Correlation of Defects on Dielectric Surfaces with Large Particle Counts in Chemical-Mechanical Planarization (CMP) Slurries Using a New Single Particle Optical Sensing (SPOS) Technique
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AbstractA dual-sensor single particle optical sensing method (SPOS) is described for the measurement of the large particle count (LPC) in fumed silica polishing slurries. LPC values were expressed on a silica sphere-equivalent diameter scale rather than a polystyrene latex-equivalent size basis. Linear correlations between LPC and scratch counts on SiO2 surface films for wafers polished under clean room and table-top CMP conditions are demonstrated. However, these correlations were obtained for a limited set of model slurries; and further investigation will be needed to assess the general applicability of dual-sensor SPOS for oxide scratch defect prediction in CMP slurries.
2010 ◽
Vol 27
(1-2)
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pp. 21-31
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1970 ◽
Vol 34
(1)
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pp. 159-162
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2013 ◽
Vol 6
(2)
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pp. 337-347
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2020 ◽
2011 ◽
Vol 4
(4)
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pp. 4165-4208
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