) and parallel voltage multiplier (PVM) with array configuration variation in series (S), parallel (P), series-parallel (SP) and parallel-series (PS). The system optimizes with different load configurations ranging from 10 kΩ to 1 MΩ. The best configuration of AC-DC converter with an appropriate array piezoelectric connection producing the optimum output of harvested power is presented. According to the simulation results, the harvested power produced by using P-SSHI converter connected with 3 parallel piezoelectric transducer array was 85.9% higher than for PVM and 15.88% higher than FWBR.

Low Temperature Sintering and Tunable Dielectrics Properties of Thick Films added of Li2CO3on BST

2006 ◽  
Vol 16 (12) ◽  
pp. 747-753
Author(s):  
So-Hyun Jeon ◽  
In-Sung Kim ◽  
Sun-Jong Jung ◽  
Jae-Sung Song ◽  
Jon-Do Yoon
Keyword(s):  
Low Temperature ◽  
Thick Films ◽  
Low Temperature Sintering ◽  
Tunable Dielectrics
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