THERMAL ANALYSIS OF A PRINTED CIRCUIT BOARD COOLED BY FORCED CONVECTION

Author(s):  
U. Navon ◽  
S. Kreitenberger ◽  
Chaim Gutfinger
1993 ◽  
Vol 115 (3) ◽  
pp. 339-342
Author(s):  
A. Hadim

A simplified methodology is developed for thermal analysis and design of printed circuit boards. It combines the use of computer-aided thermal network modeling and a simplified experimental technique. In order to demonstrate its capabilities, this methodology is implemented to correlate natural convection on a printed circuit board oriented horizontally inside an enclosure. The empirical constants used in the correlation were determined through a numerical algorithm in which the sum of the squared error between calculated temperatures and experimental measurements is minimized using the downhill simplex algorithm.


Author(s):  
Toshio Tomimura ◽  
Yasushi Koito ◽  
Shuichi Torii ◽  
Masaru Ishizuka

Some practical examples solved by using the spreadsheet software like Excel have been reported recently. In the numerical analysis using Excel, each cell can be regarded as a nodal point, and calculations are performed by using equations written in those cells without making any program. Iterative calculations are carried out automatically. Moreover, the calculated results shown in the computational domain are immediately visualized using the Chart Wizard. Two typical examples of thermal analysis on a printed circuit board with power devices by the thermal network method, and a straight rectangular fin by the finite difference method are shown in the present study.


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