scholarly journals Full-Wave Analysis of Power Distribution Networks in Printed Circuit Boards

2010 ◽  
Vol E93.B (7) ◽  
pp. 1670-1677 ◽  
Author(s):  
Francescaromana MARADEI ◽  
Spartaco CANIGGIA ◽  
Nicola INVERARDI ◽  
Mario ROTIGNI
Keyword(s):  
Power Distribution ◽  
Printed Circuit Boards ◽  
Distribution Networks ◽  
Circuit Boards ◽  
Wave Analysis ◽  
Power Distribution Networks ◽  
Printed Circuit ◽  
Full Wave ◽  
Full Wave Analysis

scholarly journals Analytical Modeling of Metamaterial Differential Transmission Line Using Corrugated Ground Planes in High-Speed Printed Circuit Boards

Electronics ◽  
2019 ◽  
Vol 8 (3) ◽  
pp. 299 ◽  
Author(s):  
Myunghoi Kim
Keyword(s):  
Analytical Model ◽  
High Speed ◽  
Printed Circuit Boards ◽  
Signal Transmission ◽  
Circuit Boards ◽  
Transmission Characteristics ◽  
Differential Signal ◽  
Printed Circuit ◽  
Full Wave ◽  
Differential Transmission

An analytical model for metamaterial differential transmission lines (MTM-DTLs) with a corrugated ground-plane electromagnetic bandgap (CGP-EBG) structure in high-speed printed circuit boards is proposed. The proposed model aims to efficiently and accurately predict the suppression of common-mode noise and differential signal transmission characteristics. Analytical expressions for the four-port impedance matrix of the CGP-EBG MTM-DTL are derived using coupled-line theory and a segmentation method. Converting the impedance matrix into mixed-mode scattering parameters enables obtaining common-mode noise suppression and differential signal transmission characteristics. The comprehensive evaluations of the CGP-EBG MTM-DTL using the proposed analytical model are also reported, which is validated by comparing mixed-mode scattering parameters Scc21 and Sdd21 with those obtained from full-wave simulations and measurements. The proposed analytical model provides a drastic reduction of computation time and accurate results compared to full-wave simulation.

Downsizing an automotive junction box based on large current-carrying printed-circuit board optimization

2016 ◽  
Vol 231 (2) ◽  
pp. 267-278 ◽  
Author(s):  
Hansang Lim ◽  
Do-Hwan Jung ◽  
Geono Kwon ◽  
Young Jong Lee ◽  
Jun Seo Park
Keyword(s):  
Power Distribution ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Installation Space ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Overcurrent Protection ◽  
Large Current ◽  
Analytical Estimation

An automotive junction box distributes electric power to electric systems installed in a vehicle with overcurrent protection. As a larger number of electric systems are installed, the junction box is equipped with more components, functionalities and connections. However, owing to the fuse accessibility, its installation space is so restricted that a downsized design is required for the junction box. The junction box is composed of small signal circuitry for control and monitoring, and large current-carrying circuitry for power distribution which includes many parallel traces. Because of these unique features, widely used techniques for downsizing printed-circuit boards are not applicable. Also, there is no rule for designing large current-carrying parallel traces, and it is difficult to optimize the size of the printed-circuit board for the automotive junction box. This paper presents the design rules for a printed-circuit board when downsizing a junction box. First, the layout strategy for the power distribution components is presented, which is determined by the sum of the squares of the currents flowing through connector pairs. Then, the thermal effects of parallel traces are simulated for different conditions by using thermal analysis software. Based on the results, an analytical estimation of the additional temperature rises due to parallel traces and rules for a thermally effective arrangement of the parallel traces are presented.

Analysis of PCB via for Signal Integrity Using ANOVA

2013 ◽  
Vol 446-447 ◽  
pp. 956-960
Author(s):  
Shi Lei Zhou ◽  
Ya Lin Guan ◽  
Xin Kun Tang
Keyword(s):  
Printed Circuit Boards ◽  
Signal Integrity ◽  
Point Of View ◽  
Electromagnetic Simulation ◽  
Physical Aspect ◽  
Circuit Boards ◽  
Anova Analysis ◽  
Printed Circuit ◽  
Full Wave ◽  
Aspect Ratios

This paper based on ANOVA (ANalysis Of VAriance) presents an investigation in the design of signal via in multilayered printed circuit boards (PCB) technology from a signal integrity point of view. Using the concept of the orthogonal array (OA), different vias physical aspect ratios have been set in the analysis. The impacts of these parameters are investigated with the help for a full-wave electromagnetic simulation soft HFSS. This study demonstrates the factors which is the most influence on the signal integrity.

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