NUMERICAL MODELING OF THERMAL MODES OF POWERFUL ELECTRONIC DEVICES UNDER NATURAL CONVECTION CONDITIONS

Author(s):  
E.V. Dilevskaya ◽  
V.V. Marin
2019 ◽  
Author(s):  
Drake Norman ◽  
Todd Otanicar ◽  
Daniel W. Crunkleton ◽  
Amanda Hawkins

2010 ◽  
Vol 132 (3) ◽  
Author(s):  
Varghese Panthalookaran

Natural convection cooling provides a reliable, cost-effective, energy-efficient and noise-free method to cool electronic equipment. However, the heat transfer coefficient associated with natural convection mode is usually insufficient for electronic cooling and it requires enhancement. Chimneylike flows developed within the cabinets of electronic devices can provide better mass flow and heat transfer rates and can lead to greater cooling efficiency. Constraints in the design of natural convection cooling systems include efficiency of packing, aesthetics, and concerns of material reduction. In this paper, methods based on computational fluid dynamics are used to study the effects of parameters such as (1) vertical alignment of the slots, (2) horizontal alignment of slots, (3) area of slots, (4) differential slot opening, and (5) zonal variation in heat generation on natural convection cooling within such design constraints. Insights thus derived are found useful for designing an energy-efficient and ecofriendly cooling system for electronic devices.


2013 ◽  
Vol 27 (1) ◽  
pp. 91-100 ◽  
Author(s):  
Nadia Dihmani ◽  
Samir Amraqui ◽  
Ahmed Mezrhab ◽  
Hassan Naji

2015 ◽  
Vol 2015 (1) ◽  
pp. 000530-000535
Author(s):  
Chandrashekar Raman

Electronic devices continue to shrink while continuing to offer increasing functionality. This trend poses a significant challenge to design engineers who need to adequately address the increasing thermal management requirements of these devices on a shrinking footprint. Thermally conductive plastics have been gaining attention as an innovative new material option to address this challenge. While plastics are typically poor conductors of heat, it is possible to increase the thermal conductivity with the use of certain additives. Unique ceramic additives like boron nitride offer the added advantage of enabling thermally conductive plastic formulations that are also electrically insulating. The replacement of aluminum heat sinks in free (natural) convection environments with thermally conductive plastics is discussed in this paper. The results show it may indeed be possible to replace aluminum with thermally conductive plastic heat sinks in convection limited environments, and if judicious redesign of the plastic heat sink is incorporated, an improved thermal management solution can be realized. Additionally, the benefits of enhancing existing plastic housings to enable an improved thermal management solution are discussed. The results also show that modest enhancements to the thermal conductivity of existing plastic housings can yield significant improvements to the overall thermal management solution as well.


1993 ◽  
Vol 126 (4) ◽  
pp. 655-674 ◽  
Author(s):  
N. Ramachandran ◽  
J.P. Downey ◽  
P.A. Curreri ◽  
J.C. Jones

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