scholarly journals Microscopic and Macroscopic Simulation of Ultra-Short-Pulse Laser Processing by CIP Method.

2002 ◽  
Vol 78 (12) ◽  
pp. 1280-1281
Author(s):  
Yoshiaki KONDOH ◽  
Takashi YABE ◽  
Jun MAEHARA ◽  
Youichi OGATA ◽  
Takashi NAKAMURA
Keyword(s):  
Pulse Laser ◽  
Laser Processing ◽  
Short Pulse ◽  
Cip Method ◽  
Short Pulse Laser ◽  
Macroscopic Simulation ◽  
Ultra Short Pulse ◽  
Ultra Short Pulse Laser

Polygon scanner based ultra-short pulse laser processing for continuous manufacturing

2019 ◽  
Author(s):  
Martin Priwisch ◽  
Sebastian Dormann ◽  
Daniel Zontar ◽  
Clemens Hönninger ◽  
Lars Penning ◽  
...  
Keyword(s):  
Pulse Laser ◽  
Laser Processing ◽  
Short Pulse ◽  
Continuous Manufacturing ◽  
Short Pulse Laser ◽  
Ultra Short Pulse ◽  
Ultra Short Pulse Laser

Ultra-Short pulse laser processing of CFRP with kilowatt average power

2014 ◽  
Author(s):  
Christian Freitag ◽  
Margit Wiedenmann ◽  
Jan-Philipp Negel ◽  
André Loescher ◽  
Volkher Onuseit ◽  
...  
Keyword(s):  
Pulse Laser ◽  
Laser Processing ◽  
Short Pulse ◽  
Average Power ◽  
Short Pulse Laser ◽  
Ultra Short Pulse ◽  
Ultra Short Pulse Laser

Designing of interference pattern in ultra-short pulse laser processing

2012 ◽  
Vol 112 (1) ◽  
pp. 191-196 ◽  
Author(s):  
Yoshiki Nakata ◽  
Keiichi Murakawa ◽  
Kenji Sonoda ◽  
Kazuma Momoo ◽  
Noriaki Miyanaga ◽  
...  
Keyword(s):  
Interference Pattern ◽  
Pulse Laser ◽  
Laser Processing ◽  
Short Pulse ◽  
Short Pulse Laser ◽  
Ultra Short Pulse ◽  
Ultra Short Pulse Laser

Silicon Thinning using Ultra-Short Pulse Laser Ablation

2004 ◽  
Author(s):  
F. Beaudoin ◽  
P. Perdu ◽  
C. DeNardi ◽  
R. Desplats ◽  
J. Lopez ◽  
...  
Keyword(s):  
Laser Ablation ◽  
Sample Preparation ◽  
Pulse Laser ◽  
Pulse Laser Ablation ◽  
Short Pulse ◽  
Special Care ◽  
Short Pulse Laser ◽  
Ultra Short Pulse ◽  
Ultra Short Pulse Laser

Abstract Ultra-short pulse laser ablation is applied to IC backside sample preparation. It is contact-less, non-thermal, precise and can ablate the various types of material present in IC packages. This study concerns the optimization of ultra-short pulse laser ablation for silicon thinning. Uncontrolled silicon roughness and poor uniformity of the laser thinned cavity needed to be tackled. Special care is taken to minimize the silicon RMS roughness to less than 1µm. Application to sample preparation of 256Mbit devices is presented.

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