scholarly journals GOLD-COPPER-SULPHIDE MINERALIZATION OF QUARTZ-CARBONATE VEINS IN GABBRO-DOLERITES FROM THE CHEVZHAVARA DEPOSIT, SOUTH KARELIA

Author(s):  
Людмила Владимировна Кулешевич ◽  
Олег Борисович Лавров ◽  
Lyudmila Kuleshevich ◽  
Oleg Lavrov
Author(s):  
Piotr Król ◽  
Zbigniew Sawłowicz

Massive ore mineralization in dolomites is described for the first time from the Fore-Sudetic copper deposits. Three cross-sections from the Lubin Mine were studied using polarized optical (PLM) and scanning electron (SEM-EDS) microscopy, also cathodoluminescence (CL) and XRD. Massive mineralization, composed mainly of chalcocite with calcite admixture, occurs in dolomites as horizontal pseudovein, locally underlain by clay-carbonate breccia and shale. Underlying dolomites were partly calcitized (dedolomitized). Various calcite generations are characterized in detail. A model of the formation of massive mineralization is proposed. Mesotectonic intralayer movements caused the cracking of dolomite layers and the formation of breccia. Calcitization led to both dedolomitization and the partial infilling of cracks. Mineralizing fluids infilled the cracks completely, partly replacing calcite and adjacent rocks.


1998 ◽  
Vol 39 (11-12) ◽  
pp. 2033-2041 ◽  
Author(s):  
A. N. Korobeinikov ◽  
F. P. Mitrofanov ◽  
S. Gehor ◽  
K. Laajoki ◽  
V. P. Pavlov ◽  
...  

2018 ◽  
Vol 7 ◽  
pp. 139-145
Author(s):  
Wen Yafeng ◽  
◽  
U.D. Izabaev ◽  
A.K. Ukubaev ◽  
E.A. Zavarukhina ◽  
...  
Keyword(s):  

Author(s):  
Anil Kurella ◽  
Aravind Munukutla ◽  
J.S. Lewis

Abstract PCB surface finishes like Immersion silver (ImAg) are commonly used in Pb-free manufacturing environments following RoHS legislation. With this transition, however the numbers of field failures associated with electrochemical migration, copper sulphide corrosion, via barrel galvanic corrosion are on a steady rise. More often than not ImAg surfaces seem to assist these failing signatures. As computers penetrate into emerging markets with humid and industrialized environments there is a greater concern on the reliability and functionality of these electronic components.


Preview ◽  
2021 ◽  
Vol 2021 (212) ◽  
pp. 48-51
Author(s):  
Don Emerson
Keyword(s):  

2021 ◽  
Vol 183 ◽  
pp. 109313
Author(s):  
Joakim Halldin Stenlid ◽  
Egon Campos dos Santos ◽  
Adam Johannes Johansson ◽  
Lars G.M. Pettersson
Keyword(s):  

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